JP2000219973A5 - - Google Patents

Download PDF

Info

Publication number
JP2000219973A5
JP2000219973A5 JP2000019278A JP2000019278A JP2000219973A5 JP 2000219973 A5 JP2000219973 A5 JP 2000219973A5 JP 2000019278 A JP2000019278 A JP 2000019278A JP 2000019278 A JP2000019278 A JP 2000019278A JP 2000219973 A5 JP2000219973 A5 JP 2000219973A5
Authority
JP
Japan
Prior art keywords
gold
electrolyte composition
circuit board
hydroxylamine
plating solution
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2000019278A
Other languages
English (en)
Japanese (ja)
Other versions
JP2000219973A (ja
JP4783484B2 (ja
Filing date
Publication date
Application filed filed Critical
Publication of JP2000219973A publication Critical patent/JP2000219973A/ja
Publication of JP2000219973A5 publication Critical patent/JP2000219973A5/ja
Application granted granted Critical
Publication of JP4783484B2 publication Critical patent/JP4783484B2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

JP2000019278A 1999-01-27 2000-01-27 無電解金メッキ溶液および方法 Expired - Lifetime JP4783484B2 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US11771599P 1999-01-27 1999-01-27
US60/117715 1999-01-27

Publications (3)

Publication Number Publication Date
JP2000219973A JP2000219973A (ja) 2000-08-08
JP2000219973A5 true JP2000219973A5 (enExample) 2007-03-08
JP4783484B2 JP4783484B2 (ja) 2011-09-28

Family

ID=22374429

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2000019278A Expired - Lifetime JP4783484B2 (ja) 1999-01-27 2000-01-27 無電解金メッキ溶液および方法

Country Status (5)

Country Link
US (1) US6383269B1 (enExample)
EP (1) EP1026285A3 (enExample)
JP (1) JP4783484B2 (enExample)
KR (1) KR100712261B1 (enExample)
TW (1) TWI223011B (enExample)

Families Citing this family (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2915888B1 (ja) * 1998-01-28 1999-07-05 日本特殊陶業株式会社 配線基板及びその製造方法
SG94721A1 (en) * 1999-12-01 2003-03-18 Gul Technologies Singapore Ltd Electroless gold plated electronic components and method of producing the same
KR20030033034A (ko) * 2000-08-21 2003-04-26 니혼 리로날 가부시키가이샤 치환 무전해 금 도금액, 및 상기 도금액 제조용 첨가제
JP3482402B2 (ja) * 2001-06-29 2003-12-22 日本エレクトロプレイテイング・エンジニヤース株式会社 置換金メッキ液
DE10139555B4 (de) * 2001-08-10 2008-10-16 Robert Bosch Gmbh Verfahren zum Aufbringen einer Haftvermittlerschicht auf einer Metallschicht eines Chips
JP3892730B2 (ja) * 2002-01-30 2007-03-14 関東化学株式会社 無電解金めっき液
WO2004003551A1 (ja) * 2002-06-28 2004-01-08 Canon Kabushiki Kaisha プローブ担体、プローブ担体の作成方法及びプローブ担体の評価方法及びそれを用いた標的核酸の検出方法
JP4638818B2 (ja) * 2003-06-10 2011-02-23 Jx日鉱日石金属株式会社 無電解金めっき液
CN1981347A (zh) * 2004-07-15 2007-06-13 积水化学工业株式会社 导电性微粒、导电性微粒的制造方法、和各向异性导电材料
JP5116956B2 (ja) * 2005-07-14 2013-01-09 関東化学株式会社 無電解硬質金めっき液
JP4932542B2 (ja) * 2007-03-05 2012-05-16 ローム・アンド・ハース・エレクトロニック・マテリアルズ,エル.エル.シー. 無電解金めっき液
GB0711302D0 (en) * 2007-06-12 2007-07-25 Buss Chemtech Ag Process & apparatus
KR100981445B1 (ko) * 2008-05-07 2010-09-13 (주)인터플렉스 연성인쇄회로기판의 고연성 Au 표면처리방법
US20110147038A1 (en) * 2009-12-17 2011-06-23 Honeywell International Inc. Oxidation-resistant high temperature wires and methods for the making thereof
WO2015010198A1 (en) 2013-07-24 2015-01-29 National Research Council Of Canada Process for depositing metal on a substrate
KR101444687B1 (ko) 2014-08-06 2014-09-26 (주)엠케이켐앤텍 무전해 금도금액
CN113054077A (zh) * 2021-03-16 2021-06-29 京东方科技集团股份有限公司 显示面板及其制备方法、显示装置及拼接显示装置

