JP2005520936A5 - - Google Patents
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- Publication number
- JP2005520936A5 JP2005520936A5 JP2003580104A JP2003580104A JP2005520936A5 JP 2005520936 A5 JP2005520936 A5 JP 2005520936A5 JP 2003580104 A JP2003580104 A JP 2003580104A JP 2003580104 A JP2003580104 A JP 2003580104A JP 2005520936 A5 JP2005520936 A5 JP 2005520936A5
- Authority
- JP
- Japan
- Prior art keywords
- silver plating
- silver
- peeling method
- plating peeling
- wiring board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims 13
- 229910052709 silver Inorganic materials 0.000 claims 13
- 239000004332 silver Substances 0.000 claims 13
- 238000007747 plating Methods 0.000 claims 10
- 238000000034 method Methods 0.000 claims 9
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical group [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 claims 3
- 230000003472 neutralizing effect Effects 0.000 claims 3
- QGZKDVFQNNGYKY-UHFFFAOYSA-N Ammonia Chemical compound N QGZKDVFQNNGYKY-UHFFFAOYSA-N 0.000 claims 2
- ATRRKUHOCOJYRX-UHFFFAOYSA-N Ammonium bicarbonate Chemical compound [NH4+].OC([O-])=O ATRRKUHOCOJYRX-UHFFFAOYSA-N 0.000 claims 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims 2
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 claims 2
- 239000001099 ammonium carbonate Substances 0.000 claims 2
- 239000010953 base metal Substances 0.000 claims 2
- 239000007800 oxidant agent Substances 0.000 claims 2
- 239000003002 pH adjusting agent Substances 0.000 claims 2
- KZNICNPSHKQLFF-UHFFFAOYSA-N succinimide Chemical compound O=C1CCC(=O)N1 KZNICNPSHKQLFF-UHFFFAOYSA-N 0.000 claims 2
- ZNBNBTIDJSKEAM-UHFFFAOYSA-N 4-[7-hydroxy-2-[5-[5-[6-hydroxy-6-(hydroxymethyl)-3,5-dimethyloxan-2-yl]-3-methyloxolan-2-yl]-5-methyloxolan-2-yl]-2,8-dimethyl-1,10-dioxaspiro[4.5]decan-9-yl]-2-methyl-3-propanoyloxypentanoic acid Chemical compound C1C(O)C(C)C(C(C)C(OC(=O)CC)C(C)C(O)=O)OC11OC(C)(C2OC(C)(CC2)C2C(CC(O2)C2C(CC(C)C(O)(CO)O2)C)C)CC1 ZNBNBTIDJSKEAM-UHFFFAOYSA-N 0.000 claims 1
- 229910000013 Ammonium bicarbonate Inorganic materials 0.000 claims 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims 1
- 229910021529 ammonia Inorganic materials 0.000 claims 1
- 235000012538 ammonium bicarbonate Nutrition 0.000 claims 1
- 235000012501 ammonium carbonate Nutrition 0.000 claims 1
- 239000003795 chemical substances by application Substances 0.000 claims 1
- 229910052802 copper Inorganic materials 0.000 claims 1
- 239000010949 copper Substances 0.000 claims 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims 1
- 229910052737 gold Inorganic materials 0.000 claims 1
- 239000010931 gold Substances 0.000 claims 1
- 229910000378 hydroxylammonium sulfate Inorganic materials 0.000 claims 1
- 229910052759 nickel Inorganic materials 0.000 claims 1
- 239000012286 potassium permanganate Substances 0.000 claims 1
- 239000002904 solvent Substances 0.000 claims 1
- 229960002317 succinimide Drugs 0.000 claims 1
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US10/106,522 | 2002-03-25 | ||
| US10/106,522 US6783690B2 (en) | 2002-03-25 | 2002-03-25 | Method of stripping silver from a printed circuit board |
| PCT/US2003/004784 WO2003082605A1 (en) | 2002-03-25 | 2003-02-18 | Method of stripping silver from a printed circuit board |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2005520936A JP2005520936A (ja) | 2005-07-14 |
| JP3683896B2 JP3683896B2 (ja) | 2005-08-17 |
| JP2005520936A5 true JP2005520936A5 (enExample) | 2005-12-22 |
Family
ID=28452509
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2003580104A Expired - Lifetime JP3683896B2 (ja) | 2002-03-25 | 2003-02-18 | プリント配線基板からの銀メッキ剥離方法 |
Country Status (8)
| Country | Link |
|---|---|
| US (1) | US6783690B2 (enExample) |
| EP (1) | EP1487646B1 (enExample) |
| JP (1) | JP3683896B2 (enExample) |
| CN (1) | CN1703327B (enExample) |
| AU (1) | AU2003217557A1 (enExample) |
| ES (1) | ES2410811T3 (enExample) |
| TW (1) | TWI256423B (enExample) |
| WO (1) | WO2003082605A1 (enExample) |
Families Citing this family (17)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4268515B2 (ja) * | 2003-12-26 | 2009-05-27 | 新光電気工業株式会社 | 電解剥離方法 |
| KR100712879B1 (ko) * | 2005-04-06 | 2007-04-30 | 주식회사 잉크테크 | 에칭액 조성물 |
| US20070232510A1 (en) * | 2006-03-29 | 2007-10-04 | Kucera Alvin A | Method and composition for selectively stripping silver from a substrate |
