JP2000219973A5 - - Google Patents
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- Publication number
- JP2000219973A5 JP2000219973A5 JP2000019278A JP2000019278A JP2000219973A5 JP 2000219973 A5 JP2000219973 A5 JP 2000219973A5 JP 2000019278 A JP2000019278 A JP 2000019278A JP 2000019278 A JP2000019278 A JP 2000019278A JP 2000219973 A5 JP2000219973 A5 JP 2000219973A5
- Authority
- JP
- Japan
- Prior art keywords
- gold
- electrolyte composition
- circuit board
- hydroxylamine
- plating solution
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 12
- 239000003792 electrolyte Substances 0.000 description 12
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 8
- 229910052737 gold Inorganic materials 0.000 description 8
- 239000010931 gold Substances 0.000 description 8
- 229910052759 nickel Inorganic materials 0.000 description 6
- 238000007747 plating Methods 0.000 description 6
- 238000007654 immersion Methods 0.000 description 5
- 150000002344 gold compounds Chemical class 0.000 description 4
- 239000003513 alkali Substances 0.000 description 3
- -1 amine carboxylic acids Chemical class 0.000 description 3
- 239000003638 chemical reducing agent Substances 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 150000003839 salts Chemical class 0.000 description 3
- CIWBSHSKHKDKBQ-JLAZNSOCSA-N Ascorbic acid Chemical compound OC[C@H](O)[C@H]1OC(=O)C(O)=C1O CIWBSHSKHKDKBQ-JLAZNSOCSA-N 0.000 description 2
- WTDHULULXKLSOZ-UHFFFAOYSA-N Hydroxylamine hydrochloride Chemical compound Cl.ON WTDHULULXKLSOZ-UHFFFAOYSA-N 0.000 description 2
- OAKJQQAXSVQMHS-UHFFFAOYSA-N hydrazine group Chemical group NN OAKJQQAXSVQMHS-UHFFFAOYSA-N 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- BDAGIHXWWSANSR-UHFFFAOYSA-N methanoic acid Natural products OC=O BDAGIHXWWSANSR-UHFFFAOYSA-N 0.000 description 2
- LPXPTNMVRIOKMN-UHFFFAOYSA-M sodium nitrite Chemical compound [Na+].[O-]N=O LPXPTNMVRIOKMN-UHFFFAOYSA-M 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- NWZSZGALRFJKBT-KNIFDHDWSA-N (2s)-2,6-diaminohexanoic acid;(2s)-2-hydroxybutanedioic acid Chemical compound OC(=O)[C@@H](O)CC(O)=O.NCCCC[C@H](N)C(O)=O NWZSZGALRFJKBT-KNIFDHDWSA-N 0.000 description 1
- OSWFIVFLDKOXQC-UHFFFAOYSA-N 4-(3-methoxyphenyl)aniline Chemical compound COC1=CC=CC(C=2C=CC(N)=CC=2)=C1 OSWFIVFLDKOXQC-UHFFFAOYSA-N 0.000 description 1
- ZNBNBTIDJSKEAM-UHFFFAOYSA-N 4-[7-hydroxy-2-[5-[5-[6-hydroxy-6-(hydroxymethyl)-3,5-dimethyloxan-2-yl]-3-methyloxolan-2-yl]-5-methyloxolan-2-yl]-2,8-dimethyl-1,10-dioxaspiro[4.5]decan-9-yl]-2-methyl-3-propanoyloxypentanoic acid Chemical compound C1C(O)C(C)C(C(C)C(OC(=O)CC)C(C)C(O)=O)OC11OC(C)(C2OC(C)(CC2)C2C(CC(O2)C2C(CC(C)C(O)(CO)O2)C)C)CC1 ZNBNBTIDJSKEAM-UHFFFAOYSA-N 0.000 description 1
- FUSNOPLQVRUIIM-UHFFFAOYSA-N 4-amino-2-(4,4-dimethyl-2-oxoimidazolidin-1-yl)-n-[3-(trifluoromethyl)phenyl]pyrimidine-5-carboxamide Chemical compound O=C1NC(C)(C)CN1C(N=C1N)=NC=C1C(=O)NC1=CC=CC(C(F)(F)F)=C1 FUSNOPLQVRUIIM-UHFFFAOYSA-N 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- AVXURJPOCDRRFD-UHFFFAOYSA-N Hydroxylamine Chemical compound ON AVXURJPOCDRRFD-UHFFFAOYSA-N 0.000 description 1
