CN102664177B - 一种双面冷却的功率半导体模块 - Google Patents
一种双面冷却的功率半导体模块 Download PDFInfo
- Publication number
- CN102664177B CN102664177B CN201210153042.XA CN201210153042A CN102664177B CN 102664177 B CN102664177 B CN 102664177B CN 201210153042 A CN201210153042 A CN 201210153042A CN 102664177 B CN102664177 B CN 102664177B
- Authority
- CN
- China
- Prior art keywords
- power semiconductor
- substrate
- semiconductor chip
- chip
- coldplate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Inverter Devices (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
Description
Claims (7)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201210153042.XA CN102664177B (zh) | 2012-05-16 | 2012-05-16 | 一种双面冷却的功率半导体模块 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201210153042.XA CN102664177B (zh) | 2012-05-16 | 2012-05-16 | 一种双面冷却的功率半导体模块 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN102664177A CN102664177A (zh) | 2012-09-12 |
CN102664177B true CN102664177B (zh) | 2014-10-29 |
Family
ID=46773634
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201210153042.XA Active CN102664177B (zh) | 2012-05-16 | 2012-05-16 | 一种双面冷却的功率半导体模块 |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN102664177B (zh) |
Families Citing this family (26)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102882403A (zh) * | 2012-10-09 | 2013-01-16 | 天津市松正电动汽车技术股份有限公司 | 一种逆变器电路及其结构 |
DE102014102493A1 (de) * | 2014-02-26 | 2015-08-27 | Infineon Technologies Bipolar Gmbh & Co. Kg | Verbesserte Scheibenzelle für mehrere druckkontaktierte Halbleiterbauelemente |
CN104930378A (zh) * | 2015-06-25 | 2015-09-23 | 青岛海信宽带多媒体技术有限公司 | 光模块 |
CN105070695A (zh) * | 2015-08-14 | 2015-11-18 | 株洲南车时代电气股份有限公司 | 双面散热电动汽车功率模块 |
CN105161477B (zh) * | 2015-08-14 | 2019-10-18 | 株洲南车时代电气股份有限公司 | 一种平面型功率模块 |
CN105762121A (zh) * | 2016-04-29 | 2016-07-13 | 北京世纪金光半导体有限公司 | 一种半桥结构的全SiC功率半导体模块 |
KR101956983B1 (ko) * | 2016-09-20 | 2019-03-11 | 현대자동차일본기술연구소 | 파워 모듈 및 그 제조 방법 |
KR20180038597A (ko) * | 2016-10-06 | 2018-04-17 | 현대자동차주식회사 | 양면냉각형 파워모듈 및 그 제조방법 |
KR101905995B1 (ko) * | 2016-11-09 | 2018-10-10 | 현대자동차주식회사 | 양면냉각형 파워모듈 |
KR101956996B1 (ko) * | 2016-12-15 | 2019-06-24 | 현대자동차주식회사 | 양면냉각형 파워모듈 |
KR102603062B1 (ko) * | 2016-12-15 | 2023-11-16 | 현대자동차주식회사 | 양면냉각형 파워모듈 입력단 |
CN107221520A (zh) * | 2017-07-05 | 2017-09-29 | 上海旻成峰电子科技有限公司 | 一种综合保护装置、制备方法以及金属隔离均热板 |
CN107342313A (zh) * | 2017-08-15 | 2017-11-10 | 杭州浙阳电气有限公司 | 门极杂散均衡衬底及其功率半导体模块 |
JP2019046899A (ja) * | 2017-08-31 | 2019-03-22 | ルネサスエレクトロニクス株式会社 | 電子装置 |
US11355419B2 (en) * | 2018-01-11 | 2022-06-07 | Amosense Co., Ltd. | Power semiconductor module |
CN109872977A (zh) * | 2019-03-14 | 2019-06-11 | 如皋市大昌电子有限公司 | 一种可多环调节的新型贴片二极管 |
DE102019206820A1 (de) * | 2019-05-10 | 2020-11-12 | Robert Bosch Gmbh | Halbleiterleistungsmodul |
US20230116118A1 (en) * | 2020-01-30 | 2023-04-13 | Hitachi Energy Switzerland Ag | Free Configurable Power Semiconductor Module |
CN111354692A (zh) * | 2020-03-10 | 2020-06-30 | 上海瞻芯电子科技有限公司 | 功率散热装置 |
CN111584443A (zh) * | 2020-05-26 | 2020-08-25 | 忱芯科技(上海)有限公司 | 双面散热功率模块及其双面平行度的控制方法 |
CN112289761B (zh) * | 2020-10-28 | 2024-06-21 | 湖南国芯半导体科技有限公司 | 一种功率模块封装结构及其制造方法 |
CN112466819A (zh) * | 2020-11-24 | 2021-03-09 | 浙江大学 | 一种带辅助绝缘衬底的功率半导体模块及制造方法 |
CN112687553B (zh) * | 2020-12-11 | 2022-10-21 | 复旦大学 | 使用一片散热器实现半导体功率模块双面散热的方法 |
CN113133287B (zh) * | 2021-04-26 | 2022-07-12 | 合肥钧联汽车电子有限公司 | 一种浸入式水冷功率模块装置、散热控制方法及设计方法 |
CN113540017B (zh) * | 2021-06-30 | 2024-04-09 | 佛山市国星光电股份有限公司 | 一种igbt模块封装结构及其制作方法 |
CN115020359A (zh) * | 2022-08-09 | 2022-09-06 | 成都复锦功率半导体技术发展有限公司 | 一种半导体芯片封装结构及其制备方法 |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN2224464Y (zh) * | 1994-08-19 | 1996-04-10 | 冯天祥 | 大功率可控硅双面冷却装置 |
CN1542954A (zh) * | 2003-03-26 | 2004-11-03 | 株式会社电装 | 半导体装置 |
CN101242148A (zh) * | 2007-02-07 | 2008-08-13 | 株式会社日立制作所 | 电力变换装置 |
