TWI256423B - Method of stripping silver from a printed circuit boatd - Google Patents

Method of stripping silver from a printed circuit boatd

Info

Publication number
TWI256423B
TWI256423B TW092104260A TW92104260A TWI256423B TW I256423 B TWI256423 B TW I256423B TW 092104260 A TW092104260 A TW 092104260A TW 92104260 A TW92104260 A TW 92104260A TW I256423 B TWI256423 B TW I256423B
Authority
TW
Taiwan
Prior art keywords
printed circuit
silver
stripping
circuit board
boatd
Prior art date
Application number
TW092104260A
Other languages
English (en)
Chinese (zh)
Other versions
TW200304507A (en
Inventor
Donna M Kologe
Raymond A Letize
Brian Larson
Original Assignee
Macdermid Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Macdermid Inc filed Critical Macdermid Inc
Publication of TW200304507A publication Critical patent/TW200304507A/zh
Application granted granted Critical
Publication of TWI256423B publication Critical patent/TWI256423B/zh

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
    • C23F1/00—Etching metallic material by chemical means
    • C23F1/10—Etching compositions
    • C23F1/14—Aqueous compositions
    • C23F1/32—Alkaline compositions
    • C23F1/40—Alkaline compositions for etching other metallic material
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
    • C23F1/00—Etching metallic material by chemical means
    • C23F1/44—Compositions for etching metallic material from a metallic material substrate of different composition
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • H05K3/067—Etchants
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/03—Metal processing
    • H05K2203/0361—Stripping a part of an upper metal layer to expose a lower metal layer, e.g. by etching or using a laser
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0779—Treatments involving liquids, e.g. plating, rinsing characterised by the specific liquids involved
    • H05K2203/0786—Using an aqueous solution, e.g. for cleaning or during drilling of holes
    • H05K2203/0796—Oxidant in aqueous solution, e.g. permanganate

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • ing And Chemical Polishing (AREA)
TW092104260A 2002-03-25 2003-02-27 Method of stripping silver from a printed circuit boatd TWI256423B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US10/106,522 US6783690B2 (en) 2002-03-25 2002-03-25 Method of stripping silver from a printed circuit board

Publications (2)

Publication Number Publication Date
TW200304507A TW200304507A (en) 2003-10-01
TWI256423B true TWI256423B (en) 2006-06-11

Family

ID=28452509

Family Applications (1)

Application Number Title Priority Date Filing Date
TW092104260A TWI256423B (en) 2002-03-25 2003-02-27 Method of stripping silver from a printed circuit boatd

Country Status (8)

Country Link
US (1) US6783690B2 (enExample)
EP (1) EP1487646B1 (enExample)
JP (1) JP3683896B2 (enExample)
CN (1) CN1703327B (enExample)
AU (1) AU2003217557A1 (enExample)
ES (1) ES2410811T3 (enExample)
TW (1) TWI256423B (enExample)
WO (1) WO2003082605A1 (enExample)

Families Citing this family (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4268515B2 (ja) * 2003-12-26 2009-05-27 新光電気工業株式会社 電解剥離方法
KR100712879B1 (ko) * 2005-04-06 2007-04-30 주식회사 잉크테크 에칭액 조성물
US20070232510A1 (en) * 2006-03-29 2007-10-04 Kucera Alvin A Method and composition for selectively stripping silver from a substrate
DE112009000839T5 (de) * 2008-04-10 2011-05-12 World Properties, Inc., Lincolnwood Schaltungsmaterialien mit verbesserter Bindung, Verfahren zur Herstellung hiervon und hieraus hergestellte Artikel
US8753561B2 (en) * 2008-06-20 2014-06-17 Baxter International Inc. Methods for processing substrates comprising metallic nanoparticles
US8178120B2 (en) * 2008-06-20 2012-05-15 Baxter International Inc. Methods for processing substrates having an antimicrobial coating
US8277826B2 (en) 2008-06-25 2012-10-02 Baxter International Inc. Methods for making antimicrobial resins
US20090324738A1 (en) * 2008-06-30 2009-12-31 Baxter International Inc. Methods for making antimicrobial coatings
US20100227052A1 (en) * 2009-03-09 2010-09-09 Baxter International Inc. Methods for processing substrates having an antimicrobial coating
KR101701537B1 (ko) * 2009-05-08 2017-02-01 바스프 에스이 루테늄 비롯한 귀금속의 화학적 기계적 평탄화를 위한 산화 입자계 슬러리
CN103237419B (zh) * 2013-04-22 2016-04-20 胜华电子（惠阳）有限公司 一种化银线路板银面剥除方法
WO2015095664A2 (en) 2013-12-20 2015-06-25 Greene Lyon Group, Inc. Method and apparatus for recovery of noble metals, including recovery of noble metals from plated and/or filled scrap
WO2016210051A1 (en) 2015-06-24 2016-12-29 Greene Lyon Group, Inc. Selective removal of noble metals using acidic fluids, including fluids containing nitrate ions
US20220151795A1 (en) 2019-03-11 2022-05-19 Shoulder Innovations, Inc. Total reverse shoulder systems and methods
CN114074492B (zh) * 2020-08-18 2024-06-25 光群雷射科技股份有限公司 去除转印滚轮的拆版线的方法
TWI755229B (zh) * 2020-12-30 2022-02-11 力橋國際有限公司 無氰之電解剝銀劑及電解剝銀方法
CN113846326A (zh) * 2021-09-23 2021-12-28 江苏富乐德半导体科技有限公司 一种陶瓷覆铜基板表面化学镀银退镀方法

