JP2005150294A - 半導体装置およびその製造方法 - Google Patents

半導体装置およびその製造方法 Download PDF

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Publication number
JP2005150294A
JP2005150294A JP2003383785A JP2003383785A JP2005150294A JP 2005150294 A JP2005150294 A JP 2005150294A JP 2003383785 A JP2003383785 A JP 2003383785A JP 2003383785 A JP2003383785 A JP 2003383785A JP 2005150294 A JP2005150294 A JP 2005150294A
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Prior art keywords
lead
bonding
wires
wire
semiconductor device
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JP2003383785A
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English (en)
Japanese (ja)
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JP2005150294A5 (enExample
Inventor
Hajime Hasebe
一 長谷部
Atsushi Fujisawa
敦 藤澤
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Renesas Technology Corp
Renesas Semiconductor Package and Test Solutions Co Ltd
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Renesas Technology Corp
Renesas Northern Japan Semiconductor Inc
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Priority to JP2003383785A priority Critical patent/JP2005150294A/ja
Publication of JP2005150294A publication Critical patent/JP2005150294A/ja
Publication of JP2005150294A5 publication Critical patent/JP2005150294A5/ja
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  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)
JP2003383785A 2003-11-13 2003-11-13 半導体装置およびその製造方法 Pending JP2005150294A (ja)

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Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2010024442A1 (ja) * 2008-08-29 2010-03-04 京セラ株式会社 回路基板、画像形成装置、サーマルヘッドおよびイメージセンサ
CN106229307A (zh) * 2016-08-01 2016-12-14 长电科技（宿迁）有限公司 铝线焊点表面二次装片的焊接结构及其工艺方法
EP2603929A4 (en) * 2010-08-10 2017-05-03 Cypress Semiconductor Corporation Stitch bump stacking design for overall package size reduction for multiple stack

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2010024442A1 (ja) * 2008-08-29 2010-03-04 京セラ株式会社 回路基板、画像形成装置、サーマルヘッドおよびイメージセンサ
US8525040B2 (en) 2008-08-29 2013-09-03 Kyocera Corporation Circuit board and its wire bonding structure
EP2603929A4 (en) * 2010-08-10 2017-05-03 Cypress Semiconductor Corporation Stitch bump stacking design for overall package size reduction for multiple stack
CN106229307A (zh) * 2016-08-01 2016-12-14 长电科技（宿迁）有限公司 铝线焊点表面二次装片的焊接结构及其工艺方法

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