CN1703327B - 由印刷电路板剥离银的方法 - Google Patents
由印刷电路板剥离银的方法 Download PDFInfo
- Publication number
- CN1703327B CN1703327B CN038066629A CN03806662A CN1703327B CN 1703327 B CN1703327 B CN 1703327B CN 038066629 A CN038066629 A CN 038066629A CN 03806662 A CN03806662 A CN 03806662A CN 1703327 B CN1703327 B CN 1703327B
- Authority
- CN
- China
- Prior art keywords
- silver
- printed circuit
- circuit board
- pcb
- plating
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 229910052709 silver Inorganic materials 0.000 title claims abstract description 35
- 239000004332 silver Substances 0.000 title claims abstract description 35
- 238000000034 method Methods 0.000 title claims abstract description 30
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims abstract description 33
- XFXPMWWXUTWYJX-UHFFFAOYSA-N Cyanide Chemical compound N#[C-] XFXPMWWXUTWYJX-UHFFFAOYSA-N 0.000 claims abstract description 9
- 239000010953 base metal Substances 0.000 claims abstract description 8
- 239000007800 oxidant agent Substances 0.000 claims abstract description 7
- 239000002904 solvent Substances 0.000 claims abstract description 7
- 238000007747 plating Methods 0.000 claims description 27
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 9
- 229910052802 copper Inorganic materials 0.000 claims description 9
- 239000010949 copper Substances 0.000 claims description 9
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 6
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical group [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 claims description 6
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 claims description 6
- 239000003795 chemical substances by application Substances 0.000 claims description 6
- 230000003750 conditioning effect Effects 0.000 claims description 6
- 238000006386 neutralization reaction Methods 0.000 claims description 5
- 230000001590 oxidative effect Effects 0.000 claims description 4
- KZNICNPSHKQLFF-UHFFFAOYSA-N succinimide Chemical group O=C1CCC(=O)N1 KZNICNPSHKQLFF-UHFFFAOYSA-N 0.000 claims description 4
- 235000011114 ammonium hydroxide Nutrition 0.000 claims description 3
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 3
- 229910052737 gold Inorganic materials 0.000 claims description 3
- 239000010931 gold Substances 0.000 claims description 3
- 229910052759 nickel Inorganic materials 0.000 claims description 3
- ATRRKUHOCOJYRX-UHFFFAOYSA-N Ammonium bicarbonate Chemical compound [NH4+].OC([O-])=O ATRRKUHOCOJYRX-UHFFFAOYSA-N 0.000 claims description 2
- 239000001099 ammonium carbonate Substances 0.000 claims description 2
- 235000012501 ammonium carbonate Nutrition 0.000 claims description 2
- 239000012286 potassium permanganate Substances 0.000 claims description 2
- 229960002317 succinimide Drugs 0.000 claims description 2
- ZCDOYSPFYFSLEW-UHFFFAOYSA-N chromate(2-) Chemical compound [O-][Cr]([O-])(=O)=O ZCDOYSPFYFSLEW-UHFFFAOYSA-N 0.000 abstract description 3
- 230000003472 neutralizing effect Effects 0.000 abstract 1
- 239000003002 pH adjusting agent Substances 0.000 abstract 1
- 150000003378 silver Chemical class 0.000 abstract 1
- 239000002689 soil Substances 0.000 abstract 1
- 238000003466 welding Methods 0.000 description 10
- 239000000126 substance Substances 0.000 description 7
- 229910052751 metal Inorganic materials 0.000 description 6
- 239000002184 metal Substances 0.000 description 6
- 239000003153 chemical reaction reagent Substances 0.000 description 5
- 238000007598 dipping method Methods 0.000 description 5
- 239000000203 mixture Substances 0.000 description 5
- 239000000758 substrate Substances 0.000 description 5
- ZLMJMSJWJFRBEC-UHFFFAOYSA-N Potassium Chemical compound [K] ZLMJMSJWJFRBEC-UHFFFAOYSA-N 0.000 description 3
- KWYUFKZDYYNOTN-UHFFFAOYSA-M Potassium hydroxide Chemical compound [OH-].[K+] KWYUFKZDYYNOTN-UHFFFAOYSA-M 0.000 description 3
- 239000002253 acid Substances 0.000 description 3
- 230000009286 beneficial effect Effects 0.000 description 3