Family Cites Families (32)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3032436A (en) 1960-11-18 1962-05-01 Metal Proc Co Inc Method and composition for plating by chemical reduction
US3753874A (en) 1971-12-21 1973-08-21 Amp Inc Method and electrolyte for electrodepositing a gold-arsenic alloy
DE3029785A1 (de) * 1980-08-04 1982-03-25 Schering Ag, 1000 Berlin Und 4619 Bergkamen Saures goldbad zur stromlosen abscheidung von gold
US4374876A (en) * 1981-06-02 1983-02-22 Occidental Chemical Corporation Process for the immersion deposition of gold
JPS596365A (ja) * 1982-06-30 1984-01-13 Toshiba Corp 無電解金メツキ方法
DE3237394A1 (de) * 1982-10-08 1984-04-12 Siemens AG, 1000 Berlin und 8000 München Chemisches vergoldungsbad
JPS60125379A (ja) 1983-12-07 1985-07-04 Shinko Electric Ind Co Ltd 無電解金めっき液
US5202151A (en) 1985-10-14 1993-04-13 Hitachi, Ltd. Electroless gold plating solution, method of plating with gold by using the same, and electronic device plated with gold by using the same
CN1003524B (zh) 1985-10-14 1989-03-08 株式会社日立制作所 无电浸镀金溶液
US5178918A (en) * 1986-07-14 1993-01-12 Robert Duva Electroless plating process
DE3640028C1 (de) * 1986-11-24 1987-10-01 Heraeus Gmbh W C Saures Bad fuer das stromlose Abscheiden von Goldschichten
DD265915A1 (de) * 1987-11-10 1989-03-15 Akad Wissenschaften Ddr Verfahren zur stromlosen abscheidung von gold
JPH0826471B2 (ja) 1988-11-14 1996-03-13 新光電気工業株式会社 金めっき液
JP3058178B2 (ja) 1990-01-18 2000-07-04 エヌ・イーケムキヤツト株式会社 無電解金めつき液
US5232492A (en) 1992-01-23 1993-08-03 Applied Electroless Concepts Inc. Electroless gold plating composition
WO1994012686A1 (fr) 1992-11-25 1994-06-09 Kanto Kagaku Kabushiki Kaisha Bain autocatalytique de placage d'or
US5803957A (en) * 1993-03-26 1998-09-08 C. Uyemura & Co.,Ltd. Electroless gold plating bath
EP0618307B1 (en) * 1993-03-26 1997-11-12 C. Uyemura & Co, Ltd Electroless gold plating bath
JP2927142B2 (ja) * 1993-03-26 1999-07-28 上村工業株式会社 無電解金めっき浴及び無電解金めっき方法
US5318621A (en) 1993-08-11 1994-06-07 Applied Electroless Concepts, Inc. Plating rate improvement for electroless silver and gold plating
KR960005765A (ko) * 1994-07-14 1996-02-23 모리시다 요이치 반도체 장치의 배선형성에 이용하는 무전해 도금욕 및 반도체 장치의 배선성형방법
JP3426817B2 (ja) * 1995-11-17 2003-07-14 日立化成工業株式会社 無電解金めっき液
JPH09157859A (ja) 1995-12-01 1997-06-17 Hitachi Chem Co Ltd 無電解金めっき液
JPH09171714A (ja) * 1995-12-21 1997-06-30 Nippon Chem Ind Co Ltd 導電性粉体
JPH09287077A (ja) 1996-04-19 1997-11-04 Hitachi Chem Co Ltd 無電解金めっき液
JPH08253872A (ja) 1996-04-22 1996-10-01 Hitachi Ltd 電子部品の金めっき方法
JP3259906B2 (ja) * 1997-04-15 2002-02-25 イビデン株式会社 無電解めっき用接着剤およびプリント配線板
JPH1112753A (ja) 1997-06-20 1999-01-19 Hitachi Chem Co Ltd 無電解金めっき方法
DE19745601C2 (de) 1997-10-08 2001-07-12 Fraunhofer Ges Forschung Lösung und Verfahren zum stromlosen Abscheiden von Goldschichten sowie Verwendung der Lösung
US5935306A (en) * 1998-02-10 1999-08-10 Technic Inc. Electroless gold plating bath
JP3816241B2 (ja) * 1998-07-14 2006-08-30 株式会社大和化成研究所 金属を還元析出させるための水溶液
JP3677617B2 (ja) 1999-06-08 2005-08-03 小島化学薬品株式会社 無電解金めっき液

Similar Documents

Publication Publication Date Title
JP2000219973A5 (enExample)
CA1139012A (en) Method of preparing substrate surface for electroless plating and products produced thereby
US5235139A (en) Method for fabricating printed circuits
JP3009326B2 (ja) 不導性基材に金属被覆を適用するための方法
CA1154878A (en) Heat shock resistant printed circuit board assemblies
US6156221A (en) Copper etching compositions, processes and products derived therefrom
EP1919266A3 (en) Electroless plating solution, electroless plating process, and printed circuit board
JP4783484B2 (ja) 無電解金メッキ溶液および方法
JP3337802B2 (ja) 酸化銅(i)コロイドの金属化によるダイレクトプレーティング方法
EP0707093B1 (en) Method for selective plating
JPS5927379B2 (ja) 迅速なメツキ速度を有する無電解銅折出法
JP2005520936A5 (enExample)
GB2051489A (en) Process for the manufacture of printed circuits
US5468515A (en) Composition and method for selective plating
CA2423066A1 (en) Method for enhancing the solderability of a surface
US5681648A (en) Printed wiring board and method for preparing the same
JP2002302789A5 (enExample)
US4520052A (en) Method for electroless copper-plating and a bath for carrying out the method
JP3336535B2 (ja) 選択的めっき用組成物及び方法
JPH07115275A (ja) 多層プリント配線板用基板の製造方法
KR890001415B1 (ko) 페놀수지의 양면인쇄 회로 기판과 이의 제조방법
IE49971B1 (en) Manufacture of printed circuits
JP2001049445A (ja) 銀導電膜上への無電解めっき方法
JPS61253375A (ja) 無電解銅めつき液
JPS5918696A (ja) プリント基板における部分半田メツキボ−ドの製造方法