JP2005150294A5 - - Google Patents
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- Publication number
- JP2005150294A5 JP2005150294A5 JP2003383785A JP2003383785A JP2005150294A5 JP 2005150294 A5 JP2005150294 A5 JP 2005150294A5 JP 2003383785 A JP2003383785 A JP 2003383785A JP 2003383785 A JP2003383785 A JP 2003383785A JP 2005150294 A5 JP2005150294 A5 JP 2005150294A5
- Authority
- JP
- Japan
- Prior art keywords
- wire
- electrode
- electrically connected
- wires
- electrodes
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims 10
- 238000007789 sealing Methods 0.000 claims 4
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims 2
- 229910052737 gold Inorganic materials 0.000 claims 2
- 239000010931 gold Substances 0.000 claims 2
- 239000011347 resin Substances 0.000 claims 2
- 229920005989 resin Polymers 0.000 claims 2
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims 1
- 238000007747 plating Methods 0.000 claims 1
- 229910052709 silver Inorganic materials 0.000 claims 1
- 239000004332 silver Substances 0.000 claims 1
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2003383785A JP2005150294A (ja) | 2003-11-13 | 2003-11-13 | 半導体装置およびその製造方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2003383785A JP2005150294A (ja) | 2003-11-13 | 2003-11-13 | 半導体装置およびその製造方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2005150294A JP2005150294A (ja) | 2005-06-09 |
| JP2005150294A5 true JP2005150294A5 (enExample) | 2006-12-21 |
Family
ID=34692407
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2003383785A Pending JP2005150294A (ja) | 2003-11-13 | 2003-11-13 | 半導体装置およびその製造方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2005150294A (enExample) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5114569B2 (ja) | 2008-08-29 | 2013-01-09 | 京セラ株式会社 | 回路基板、画像形成装置、サーマルヘッドおよびイメージセンサ |
| US8357563B2 (en) * | 2010-08-10 | 2013-01-22 | Spansion Llc | Stitch bump stacking design for overall package size reduction for multiple stack |
| CN106229307B (zh) * | 2016-08-01 | 2019-05-17 | 长电科技（宿迁）有限公司 | 铝线焊点表面二次装片的焊接结构及其工艺方法 |
-
2003
- 2003-11-13 JP JP2003383785A patent/JP2005150294A/ja active Pending
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