- 239000011248 coating agent Substances 0.000 description 3
- 238000000576 coating method Methods 0.000 description 3
- 229910052700 potassium Inorganic materials 0.000 description 3
- 239000011591 potassium Substances 0.000 description 3
- JYLNVJYYQQXNEK-UHFFFAOYSA-N 3-amino-2-(4-chlorophenyl)-1-propanesulfonic acid Chemical compound OS(=O)(=O)CC(CN)C1=CC=C(Cl)C=C1 JYLNVJYYQQXNEK-UHFFFAOYSA-N 0.000 description 2
- QGZKDVFQNNGYKY-UHFFFAOYSA-O Ammonium Chemical compound [NH4+] QGZKDVFQNNGYKY-UHFFFAOYSA-O 0.000 description 2
- 239000011469 building brick Substances 0.000 description 2
- 230000008021 deposition Effects 0.000 description 2
- 238000005868 electrolysis reaction Methods 0.000 description 2
- LQNUZADURLCDLV-UHFFFAOYSA-N nitrobenzene Chemical compound [O-][N+](=O)C1=CC=CC=C1 LQNUZADURLCDLV-UHFFFAOYSA-N 0.000 description 2
- 230000000737 periodic effect Effects 0.000 description 2
- BZSXEZOLBIJVQK-UHFFFAOYSA-N 2-methylsulfonylbenzoic acid Chemical compound CS(=O)(=O)C1=CC=CC=C1C(O)=O BZSXEZOLBIJVQK-UHFFFAOYSA-N 0.000 description 1
- CMWKITSNTDAEDT-UHFFFAOYSA-N 2-nitrobenzaldehyde Chemical compound [O-][N+](=O)C1=CC=CC=C1C=O CMWKITSNTDAEDT-UHFFFAOYSA-N 0.000 description 1
- SLAMLWHELXOEJZ-UHFFFAOYSA-N 2-nitrobenzoic acid Chemical compound OC(=O)C1=CC=CC=C1[N+]([O-])=O SLAMLWHELXOEJZ-UHFFFAOYSA-N 0.000 description 1
- VHUUQVKOLVNVRT-UHFFFAOYSA-N Ammonium hydroxide Chemical compound [NH4+].[OH-] VHUUQVKOLVNVRT-UHFFFAOYSA-N 0.000 description 1
- LSNNMFCWUKXFEE-UHFFFAOYSA-M Bisulfite Chemical compound OS([O-])=O LSNNMFCWUKXFEE-UHFFFAOYSA-M 0.000 description 1
- PIICEJLVQHRZGT-UHFFFAOYSA-N Ethylenediamine Chemical compound NCCN PIICEJLVQHRZGT-UHFFFAOYSA-N 0.000 description 1
- 238000006424 Flood reaction Methods 0.000 description 1
- FOIXSVOLVBLSDH-UHFFFAOYSA-N Silver ion Chemical compound [Ag+] FOIXSVOLVBLSDH-UHFFFAOYSA-N 0.000 description 1
- 230000004913 activation Effects 0.000 description 1
- 239000003513 alkali Substances 0.000 description 1
- 229910052784 alkaline earth metal Inorganic materials 0.000 description 1
- 150000001342 alkaline earth metals Chemical class 0.000 description 1
- 239000000908 ammonium hydroxide Substances 0.000 description 1
- 238000005844 autocatalytic reaction Methods 0.000 description 1
- 238000004061 bleaching Methods 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 238000006073 displacement reaction Methods 0.000 description 1
- 238000009713 electroplating Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000005562 fading Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-M hydroxide Chemical compound [OH-] XLYOFNOQVPJJNP-UHFFFAOYSA-M 0.000 description 1
- 230000002401 inhibitory effect Effects 0.000 description 1
- 230000005764 inhibitory process Effects 0.000 description 1
- 238000002386 leaching Methods 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 150000007522 mineralic acids Chemical class 0.000 description 1
- 150000002828 nitro derivatives Chemical class 0.000 description 1
- 125000004971 nitroalkyl group Chemical group 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 231100000614 poison Toxicity 0.000 description 1
- 230000007096 poisonous effect Effects 0.000 description 1
- 238000011084 recovery Methods 0.000 description 1
- 229940100890 silver compound Drugs 0.000 description 1
- 150000003379 silver compounds Chemical class 0.000 description 1
- UKLNMMHNWFDKNT-UHFFFAOYSA-M sodium chlorite Chemical compound [Na+].[O-]Cl=O UKLNMMHNWFDKNT-UHFFFAOYSA-M 0.000 description 1
- 229960002218 sodium chlorite Drugs 0.000 description 1
- 238000009736 wetting Methods 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
- C23F1/00—Etching metallic material by chemical means
- C23F1/10—Etching compositions
- C23F1/14—Aqueous compositions
- C23F1/32—Alkaline compositions
- C23F1/40—Alkaline compositions for etching other metallic material
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
- C23F1/00—Etching metallic material by chemical means
