JP2003297994A5 - - Google Patents

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Publication number
JP2003297994A5
JP2003297994A5 JP2002093625A JP2002093625A JP2003297994A5 JP 2003297994 A5 JP2003297994 A5 JP 2003297994A5 JP 2002093625 A JP2002093625 A JP 2002093625A JP 2002093625 A JP2002093625 A JP 2002093625A JP 2003297994 A5 JP2003297994 A5 JP 2003297994A5
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JP
Japan
Prior art keywords
semiconductor
tab
semiconductor device
chip
semiconductor chip
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2002093625A
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English (en)
Japanese (ja)
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JP2003297994A (ja
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Publication date
Application filed filed Critical
Priority to JP2002093625A priority Critical patent/JP2003297994A/ja
Priority claimed from JP2002093625A external-priority patent/JP2003297994A/ja
Priority to US10/396,360 priority patent/US6876067B2/en
Publication of JP2003297994A publication Critical patent/JP2003297994A/ja
Publication of JP2003297994A5 publication Critical patent/JP2003297994A5/ja
Pending legal-status Critical Current

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JP2002093625A 2002-03-29 2002-03-29 半導体装置およびその製造方法 Pending JP2003297994A (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2002093625A JP2003297994A (ja) 2002-03-29 2002-03-29 半導体装置およびその製造方法
US10/396,360 US6876067B2 (en) 2002-03-29 2003-03-26 Semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2002093625A JP2003297994A (ja) 2002-03-29 2002-03-29 半導体装置およびその製造方法

Publications (2)

Publication Number Publication Date
JP2003297994A JP2003297994A (ja) 2003-10-17
JP2003297994A5 true JP2003297994A5 (enExample) 2005-09-08

Family

ID=29386789

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2002093625A Pending JP2003297994A (ja) 2002-03-29 2002-03-29 半導体装置およびその製造方法

Country Status (2)

Country Link
US (1) US6876067B2 (enExample)
JP (1) JP2003297994A (enExample)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH08222710A (ja) * 1995-02-17 1996-08-30 Mitsubishi Electric Corp 半導体装置
EP1406300B1 (en) * 2001-07-09 2012-02-22 Sumitomo Metal Mining Company Limited Method of manufacturing a lead frame
JP3810411B2 (ja) * 2004-01-23 2006-08-16 Ｎｅｃエレクトロニクス株式会社 集積回路装置
JP4541717B2 (ja) * 2004-02-09 2010-09-08 ルネサスエレクトロニクス株式会社 集積回路装置及びその製造方法
US8008142B2 (en) 2009-03-13 2011-08-30 International Business Machines Corporation Self-aligned Schottky diode
JP5876669B2 (ja) * 2010-08-09 2016-03-02 ルネサスエレクトロニクス株式会社 半導体装置
JP2017028131A (ja) * 2015-07-23 2017-02-02 株式会社デンソー パッケージ実装体
CN111354695B (zh) * 2020-03-11 2022-11-15 珠海格力电器股份有限公司 封装结构及其制造方法
US12021038B2 (en) 2021-06-11 2024-06-25 Macom Technology Solutions Holdings, Inc. Solderable and wire bondable part marking

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5041902A (en) * 1989-12-14 1991-08-20 Motorola, Inc. Molded electronic package with compression structures
JP3252569B2 (ja) * 1993-11-09 2002-02-04 株式会社デンソー 絶縁分離基板及びそれを用いた半導体装置及びその製造方法
JPH07335811A (ja) 1994-06-10 1995-12-22 Nippondenso Co Ltd 半導体装置
JPH11284119A (ja) 1998-03-27 1999-10-15 Mitsumi Electric Co Ltd 半導体集積デバイスの放熱構造
US6139977A (en) * 1998-06-10 2000-10-31 Lucent Technologies Inc. Palladium surface coating suitable for wirebonding and process for forming palladium surface coatings
US6429512B1 (en) * 1999-03-16 2002-08-06 Siliconware Precision Industries Co., Ltd. Ball grid array integrated circuit package with palladium coated heat-dissipation device
US6198163B1 (en) * 1999-10-18 2001-03-06 Amkor Technology, Inc. Thin leadframe-type semiconductor package having heat sink with recess and exposed surface
US6512244B1 (en) * 2001-05-07 2003-01-28 Advanced Micro Devices, Inc. SOI device with structure for enhancing carrier recombination and method of fabricating same

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