JP4195380B2 - 冷却を改善した半導体デバイスのパッケージ - Google Patents
冷却を改善した半導体デバイスのパッケージ Download PDFInfo
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- JP4195380B2 JP4195380B2 JP2003535253A JP2003535253A JP4195380B2 JP 4195380 B2 JP4195380 B2 JP 4195380B2 JP 2003535253 A JP2003535253 A JP 2003535253A JP 2003535253 A JP2003535253 A JP 2003535253A JP 4195380 B2 JP4195380 B2 JP 4195380B2
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/13—Discrete devices, e.g. 3 terminal devices
- H01L2924/1304—Transistor
- H01L2924/1306—Field-effect transistor [FET]
- H01L2924/13091—Metal-Oxide-Semiconductor Field-Effect Transistor [MOSFET]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/161—Cap
- H01L2924/1615—Shape
- H01L2924/16152—Cap comprising a cavity for hosting the device, e.g. U-shaped cap
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/161—Cap
- H01L2924/166—Material
- H01L2924/167—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/30—Technical effects
- H01L2924/301—Electrical effects
- H01L2924/3011—Impedance
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Description
Claims (13)
- 半導体デバイスであって、
第1の表面上に配設された第1の電極と第2の表面上に配設された第2の電極とを有する半導体ダイと、
少なくとも部分的に金属めっきされた表面を有するクリップと
を具え、該クリップは、
第1の表面と該第1の表面に対向する第2の表面とを有する電気伝導性のウェブ部と、
前記電気伝導性のウェブ部の前記第1の表面の端部から延在した少なくとも1つの電気伝導性のポストと、
前記電気伝導性のウェブ部の前記第2の表面の全面に渡ってかつ該第2の表面から延伸する複数の熱伝導性構造体とを有し、
前記半導体ダイの前記第1の電極は、前記ウェブ部の第1の表面上に電気的に接続されて配設され、
前記複数の熱伝導性構造体と前記少なくとも1つの電気伝導性のポストとは、前記電気伝導性のウェブ部と一体化され、該一体化された本体を形成することを特徴とする半導体デバイス。 - 前記電気伝導性のウェブ部は、電気伝導性接着剤によって前記半導体ダイの第1の電極に電気的に接続されていることを特徴とする請求項1記載の半導体デバイス。
- 前記電気伝導性接着剤は、はんだを含むことを特徴とする請求項2記載の半導体デバイス。
- 前記電気伝導性接着剤は、電気伝導性エポキシを含むことを特徴とする請求項2記載の半導体デバイス。
- 前記一体化された本体は、熱伝導性材料を含むことを特徴とする請求項4記載の半導体デバイス。
- 前記一体化された本体は、アルミニウムおよび金属母材ポリマーの1つを含むことを特徴とする請求項5記載の半導体デバイス。
- 前記半導体ダイと前記少なくとも1個の電気伝導性のポストとの間に配設された絶縁充填材をさらに具えたことを特徴とする請求項1記載の半導体デバイス。
- 前記電気伝導性のウェブ部の前記第1の主要な表面から離れる方向に、前記電気伝導性のウェブ部の他の端部から延伸する少なくとも1個の他の電気伝導性のポストをさらに具えたことを特徴とする請求項1記載の半導体デバイス。
- 半導体デバイスを構成する半導体ダイを装着するための、少なくとも部分的に金属めっきされた表面を有するクリップであって、
前記半導体ダイの電極を電気的に接続するための第1の表面と該第1の表面に対向する第2の表面とを有する電気伝導性のウェブ部と、
前記電気伝導性のウェブ部の前記第1の表面の端部から延在した少なくとも1つの電気伝導性のポストと、
前記電気伝導性のウェブ部の前記第2の表面の全面に渡ってかつ該第2の表面から延伸する複数の熱伝導性構造体と
を具え、
前記複数の熱伝導性構造体と前記少なくとも1つの電気伝導性のポストとは、前記電気伝導性のウェブ部と一体化され、該一体化された本体を形成することを特徴とするクリップ。 - 前記複数のフィンと前記少なくとも1個の電気的コネクタとは、前記電気伝導性のウェブ部に一体的に接続され、該一体化した本体を形成することを特徴とする請求項9記載のクリップ。
- 前記一体化された本体は、アルミニウムからなることを特徴とする請求項10記載のクリップ。
- 前記一体化された本体は、金属母材ポリマーからなることを特徴とする請求項10記載のクリップ。
- 前記電気伝導性のウェブ部の他の端部に接続され、前記ウェブ部の前記第1の主要な表面から離れて延伸する少なくとも1個の他の電気的コネクタをさらに具えたことを特徴とする請求項9ないし12のいずれかに記載のクリップ。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US32836201P | 2001-10-10 | 2001-10-10 | |
US10/267,142 US6784540B2 (en) | 2001-10-10 | 2002-10-08 | Semiconductor device package with improved cooling |
PCT/US2002/032678 WO2003032388A1 (en) | 2001-10-10 | 2002-10-09 | Semiconductor device package with improved cooling |
Publications (3)
Publication Number | Publication Date |
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JP2005506691A JP2005506691A (ja) | 2005-03-03 |
JP2005506691A5 JP2005506691A5 (ja) | 2008-02-07 |
JP4195380B2 true JP4195380B2 (ja) | 2008-12-10 |
Family
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JP2003535253A Expired - Fee Related JP4195380B2 (ja) | 2001-10-10 | 2002-10-09 | 冷却を改善した半導体デバイスのパッケージ |
Country Status (5)
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US (2) | US6784540B2 (ja) |
JP (1) | JP4195380B2 (ja) |
CN (1) | CN1311548C (ja) |
TW (1) | TW574749B (ja) |
WO (1) | WO2003032388A1 (ja) |
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US6391687B1 (en) | 2000-10-31 | 2002-05-21 | Fairchild Semiconductor Corporation | Column ball grid array package |
US6566164B1 (en) * | 2000-12-07 | 2003-05-20 | Amkor Technology, Inc. | Exposed copper strap in a semiconductor package |
-
2002
- 2002-10-08 US US10/267,142 patent/US6784540B2/en not_active Ceased
- 2002-10-09 CN CNB028201590A patent/CN1311548C/zh not_active Expired - Fee Related
- 2002-10-09 TW TW91123353A patent/TW574749B/zh not_active IP Right Cessation
- 2002-10-09 WO PCT/US2002/032678 patent/WO2003032388A1/en active Application Filing
- 2002-10-09 JP JP2003535253A patent/JP4195380B2/ja not_active Expired - Fee Related
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2006
- 2006-08-31 US US11/514,327 patent/USRE41559E1/en not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
USRE41559E1 (en) | 2010-08-24 |
CN1311548C (zh) | 2007-04-18 |
US20030067071A1 (en) | 2003-04-10 |
JP2005506691A (ja) | 2005-03-03 |
CN1568541A (zh) | 2005-01-19 |
US6784540B2 (en) | 2004-08-31 |
TW574749B (en) | 2004-02-01 |
WO2003032388A1 (en) | 2003-04-17 |
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