- C23F1/44—Compositions for etching metallic material from a metallic material substrate of different composition
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
- H05K3/067—Etchants
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/03—Metal processing
- H05K2203/0361—Stripping a part of an upper metal layer to expose a lower metal layer, e.g. by etching or using a laser
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
- H05K2203/0779—Treatments involving liquids, e.g. plating, rinsing characterised by the specific liquids involved
- H05K2203/0786—Using an aqueous solution, e.g. for cleaning or during drilling of holes
- H05K2203/0796—Oxidant in aqueous solution, e.g. permanganate
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing Of Printed Wiring (AREA)
- ing And Chemical Polishing (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US10/106,522 | 2002-03-25 | ||
| US10/106,522 US6783690B2 (en) | 2002-03-25 | 2002-03-25 | Method of stripping silver from a printed circuit board |
| PCT/US2003/004784 WO2003082605A1 (en) | 2002-03-25 | 2003-02-18 | Method of stripping silver from a printed circuit board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1703327A CN1703327A (zh) | 2005-11-30 |
| CN1703327B true CN1703327B (zh) | 2010-06-09 |
Family
ID=28452509
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN038066629A Expired - Fee Related CN1703327B (zh) | 2002-03-25 | 2003-02-18 | 由印刷电路板剥离银的方法 |
Country Status (8)
| Country | Link |
|---|---|
| US (1) | US6783690B2 (enExample) |
| EP (1) | EP1487646B1 (enExample) |
| JP (1) | JP3683896B2 (enExample) |
| CN (1) | CN1703327B (enExample) |
| AU (1) | AU2003217557A1 (enExample) |
| ES (1) | ES2410811T3 (enExample) |
| TW (1) | TWI256423B (enExample) |
| WO (1) | WO2003082605A1 (enExample) |
Families Citing this family (17)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4268515B2 (ja) * | 2003-12-26 | 2009-05-27 | 新光電気工業株式会社 | 電解剥離方法 |
| KR100712879B1 (ko) * | 2005-04-06 | 2007-04-30 | 주식회사 잉크테크 | 에칭액 조성물 |
| US20070232510A1 (en) * | 2006-03-29 | 2007-10-04 | Kucera Alvin A | Method and composition for selectively stripping silver from a substrate |
| DE112009000839T5 (de) * | 2008-04-10 | 2011-05-12 | World Properties, Inc., Lincolnwood | Schaltungsmaterialien mit verbesserter Bindung, Verfahren zur Herstellung hiervon und hieraus hergestellte Artikel |
| US8753561B2 (en) * | 2008-06-20 | 2014-06-17 | Baxter International Inc. | Methods for processing substrates comprising metallic nanoparticles |
| US8178120B2 (en) * | 2008-06-20 | 2012-05-15 | Baxter International Inc. | Methods for processing substrates having an antimicrobial coating |
| US8277826B2 (en) | 2008-06-25 | 2012-10-02 | Baxter International Inc. | Methods for making antimicrobial resins |
| US20090324738A1 (en) * | 2008-06-30 | 2009-12-31 | Baxter International Inc. | Methods for making antimicrobial coatings |
| US20100227052A1 (en) * | 2009-03-09 | 2010-09-09 | Baxter International Inc. | Methods for processing substrates having an antimicrobial coating |
| KR101701537B1 (ko) * | 2009-05-08 | 2017-02-01 | 바스프 에스이 | 루테늄 비롯한 귀금속의 화학적 기계적 평탄화를 위한 산화 입자계 슬러리 |
| CN103237419B (zh) * | 2013-04-22 | 2016-04-20 | 胜华电子（惠阳）有限公司 | 一种化银线路板银面剥除方法 |
| WO2015095664A2 (en) | 2013-12-20 | 2015-06-25 | Greene Lyon Group, Inc. | Method and apparatus for recovery of noble metals, including recovery of noble metals from plated and/or filled scrap |
| WO2016210051A1 (en) | 2015-06-24 | 2016-12-29 | Greene Lyon Group, Inc. | Selective removal of noble metals using acidic fluids, including fluids containing nitrate ions |
| US20220151795A1 (en) | 2019-03-11 | 2022-05-19 | Shoulder Innovations, Inc. | Total reverse shoulder systems and methods |
| CN114074492B (zh) * | 2020-08-18 | 2024-06-25 | 光群雷射科技股份有限公司 | 去除转印滚轮的拆版线的方法 |
| TWI755229B (zh) * | 2020-12-30 | 2022-02-11 | 力橋國際有限公司 | 無氰之電解剝銀劑及電解剝銀方法 |