- AZFNGPAYDKGCRB-XCPIVNJJSA-M [(1s,2s)-2-amino-1,2-diphenylethyl]-(4-methylphenyl)sulfonylazanide;chlororuthenium(1+);1-methyl-4-propan-2-ylbenzene Chemical compound [Ru+]Cl.CC(C)C1=CC=C(C)C=C1.C1=CC(C)=CC=C1S(=O)(=O)[N-][C@@H](C=1C=CC=CC=1)[C@@H](N)C1=CC=CC=C1 AZFNGPAYDKGCRB-XCPIVNJJSA-M 0.000 description 1
- CAMXVZOXBADHNJ-UHFFFAOYSA-N ammonium nitrite Chemical compound [NH4+].[O-]N=O CAMXVZOXBADHNJ-UHFFFAOYSA-N 0.000 description 1
- 235000010323 ascorbic acid Nutrition 0.000 description 1
- 229960005070 ascorbic acid Drugs 0.000 description 1
- 239000011668 ascorbic acid Substances 0.000 description 1
- IQXHAJSMTNDJGA-UHFFFAOYSA-O azanium;gold(1+);dicyanide Chemical compound [NH4+].[Au+].N#[C-].N#[C-] IQXHAJSMTNDJGA-UHFFFAOYSA-O 0.000 description 1
- NHFMFALCHGVCPP-UHFFFAOYSA-M azanium;gold(1+);sulfite Chemical compound [NH4+].[Au+].[O-]S([O-])=O NHFMFALCHGVCPP-UHFFFAOYSA-M 0.000 description 1
- 150000001735 carboxylic acids Chemical class 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- GVJHHUAWPYXKBD-UHFFFAOYSA-N d-alpha-tocopherol Natural products OC1=C(C)C(C)=C2OC(CCCC(C)CCCC(C)CCCC(C)C)(C)CCC2=C1C GVJHHUAWPYXKBD-UHFFFAOYSA-N 0.000 description 1
- 235000019253 formic acid Nutrition 0.000 description 1
- IKDUDTNKRLTJSI-UHFFFAOYSA-N hydrazine monohydrate Substances O.NN IKDUDTNKRLTJSI-UHFFFAOYSA-N 0.000 description 1
- 229910000377 hydrazine sulfate Inorganic materials 0.000 description 1
- 239000012493 hydrazine sulfate Substances 0.000 description 1
- NILJXUMQIIUAFY-UHFFFAOYSA-N hydroxylamine;nitric acid Chemical compound ON.O[N+]([O-])=O NILJXUMQIIUAFY-UHFFFAOYSA-N 0.000 description 1
- HYYHQASRTSDPOD-UHFFFAOYSA-N hydroxylamine;phosphoric acid Chemical compound ON.OP(O)(O)=O HYYHQASRTSDPOD-UHFFFAOYSA-N 0.000 description 1
- 229910000378 hydroxylammonium sulfate Inorganic materials 0.000 description 1
- IIXGBDGCPUYARL-UHFFFAOYSA-N hydroxysulfamic acid Chemical compound ONS(O)(=O)=O IIXGBDGCPUYARL-UHFFFAOYSA-N 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 150000003009 phosphonic acids Chemical class 0.000 description 1
- 235000010289 potassium nitrite Nutrition 0.000 description 1
- 239000004304 potassium nitrite Substances 0.000 description 1
- XTFKWYDMKGAZKK-UHFFFAOYSA-N potassium;gold(1+);dicyanide Chemical compound [K+].[Au+].N#[C-].N#[C-] XTFKWYDMKGAZKK-UHFFFAOYSA-N 0.000 description 1
- 235000010288 sodium nitrite Nutrition 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 235000010384 tocopherol Nutrition 0.000 description 1
- 229960001295 tocopherol Drugs 0.000 description 1
- 229930003799 tocopherol Natural products 0.000 description 1
- 239000011732 tocopherol Substances 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
- GVJHHUAWPYXKBD-IEOSBIPESA-N α-tocopherol Chemical compound OC1=C(C)C(C)=C2O[C@@](CCC[C@H](C)CCC[C@H](C)CCCC(C)C)(C)CCC2=C1C GVJHHUAWPYXKBD-IEOSBIPESA-N 0.000 description 1
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US11771599P | 1999-01-27 | 1999-01-27 | |
| US60/117715 | 1999-01-27 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2000219973A JP2000219973A (ja) | 2000-08-08 |
