JP2000236040A5 - - Google Patents

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Publication number
JP2000236040A5
JP2000236040A5 JP1999036142A JP3614299A JP2000236040A5 JP 2000236040 A5 JP2000236040 A5 JP 2000236040A5 JP 1999036142 A JP1999036142 A JP 1999036142A JP 3614299 A JP3614299 A JP 3614299A JP 2000236040 A5 JP2000236040 A5 JP 2000236040A5
Authority
JP
Japan
Prior art keywords
main surface
wiring board
wirings
wiring
semiconductor device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1999036142A
Other languages
English (en)
Japanese (ja)
Other versions
JP2000236040A (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP11036142A priority Critical patent/JP2000236040A/ja
Priority claimed from JP11036142A external-priority patent/JP2000236040A/ja
Priority to US09/495,918 priority patent/US6472749B1/en
Publication of JP2000236040A publication Critical patent/JP2000236040A/ja
Priority to US10/162,613 priority patent/US6838767B2/en
Publication of JP2000236040A5 publication Critical patent/JP2000236040A5/ja
Pending legal-status Critical Current

Links

JP11036142A 1999-02-15 1999-02-15 半導体装置 Pending JP2000236040A (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP11036142A JP2000236040A (ja) 1999-02-15 1999-02-15 半導体装置
US09/495,918 US6472749B1 (en) 1999-02-15 2000-02-02 Semiconductor device having a shortened wiring length to reduce the size of a chip
US10/162,613 US6838767B2 (en) 1999-02-15 2002-06-06 Semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP11036142A JP2000236040A (ja) 1999-02-15 1999-02-15 半導体装置

Publications (2)

Publication Number Publication Date
JP2000236040A JP2000236040A (ja) 2000-08-29
JP2000236040A5 true JP2000236040A5 (enExample) 2005-06-16

Family

ID=12461554

Family Applications (1)

Application Number Title Priority Date Filing Date
JP11036142A Pending JP2000236040A (ja) 1999-02-15 1999-02-15 半導体装置

Country Status (2)

Country Link
US (2) US6472749B1 (enExample)
JP (1) JP2000236040A (enExample)

Families Citing this family (29)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW575949B (en) * 2001-02-06 2004-02-11 Hitachi Ltd Mixed integrated circuit device, its manufacturing method and electronic apparatus
JP4701563B2 (ja) * 2001-08-23 2011-06-15 日本テキサス・インスツルメンツ株式会社 半導体チップ搭載基板及びそれを用いた半導体装置
CN100367489C (zh) * 2001-09-07 2008-02-06 株式会社理光 半导体器件
US20030218246A1 (en) * 2002-05-22 2003-11-27 Hirofumi Abe Semiconductor device passing large electric current
JP4030363B2 (ja) * 2002-06-25 2008-01-09 株式会社ルネサステクノロジ 半導体装置
JP4056360B2 (ja) * 2002-11-08 2008-03-05 沖電気工業株式会社 半導体装置及びその製造方法
WO2005017995A1 (en) * 2003-08-08 2005-02-24 Dow Corning Corporation Process for fabricating electronic components using liquid injection molding
JP2005268575A (ja) * 2004-03-19 2005-09-29 Hitachi Ltd 半導体装置
JP4137929B2 (ja) * 2005-09-30 2008-08-20 シャープ株式会社 半導体装置
JP4595823B2 (ja) * 2006-01-24 2010-12-08 株式会社デンソー ボールグリッドアレイ
JP2009105139A (ja) * 2007-10-22 2009-05-14 Shinko Electric Ind Co Ltd 配線基板及びその製造方法と半導体装置
JP4973463B2 (ja) * 2007-11-16 2012-07-11 トヨタ自動車株式会社 半導体装置
WO2009081685A1 (ja) * 2007-12-26 2009-07-02 Murata Manufacturing Co., Ltd. 部品実装基板およびその製造方法
JP2009295958A (ja) * 2008-05-09 2009-12-17 Panasonic Corp 半導体装置
JP4991637B2 (ja) * 2008-06-12 2012-08-01 ルネサスエレクトロニクス株式会社 半導体装置およびその製造方法
TWI406373B (zh) * 2009-01-14 2013-08-21 日月光半導體製造股份有限公司 可選擇線路之基板及覆晶接合結構
US20100289132A1 (en) * 2009-05-13 2010-11-18 Shih-Fu Huang Substrate having embedded single patterned metal layer, and package applied with the same, and methods of manufacturing of the substrate and package
US8367473B2 (en) * 2009-05-13 2013-02-05 Advanced Semiconductor Engineering, Inc. Substrate having single patterned metal layer exposing patterned dielectric layer, chip package structure including the substrate, and manufacturing methods thereof
TW201041105A (en) * 2009-05-13 2010-11-16 Advanced Semiconductor Eng Substrate having single patterned metal layer, and package applied with the same, and methods of manufacturing the substrate and package
TWI425603B (zh) * 2009-09-08 2014-02-01 日月光半導體製造股份有限公司 晶片封裝體
US20110084372A1 (en) 2009-10-14 2011-04-14 Advanced Semiconductor Engineering, Inc. Package carrier, semiconductor package, and process for fabricating same
US8786062B2 (en) * 2009-10-14 2014-07-22 Advanced Semiconductor Engineering, Inc. Semiconductor package and process for fabricating same
US8569894B2 (en) 2010-01-13 2013-10-29 Advanced Semiconductor Engineering, Inc. Semiconductor package with single sided substrate design and manufacturing methods thereof
TWI411075B (zh) 2010-03-22 2013-10-01 日月光半導體製造股份有限公司 半導體封裝件及其製造方法
JP2012084840A (ja) 2010-09-13 2012-04-26 Renesas Electronics Corp 半導体装置及びその製造方法
KR101959923B1 (ko) * 2012-07-30 2019-03-20 삼성디스플레이 주식회사 유기 발광 표시 장치 및 그 제조 방법
KR102007404B1 (ko) * 2012-12-14 2019-08-05 엘지이노텍 주식회사 발광소자 패키지
US10861773B2 (en) * 2017-08-30 2020-12-08 Taiwan Semiconductor Manufacturing Company, Ltd. Semiconductor package and manufacturing method thereof
JP7362380B2 (ja) * 2019-09-12 2023-10-17 キヤノン株式会社 配線基板及び半導体装置

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62213261A (ja) * 1986-03-14 1987-09-19 Canon Inc 長尺素子アレイ部材
JP3176542B2 (ja) * 1995-10-25 2001-06-18 シャープ株式会社 半導体装置及びその製造方法
JP3679199B2 (ja) * 1996-07-30 2005-08-03 日本テキサス・インスツルメンツ株式会社 半導体パッケージ装置
US6064111A (en) * 1996-07-31 2000-05-16 Hitachi Company, Ltd. Substrate for holding a chip of semi-conductor package, semi-conductor package, and fabrication process of semi-conductor package
JPH1154658A (ja) * 1997-07-30 1999-02-26 Hitachi Ltd 半導体装置及びその製造方法並びにフレーム構造体
JPH11186294A (ja) * 1997-10-14 1999-07-09 Sumitomo Metal Smi Electron Devices Inc 半導体パッケージ及びその製造方法
JPH11204549A (ja) * 1998-01-13 1999-07-30 Citizen Watch Co Ltd 半導体装置の製造方法
JPH11284006A (ja) * 1998-03-31 1999-10-15 Fujitsu Ltd 半導体装置
US5903051A (en) * 1998-04-03 1999-05-11 Motorola, Inc. Electronic component and method of manufacture
JP3506211B2 (ja) * 1998-05-28 2004-03-15 シャープ株式会社 絶縁性配線基板及び樹脂封止型半導体装置
JP3310617B2 (ja) * 1998-05-29 2002-08-05 シャープ株式会社 樹脂封止型半導体装置及びその製造方法
JP3844032B2 (ja) * 1998-07-14 2006-11-08 日本テキサス・インスツルメンツ株式会社 半導体装置及びその製造方法
US6242815B1 (en) * 1999-12-07 2001-06-05 Advanced Semiconductor Engineering, Inc. Flexible substrate based ball grid array (BGA) package

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