| CN113846326A (zh) * | 2021-09-23 | 2021-12-28 | 江苏富乐德半导体科技有限公司 | 一种陶瓷覆铜基板表面化学镀银退镀方法 |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3615950A (en) * | 1968-04-19 | 1971-10-26 | Philips Corp | Method of etching silver-tin-lead contacts on a nickel coated base |
| US4204013A (en) * | 1978-10-20 | 1980-05-20 | Oxy Metal Industries Corporation | Method for treating polymeric substrates prior to plating employing accelerating composition containing an alkyl amine |
| JPH07316845A (ja) | 1994-05-19 | 1995-12-05 | Hitachi Cable Ltd | 銀めっき部材の表面処理液 |
| US6126720A (en) * | 1997-06-16 | 2000-10-03 | Mitsubishi Materials Corporation | Method for smelting noble metal |
Family Cites Families (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3860423A (en) | 1973-08-24 | 1975-01-14 | Rca Corp | Etching solution for silver |
| US4448637A (en) | 1981-12-28 | 1984-05-15 | Daicel Chemical Industries, Ltd. | Etching method of conductive film |
| US4960490A (en) | 1983-06-13 | 1990-10-02 | Minnesota Mining And Manufacturing Company | Method of making multiple-connector adhesive tape |
| US5002649A (en) | 1988-03-28 | 1991-03-26 | Sifco Industries, Inc. | Selective stripping apparatus |
| JPH03232980A (ja) * | 1990-02-06 | 1991-10-16 | Shinko Electric Ind Co Ltd | 銅もしくは銅合金上の銀剥離液 |
| DE4031609A1 (de) | 1990-03-16 | 1991-09-19 | Kodak Ag | Verfahren und vorrichtung zur aufbereitung von fluessigen rueckstaenden aus photographischen prozessen |
| USH1136H (en) | 1991-11-29 | 1993-02-02 | The United States Of America As Represented By The Secretary Of The Air Force | Electrolytic deposition and recovery of silver |
| US5611905A (en) * | 1995-06-09 | 1997-03-18 | Shipley Company, L.L.C. | Electroplating process |
| US6200451B1 (en) | 1996-03-22 | 2001-03-13 | Macdermid, Incorporated | Method for enhancing the solderability of a surface |
| TW385375B (en) * | 1996-07-26 | 2000-03-21 | Asahi Glass Co Ltd | Transparent conductive film and forming method for transparent electrode |
| US6238592B1 (en) | 1999-03-10 | 2001-05-29 | 3M Innovative Properties Company | Working liquids and methods for modifying structured wafers suited for semiconductor fabrication |
-
2002
- 2002-03-25 US US10/106,522 patent/US6783690B2/en not_active Expired - Lifetime
-
2003
- 2003-02-18 CN CN038066629A patent/CN1703327B/zh not_active Expired - Fee Related
- 2003-02-18 EP EP03713509.2A patent/EP1487646B1/en not_active Expired - Lifetime
- 2003-02-18 WO PCT/US2003/004784 patent/WO2003082605A1/en not_active Ceased
- 2003-02-18 JP JP2003580104A patent/JP3683896B2/ja not_active Expired - Lifetime
- 2003-02-18 ES ES03713509T patent/ES2410811T3/es not_active Expired - Lifetime
- 2003-02-18 AU AU2003217557A patent/AU2003217557A1/en not_active Abandoned
- 2003-02-27 TW TW092104260A patent/TWI256423B/zh not_active IP Right Cessation
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3615950A (en) * | 1968-04-19 | 1971-10-26 | Philips Corp | Method of etching silver-tin-lead contacts on a nickel coated base |
| US4204013A (en) * | 1978-10-20 | 1980-05-20 | Oxy Metal Industries Corporation | Method for treating polymeric substrates prior to plating employing accelerating composition containing an alkyl amine |
| JPH07316845A (ja) | 1994-05-19 | 1995-12-05 | Hitachi Cable Ltd | 銀めっき部材の表面処理液 |
| US6126720A (en) * | 1997-06-16 | 2000-10-03 | Mitsubishi Materials Corporation | Method for smelting noble metal |
Also Published As
| Publication number | Publication date |
|---|---|
| ES2410811T3 (es) | 2013-07-03 |
| JP3683896B2 (ja) | 2005-08-17 |
| TW200304507A (en) | 2003-10-01 |
| AU2003217557A1 (en) | 2003-10-13 |
| WO2003082605A1 (en) | 2003-10-09 |
| EP1487646A4 (en) | 2010-01-13 |
| EP1487646A1 (en) | 2004-12-22 |
| US20030183598A1 (en) | 2003-10-02 |
| TWI256423B (en) | 2006-06-11 |
| EP1487646B1 (en) | 2013-05-22 |
| JP2005520936A (ja) | 2005-07-14 |
| US6783690B2 (en) | 2004-08-31 |
| CN1703327A (zh) | 2005-11-30 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20100609 Termination date: 20220218 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |