FR1583955A - - Google Patents
Info
- Publication number
- FR1583955A FR1583955A FR148719A FR1583955DA FR1583955A FR 1583955 A FR1583955 A FR 1583955A FR 148719 A FR148719 A FR 148719A FR 1583955D A FR1583955D A FR 1583955DA FR 1583955 A FR1583955 A FR 1583955A
- Authority
- FR
- France
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
- C23F1/00—Etching metallic material by chemical means
- C23F1/44—Compositions for etching metallic material from a metallic material substrate of different composition
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
- C23F1/00—Etching metallic material by chemical means
- C23F1/10—Etching compositions
- C23F1/14—Aqueous compositions
- C23F1/16—Acidic compositions
- C23F1/30—Acidic compositions for etching other metallic material
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- ing And Chemical Polishing (AREA)
- Weting (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| FR148719 | 1968-04-19 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| FR1583955A true FR1583955A (enExample) | 1969-12-12 |
Family
ID=8649172
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| FR148719A Expired FR1583955A (enExample) | 1968-04-19 | 1968-04-19 |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US3615950A (enExample) |
| DE (1) | DE1919158A1 (enExample) |
| FR (1) | FR1583955A (enExample) |
| GB (1) | GB1261803A (enExample) |
| NL (1) | NL6906100A (enExample) |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB1446816A (en) * | 1973-05-02 | 1976-08-18 | Furukawa Electric Co Ltd | Chemical dissolution treatment of tin or alloys thereof |
| US3926699A (en) * | 1974-06-17 | 1975-12-16 | Rbp Chemical Corp | Method of preparing printed circuit boards with terminal tabs |
| USRE29181E (en) * | 1974-12-18 | 1977-04-12 | Rbp Chemical Corporation | Method of preparing printed circuit boards with terminal tabs |
| US6121058A (en) * | 1998-01-02 | 2000-09-19 | Intel Corporation | Method for removing accumulated solder from probe card probing features |
| US6783690B2 (en) * | 2002-03-25 | 2004-08-31 | Donna M. Kologe | Method of stripping silver from a printed circuit board |
| US20060038302A1 (en) * | 2004-08-19 | 2006-02-23 | Kejun Zeng | Thermal fatigue resistant tin-lead-silver solder |
-
1968
- 1968-04-19 FR FR148719A patent/FR1583955A/fr not_active Expired
-
1969
- 1969-04-15 US US816301A patent/US3615950A/en not_active Expired - Lifetime
- 1969-04-16 DE DE19691919158 patent/DE1919158A1/de active Pending
- 1969-04-16 GB GB09406/69A patent/GB1261803A/en not_active Expired
- 1969-04-18 NL NL6906100A patent/NL6906100A/xx unknown
Also Published As
| Publication number | Publication date |
|---|---|
| US3615950A (en) | 1971-10-26 |
| NL6906100A (enExample) | 1969-10-21 |
| DE1919158A1 (de) | 1969-11-06 |
| GB1261803A (en) | 1972-01-26 |
Similar Documents
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| ST | Notification of lapse |