JP2023512274A5 - - Google Patents
Info
- Publication number
- JP2023512274A5 JP2023512274A5 JP2022546497A JP2022546497A JP2023512274A5 JP 2023512274 A5 JP2023512274 A5 JP 2023512274A5 JP 2022546497 A JP2022546497 A JP 2022546497A JP 2022546497 A JP2022546497 A JP 2022546497A JP 2023512274 A5 JP2023512274 A5 JP 2023512274A5
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor
- board
- power
- terminal
- chip
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| EP20154510.0 | 2020-01-30 | ||
| EP20154510 | 2020-01-30 | ||
| PCT/EP2021/052004 WO2021152021A1 (en) | 2020-01-30 | 2021-01-28 | Free configurable power semiconductor module |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2023512274A JP2023512274A (ja) | 2023-03-24 |
| JP2023512274A5 true JP2023512274A5 (enExample) | 2024-01-26 |
| JP7684320B2 JP7684320B2 (ja) | 2025-05-27 |
Family
ID=69423064
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2022546497A Active JP7684320B2 (ja) | 2020-01-30 | 2021-01-28 | 自由構成可能なパワー半導体モジュール |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US12599012B2 (enExample) |
| EP (1) | EP4097761B1 (enExample) |
| JP (1) | JP7684320B2 (enExample) |
| CN (1) | CN115039222B (enExample) |
| WO (1) | WO2021152021A1 (enExample) |
Families Citing this family (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE102021208772B4 (de) | 2021-08-11 | 2024-05-16 | Zf Friedrichshafen Ag | Halbbrücke für einen Inverter zum Betreiben eines Elektrofahrzeugantriebs, Leistungsmodul umfassend mehrere Halbbrücken, Inverter, Verfahren zum Herstellen eines Inverters |
| DE102021208767A1 (de) | 2021-08-11 | 2023-02-16 | Zf Friedrichshafen Ag | Halbbrücke für einen Inverter zum Betreiben eines Elektrofahrzeugantriebs, Leistungsmodul umfassend mehrere Halbbrücken, Inverter, Verfahren zum Herstellen eines Inverters |
| DE102021208770A1 (de) | 2021-08-11 | 2023-02-16 | Zf Friedrichshafen Ag | Halbbrücke für einen Inverter zum Betreiben eines Elektrofahrzeugantriebs, Leistungsmodul umfassend mehrere Halbbrücken, Inverter, Verfahren zum Herstellen eines Inverters |
| DE102022209564A1 (de) | 2022-09-13 | 2023-07-06 | Zf Friedrichshafen Ag | Leistungsmodul und verfahren zum montieren eines leistungsmoduls |
| DE102022211926A1 (de) * | 2022-11-10 | 2024-05-16 | D + L Dubois + Linke Gesellschaft mit beschränkter Haftung | Schweißgerät |
| DE102022213006A1 (de) * | 2022-12-02 | 2024-06-13 | Zf Friedrichshafen Ag | Leistungsmodul für einen Wandler mit separater Leiterplatte zur Steuersignalführung |
| CN119181675A (zh) * | 2023-06-21 | 2024-12-24 | 北京大学 | 半导体封装结构 |
| US12556090B2 (en) * | 2023-07-18 | 2026-02-17 | Volkswagen Aktiengesellschaft | Wide band gap (WBG) devices based three-level neutral point clamped (NPC) power module designs |
| US20250294697A1 (en) * | 2024-03-18 | 2025-09-18 | Mahle International Gmbh | Electric power converter |
| DE102024127473A1 (de) * | 2024-09-23 | 2026-03-26 | Infineon Technologies Ag | Halbleitervorrichtungen und Verfahren zu deren Herstellung |
| CN120769416B (zh) * | 2025-09-03 | 2026-01-02 | 乐山希尔电子股份有限公司 | 一种层叠式功率模块及制备方法 |
| CN121215647A (zh) * | 2025-11-27 | 2025-12-26 | 华侨大学 | 一种三相低压mosfet封装集成功率模块 |
Family Cites Families (16)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2005243713A (ja) | 2004-02-24 | 2005-09-08 | Toshiba Corp | パワーモジュール及び実装基板 |
| US8124429B2 (en) * | 2006-12-15 | 2012-02-28 | Richard Norman | Reprogrammable circuit board with alignment-insensitive support for multiple component contact types |
| DE102008033410B4 (de) * | 2008-07-16 | 2011-06-30 | SEMIKRON Elektronik GmbH & Co. KG, 90431 | Leistungselektronische Verbindungseinrichtung mit einem Leistungshalbleiterbauelement und Herstellungsverfahren hierzu |
| DE102009046258B3 (de) | 2009-10-30 | 2011-07-07 | Infineon Technologies AG, 85579 | Leistungshalbleitermodul und Verfahren zum Betrieb eines Leistungshalbleitermoduls |
| JP5551920B2 (ja) | 2009-11-24 | 2014-07-16 | イビデン株式会社 | 半導体装置及びその製造方法 |
| CN102664177B (zh) * | 2012-05-16 | 2014-10-29 | 中国科学院电工研究所 | 一种双面冷却的功率半导体模块 |
| WO2014185050A1 (ja) | 2013-05-16 | 2014-11-20 | 富士電機株式会社 | 半導体装置 |
| EP2871765A1 (en) | 2013-11-08 | 2015-05-13 | Vincotech GmbH | NPC converter for use in power module, and power module incorporating same |
| WO2015159751A1 (ja) | 2014-04-14 | 2015-10-22 | 富士電機株式会社 | 半導体装置 |
| JP6701641B2 (ja) | 2015-08-13 | 2020-05-27 | 富士電機株式会社 | 半導体モジュール |
| US9839146B2 (en) | 2015-10-20 | 2017-12-05 | Cree, Inc. | High voltage power module |
| JP2018073923A (ja) | 2016-10-27 | 2018-05-10 | 三菱電機株式会社 | 電力用半導体装置、電力用半導体装置の製造方法および電力変換装置 |
| EP3555914B1 (en) | 2016-12-16 | 2021-02-03 | ABB Schweiz AG | Power semiconductor module with low gate path inductance |
| CN106887955A (zh) * | 2017-04-17 | 2017-06-23 | 中车青岛四方车辆研究所有限公司 | 高压大功率dc/dc模块 |
| JP2019096508A (ja) | 2017-11-24 | 2019-06-20 | 川崎重工業株式会社 | 筐体 |
| WO2021151949A1 (en) | 2020-01-30 | 2021-08-05 | Abb Power Grids Switzerland Ag | Power semiconductor module with accessible metal clips |
-
2021
- 2021-01-28 EP EP21701349.9A patent/EP4097761B1/en active Active
- 2021-01-28 US US17/795,970 patent/US12599012B2/en active Active
- 2021-01-28 JP JP2022546497A patent/JP7684320B2/ja active Active
- 2021-01-28 WO PCT/EP2021/052004 patent/WO2021152021A1/en not_active Ceased
- 2021-01-28 CN CN202180011873.0A patent/CN115039222B/zh active Active
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