| JP2000219973A5 true JP2000219973A5 (enExample) | 2007-03-08 |
| JP4783484B2 JP4783484B2 (ja) | 2011-09-28 |
Family
ID=22374429
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2000019278A Expired - Lifetime JP4783484B2 (ja) | 1999-01-27 | 2000-01-27 | 無電解金メッキ溶液および方法 |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US6383269B1 (enExample) |
| EP (1) | EP1026285A3 (enExample) |
| JP (1) | JP4783484B2 (enExample) |
| KR (1) | KR100712261B1 (enExample) |
| TW (1) | TWI223011B (enExample) |
Families Citing this family (17)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2915888B1 (ja) * | 1998-01-28 | 1999-07-05 | 日本特殊陶業株式会社 | 配線基板及びその製造方法 |
| SG94721A1 (en) * | 1999-12-01 | 2003-03-18 | Gul Technologies Singapore Ltd | Electroless gold plated electronic components and method of producing the same |
| KR20030033034A (ko) * | 2000-08-21 | 2003-04-26 | 니혼 리로날 가부시키가이샤 | 치환 무전해 금 도금액, 및 상기 도금액 제조용 첨가제 |
| JP3482402B2 (ja) * | 2001-06-29 | 2003-12-22 | 日本エレクトロプレイテイング・エンジニヤース株式会社 | 置換金メッキ液 |
| DE10139555B4 (de) * | 2001-08-10 | 2008-10-16 | Robert Bosch Gmbh | Verfahren zum Aufbringen einer Haftvermittlerschicht auf einer Metallschicht eines Chips |
| JP3892730B2 (ja) * | 2002-01-30 | 2007-03-14 | 関東化学株式会社 | 無電解金めっき液 |
| WO2004003551A1 (ja) * | 2002-06-28 | 2004-01-08 | Canon Kabushiki Kaisha | プローブ担体、プローブ担体の作成方法及びプローブ担体の評価方法及びそれを用いた標的核酸の検出方法 |
| JP4638818B2 (ja) * | 2003-06-10 | 2011-02-23 | Jx日鉱日石金属株式会社 | 無電解金めっき液 |
| CN1981347A (zh) * | 2004-07-15 | 2007-06-13 | 积水化学工业株式会社 | 导电性微粒、导电性微粒的制造方法、和各向异性导电材料 |
| JP5116956B2 (ja) * | 2005-07-14 | 2013-01-09 | 関東化学株式会社 | 無電解硬質金めっき液 |
| JP4932542B2 (ja) * | 2007-03-05 | 2012-05-16 | ローム・アンド・ハース・エレクトロニック・マテリアルズ,エル.エル.シー. | 無電解金めっき液 |
| GB0711302D0 (en) * | 2007-06-12 | 2007-07-25 | Buss Chemtech Ag | Process & apparatus |
| KR100981445B1 (ko) * | 2008-05-07 | 2010-09-13 | (주)인터플렉스 | 연성인쇄회로기판의 고연성 Au 표면처리방법 |
| US20110147038A1 (en) * | 2009-12-17 | 2011-06-23 | Honeywell International Inc. | Oxidation-resistant high temperature wires and methods for the making thereof |
| WO2015010198A1 (en) | 2013-07-24 | 2015-01-29 | National Research Council Of Canada | Process for depositing metal on a substrate |
| KR101444687B1 (ko) | 2014-08-06 | 2014-09-26 | (주)엠케이켐앤텍 | 무전해 금도금액 |
| CN113054077A (zh) * | 2021-03-16 | 2021-06-29 | 京东方科技集团股份有限公司 | 显示面板及其制备方法、显示装置及拼接显示装置 |
Family Cites Families (32)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3032436A (en) | 1960-11-18 | 1962-05-01 | Metal Proc Co Inc | Method and composition for plating by chemical reduction |
| US3753874A (en) | 1971-12-21 | 1973-08-21 | Amp Inc | Method and electrolyte for electrodepositing a gold-arsenic alloy |
| DE3029785A1 (de) * | 1980-08-04 | 1982-03-25 | Schering Ag, 1000 Berlin Und 4619 Bergkamen | Saures goldbad zur stromlosen abscheidung von gold |
| US4374876A (en) * | 1981-06-02 | 1983-02-22 | Occidental Chemical Corporation | Process for the immersion deposition of gold |
| JPS596365A (ja) * | 1982-06-30 | 1984-01-13 | Toshiba Corp | 無電解金メツキ方法 |
| DE3237394A1 (de) * | 1982-10-08 | 1984-04-12 | Siemens AG, 1000 Berlin und 8000 München | Chemisches vergoldungsbad |