| DE112009000839T5 (de) * | 2008-04-10 | 2011-05-12 | World Properties, Inc., Lincolnwood | Schaltungsmaterialien mit verbesserter Bindung, Verfahren zur Herstellung hiervon und hieraus hergestellte Artikel |
| US8753561B2 (en) * | 2008-06-20 | 2014-06-17 | Baxter International Inc. | Methods for processing substrates comprising metallic nanoparticles |
| US8178120B2 (en) * | 2008-06-20 | 2012-05-15 | Baxter International Inc. | Methods for processing substrates having an antimicrobial coating |
| US8277826B2 (en) | 2008-06-25 | 2012-10-02 | Baxter International Inc. | Methods for making antimicrobial resins |
| US20090324738A1 (en) * | 2008-06-30 | 2009-12-31 | Baxter International Inc. | Methods for making antimicrobial coatings |
| US20100227052A1 (en) * | 2009-03-09 | 2010-09-09 | Baxter International Inc. | Methods for processing substrates having an antimicrobial coating |
| KR101701537B1 (ko) * | 2009-05-08 | 2017-02-01 | 바스프 에스이 | 루테늄 비롯한 귀금속의 화학적 기계적 평탄화를 위한 산화 입자계 슬러리 |
| CN103237419B (zh) * | 2013-04-22 | 2016-04-20 | 胜华电子（惠阳）有限公司 | 一种化银线路板银面剥除方法 |
| WO2015095664A2 (en) | 2013-12-20 | 2015-06-25 | Greene Lyon Group, Inc. | Method and apparatus for recovery of noble metals, including recovery of noble metals from plated and/or filled scrap |
| WO2016210051A1 (en) | 2015-06-24 | 2016-12-29 | Greene Lyon Group, Inc. | Selective removal of noble metals using acidic fluids, including fluids containing nitrate ions |
| US20220151795A1 (en) | 2019-03-11 | 2022-05-19 | Shoulder Innovations, Inc. | Total reverse shoulder systems and methods |
| CN114074492B (zh) * | 2020-08-18 | 2024-06-25 | 光群雷射科技股份有限公司 | 去除转印滚轮的拆版线的方法 |
| TWI755229B (zh) * | 2020-12-30 | 2022-02-11 | 力橋國際有限公司 | 無氰之電解剝銀劑及電解剝銀方法 |
| CN113846326A (zh) * | 2021-09-23 | 2021-12-28 | 江苏富乐德半导体科技有限公司 | 一种陶瓷覆铜基板表面化学镀银退镀方法 |
Family Cites Families (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| FR1583955A (enExample) * | 1968-04-19 | 1969-12-12 | ||
| US3860423A (en) | 1973-08-24 | 1975-01-14 | Rca Corp | Etching solution for silver |
| US4204013A (en) | 1978-10-20 | 1980-05-20 | Oxy Metal Industries Corporation | Method for treating polymeric substrates prior to plating employing accelerating composition containing an alkyl amine |
| US4448637A (en) | 1981-12-28 | 1984-05-15 | Daicel Chemical Industries, Ltd. | Etching method of conductive film |
| US4960490A (en) | 1983-06-13 | 1990-10-02 | Minnesota Mining And Manufacturing Company | Method of making multiple-connector adhesive tape |
| US5002649A (en) | 1988-03-28 | 1991-03-26 | Sifco Industries, Inc. | Selective stripping apparatus |
| JPH03232980A (ja) * | 1990-02-06 | 1991-10-16 | Shinko Electric Ind Co Ltd | 銅もしくは銅合金上の銀剥離液 |
| DE4031609A1 (de) | 1990-03-16 | 1991-09-19 | Kodak Ag | Verfahren und vorrichtung zur aufbereitung von fluessigen rueckstaenden aus photographischen prozessen |
| USH1136H (en) | 1991-11-29 | 1993-02-02 | The United States Of America As Represented By The Secretary Of The Air Force | Electrolytic deposition and recovery of silver |
| JPH07316845A (ja) * | 1994-05-19 | 1995-12-05 | Hitachi Cable Ltd | 銀めっき部材の表面処理液 |
| US5611905A (en) * | 1995-06-09 | 1997-03-18 | Shipley Company, L.L.C. | Electroplating process |
| US6200451B1 (en) | 1996-03-22 | 2001-03-13 | Macdermid, Incorporated | Method for enhancing the solderability of a surface |
| TW385375B (en) * | 1996-07-26 | 2000-03-21 | Asahi Glass Co Ltd | Transparent conductive film and forming method for transparent electrode |
| US6126720A (en) | 1997-06-16 | 2000-10-03 | Mitsubishi Materials Corporation | Method for smelting noble metal |
| US6238592B1 (en) | 1999-03-10 | 2001-05-29 | 3M Innovative Properties Company | Working liquids and methods for modifying structured wafers suited for semiconductor fabrication |
-
2002
- 2002-03-25 US US10/106,522 patent/US6783690B2/en not_active Expired - Lifetime
-
2003
- 2003-02-18 CN CN038066629A patent/CN1703327B/zh not_active Expired - Fee Related
- 2003-02-18 EP EP03713509.2A patent/EP1487646B1/en not_active Expired - Lifetime
- 2003-02-18 WO PCT/US2003/004784 patent/WO2003082605A1/en not_active Ceased
- 2003-02-18 JP JP2003580104A patent/JP3683896B2/ja not_active Expired - Lifetime
- 2003-02-18 ES ES03713509T patent/ES2410811T3/es not_active Expired - Lifetime
- 2003-02-18 AU AU2003217557A patent/AU2003217557A1/en not_active Abandoned
- 2003-02-27 TW TW092104260A patent/TWI256423B/zh not_active IP Right Cessation
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