CN101594067A (zh) * | 2009-06-26 | 2009-12-02 | 天津大学 | 混合动力汽车双面冷却平面高温逆变器 |
US7696532B2 (en) * | 2004-12-16 | 2010-04-13 | Abb Research Ltd | Power semiconductor module |
Family Cites Families (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7999369B2 (en) * | 2006-08-29 | 2011-08-16 | Denso Corporation | Power electronic package having two substrates with multiple semiconductor chips and electronic components |
US8358000B2 (en) * | 2009-03-13 | 2013-01-22 | General Electric Company | Double side cooled power module with power overlay |
-
2012
- 2012-05-16 CN CN201210153042.XA patent/CN102664177B/zh active Active
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN2224464Y (zh) * | 1994-08-19 | 1996-04-10 | 冯天祥 | 大功率可控硅双面冷却装置 |
CN1542954A (zh) * | 2003-03-26 | 2004-11-03 | 株式会社电装 | 半导体装置 |
US7696532B2 (en) * | 2004-12-16 | 2010-04-13 | Abb Research Ltd | Power semiconductor module |
CN101242148A (zh) * | 2007-02-07 | 2008-08-13 | 株式会社日立制作所 | 电力变换装置 |
CN101594067A (zh) * | 2009-06-26 | 2009-12-02 | 天津大学 | 混合动力汽车双面冷却平面高温逆变器 |
Also Published As
Publication number | Publication date |
---|---|
CN102664177A (zh) | 2012-09-12 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
CN102664177B (zh) | 一种双面冷却的功率半导体模块 | |
TWI405320B (zh) | Semiconductor device | |
JP5407198B2 (ja) | 電力変換装置のパワーモジュール | |
CN110854103B (zh) | 一种嵌入式双面互连功率模块封装结构和制作方法 | |
CN110506330B (zh) | 功率电子模块以及包含该模块的电功率变换器 | |
CN109817591B (zh) | 一种高功率密度igbt模块的双面水冷散热结构及加工工艺 | |
KR20140005813A (ko) | 반도체 장치 | |
CN109920768B (zh) | 一种计及运行工况的大功率igbt模块水冷散热系统 | |
CN111554645B (zh) | 集成叠层母排的双面水冷SiC半桥模块封装结构 | |
WO2020215737A1 (zh) | 一种功率器件封装结构及其方法 | |
CN111627899B (zh) | 基于一种dbc布局的集成igbt封装结构 | |
JP2014022579A (ja) | パワーモジュール半導体装置 | |
CN114725076B (zh) | 一种功率模块及三相电机驱动器 | |
CN114649279A (zh) | 基于导电金属带的宽禁带半导体双面散热模块封装结构 | |
CN202695428U (zh) | 一种igbt功率模块 | |
CN102693969A (zh) | 一种igbt功率模块 | |
CN208861980U (zh) | 功率模块组件、功率半导体模块和车辆 | |
CN206117523U (zh) | 一种功率模块模组 | |
CN202585404U (zh) | Igbt模块 | |
CN203607394U (zh) | 功率集成模块 | |
CN110797318A (zh) | 一种双面热管冷却的igbt封装结构 | |
CN110634817B (zh) | 一种由igbt和mosfet构成的混合功率模块的封装结构 | |
CN103413797B (zh) | 一种三维结构单元组装的功率半导体模块 | |
CN207038508U (zh) | 一种叠层封装双面散热功率模块 | |
CN110911395A (zh) | 双面散热igbt模块 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
TR01 | Transfer of patent right | ||
TR01 | Transfer of patent right |
Effective date of registration: 20191126 Address after: 100000 Beijing Daxing District Beijing Economic and Technological Development Zone Liangshuihe 2nd Street 8 Courtyard 11 Building B 2 Floor 202 Patentee after: PHASE GREEN ENERGY TECHNOLOGY (BEIJING) Co.,Ltd. Address before: 100190 Beijing, Zhongguancun, north of No. two, No. 6, No. Patentee before: INSTITUTE OF ELECTRICAL ENGINEERING, CHINESE ACADEMY OF SCIENCES |
|
TR01 | Transfer of patent right | ||
TR01 | Transfer of patent right |
Effective date of registration: 20201229 Address after: No.248, Binhai 2nd Road, Hangzhou Bay New District, Ningbo, Zhejiang Province, 315000 Patentee after: FISH GREEN ENERGY TECHNOLOGY (NINGBO) Co.,Ltd. Address before: 100000 Beijing Daxing District Beijing Economic and Technological Development Zone Liangshuihe 2nd Street 8 Courtyard 11 Building B 2 Floor 202 Patentee before: PHASE GREEN ENERGY TECHNOLOGY (BEIJING) Co.,Ltd. |
|
TR01 | Transfer of patent right | ||
TR01 | Transfer of patent right |
Effective date of registration: 20221228 Address after: 412000 Building 1-1/1-2, Block K2, Phase I, Tianyi Science and Technology City Self employment Park, No. 2588, Xiangyun Road, Tianyuan District, Zhuzhou City, Hunan Province Patentee after: Zhuzhou Feishi Lvneng Technology Co.,Ltd. Address before: No.248, Binhai 2nd Road, Hangzhou Bay New District, Ningbo, Zhejiang Province, 315000 Patentee before: FISH GREEN ENERGY TECHNOLOGY (NINGBO) Co.,Ltd. |