| JPS60125379A (ja) | 1983-12-07 | 1985-07-04 | Shinko Electric Ind Co Ltd | 無電解金めっき液 |
| US5202151A (en) | 1985-10-14 | 1993-04-13 | Hitachi, Ltd. | Electroless gold plating solution, method of plating with gold by using the same, and electronic device plated with gold by using the same |
| CN1003524B (zh) | 1985-10-14 | 1989-03-08 | 株式会社日立制作所 | 无电浸镀金溶液 |
| US5178918A (en) * | 1986-07-14 | 1993-01-12 | Robert Duva | Electroless plating process |
| DE3640028C1 (de) * | 1986-11-24 | 1987-10-01 | Heraeus Gmbh W C | Saures Bad fuer das stromlose Abscheiden von Goldschichten |
| DD265915A1 (de) * | 1987-11-10 | 1989-03-15 | Akad Wissenschaften Ddr | Verfahren zur stromlosen abscheidung von gold |
| JPH0826471B2 (ja) | 1988-11-14 | 1996-03-13 | 新光電気工業株式会社 | 金めっき液 |
| JP3058178B2 (ja) | 1990-01-18 | 2000-07-04 | エヌ・イーケムキヤツト株式会社 | 無電解金めつき液 |
| US5232492A (en) | 1992-01-23 | 1993-08-03 | Applied Electroless Concepts Inc. | Electroless gold plating composition |
| WO1994012686A1 (fr) | 1992-11-25 | 1994-06-09 | Kanto Kagaku Kabushiki Kaisha | Bain autocatalytique de placage d'or |
| US5803957A (en) * | 1993-03-26 | 1998-09-08 | C. Uyemura & Co.,Ltd. | Electroless gold plating bath |
| EP0618307B1 (en) * | 1993-03-26 | 1997-11-12 | C. Uyemura & Co, Ltd | Electroless gold plating bath |
| JP2927142B2 (ja) * | 1993-03-26 | 1999-07-28 | 上村工業株式会社 | 無電解金めっき浴及び無電解金めっき方法 |
| US5318621A (en) | 1993-08-11 | 1994-06-07 | Applied Electroless Concepts, Inc. | Plating rate improvement for electroless silver and gold plating |
| KR960005765A (ko) * | 1994-07-14 | 1996-02-23 | 모리시다 요이치 | 반도체 장치의 배선형성에 이용하는 무전해 도금욕 및 반도체 장치의 배선성형방법 |
| JP3426817B2 (ja) * | 1995-11-17 | 2003-07-14 | 日立化成工業株式会社 | 無電解金めっき液 |
| JPH09157859A (ja) | 1995-12-01 | 1997-06-17 | Hitachi Chem Co Ltd | 無電解金めっき液 |
| JPH09171714A (ja) * | 1995-12-21 | 1997-06-30 | Nippon Chem Ind Co Ltd | 導電性粉体 |
| JPH09287077A (ja) | 1996-04-19 | 1997-11-04 | Hitachi Chem Co Ltd | 無電解金めっき液 |
| JPH08253872A (ja) | 1996-04-22 | 1996-10-01 | Hitachi Ltd | 電子部品の金めっき方法 |
| JP3259906B2 (ja) * | 1997-04-15 | 2002-02-25 | イビデン株式会社 | 無電解めっき用接着剤およびプリント配線板 |
| JPH1112753A (ja) | 1997-06-20 | 1999-01-19 | Hitachi Chem Co Ltd | 無電解金めっき方法 |
| DE19745601C2 (de) | 1997-10-08 | 2001-07-12 | Fraunhofer Ges Forschung | Lösung und Verfahren zum stromlosen Abscheiden von Goldschichten sowie Verwendung der Lösung |
| US5935306A (en) * | 1998-02-10 | 1999-08-10 | Technic Inc. | Electroless gold plating bath |
| JP3816241B2 (ja) * | 1998-07-14 | 2006-08-30 | 株式会社大和化成研究所 | 金属を還元析出させるための水溶液 |
| JP3677617B2 (ja) | 1999-06-08 | 2005-08-03 | 小島化学薬品株式会社 | 無電解金めっき液 |
-
2000
- 2000-01-25 US US09/490,928 patent/US6383269B1/en not_active Expired - Lifetime
- 2000-01-26 KR KR1020000003661A patent/KR100712261B1/ko not_active Expired - Lifetime
- 2000-01-26 EP EP00300548A patent/EP1026285A3/en not_active Withdrawn
- 2000-01-27 JP JP2000019278A patent/JP4783484B2/ja not_active Expired - Lifetime
- 2000-01-27 TW TW089101339A patent/TWI223011B/zh not_active IP Right Cessation
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