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR1583955A (enExample) * 1968-04-19 1969-12-12
US3860423A (en) 1973-08-24 1975-01-14 Rca Corp Etching solution for silver
US4204013A (en) 1978-10-20 1980-05-20 Oxy Metal Industries Corporation Method for treating polymeric substrates prior to plating employing accelerating composition containing an alkyl amine
US4448637A (en) 1981-12-28 1984-05-15 Daicel Chemical Industries, Ltd. Etching method of conductive film
US4960490A (en) 1983-06-13 1990-10-02 Minnesota Mining And Manufacturing Company Method of making multiple-connector adhesive tape
US5002649A (en) 1988-03-28 1991-03-26 Sifco Industries, Inc. Selective stripping apparatus
JPH03232980A (ja) * 1990-02-06 1991-10-16 Shinko Electric Ind Co Ltd 銅もしくは銅合金上の銀剥離液
DE4031609A1 (de) 1990-03-16 1991-09-19 Kodak Ag Verfahren und vorrichtung zur aufbereitung von fluessigen rueckstaenden aus photographischen prozessen
USH1136H (en) 1991-11-29 1993-02-02 The United States Of America As Represented By The Secretary Of The Air Force Electrolytic deposition and recovery of silver
JPH07316845A (ja) * 1994-05-19 1995-12-05 Hitachi Cable Ltd 銀めっき部材の表面処理液
US5611905A (en) * 1995-06-09 1997-03-18 Shipley Company, L.L.C. Electroplating process
US6200451B1 (en) 1996-03-22 2001-03-13 Macdermid, Incorporated Method for enhancing the solderability of a surface
TW385375B (en) * 1996-07-26 2000-03-21 Asahi Glass Co Ltd Transparent conductive film and forming method for transparent electrode
US6126720A (en) 1997-06-16 2000-10-03 Mitsubishi Materials Corporation Method for smelting noble metal
US6238592B1 (en) 1999-03-10 2001-05-29 3M Innovative Properties Company Working liquids and methods for modifying structured wafers suited for semiconductor fabrication

Also Published As

Publication number Publication date
ES2410811T3 (es) 2013-07-03
JP3683896B2 (ja) 2005-08-17
TW200304507A (en) 2003-10-01
AU2003217557A1 (en) 2003-10-13
WO2003082605A1 (en) 2003-10-09
EP1487646A4 (en) 2010-01-13
EP1487646A1 (en) 2004-12-22
CN1703327B (zh) 2010-06-09
US20030183598A1 (en) 2003-10-02
EP1487646B1 (en) 2013-05-22
JP2005520936A (ja) 2005-07-14
US6783690B2 (en) 2004-08-31
CN1703327A (zh) 2005-11-30

Similar Documents

Publication Publication Date Title
TWI256423B (en) Method of stripping silver from a printed circuit boatd
AU4181996A (en) Printed circuit board manufacture
EP1043408A3 (en) Processes and apparatus for recovery and removal of copper from fluids
DE69842001D1 (de) Galvanisches verfahren zur herstellung einer mehrlagenstruktur
MXPA03000526A (es) Metodo y sistema de prevencion de bioincrustacion y corrosion de dispositivos biomedicos y estructuras.
FR2536623B1 (fr) Procede de nettoyage de trous de plaquettes de circuits imprimes utilisant des solutions de traitement caustiques a base d'un permanganate
GB0426693D0 (en) Message processing based on address patterns and automated management and control of contact aliases
EP1643817A4 (en) RESIN SOLUTION, PAINT PROCESSING AND PCB
DE60117669D1 (de) Weichlot, Oberflächenbehandlungsverfahren von Leiterplatten und Verfahren zum Montieren eines elektronischen Bauteils
EP1403922A3 (en) Combined member of aluminum-ceramics
ATE51422T1 (de) Hochkonzentrierte natriumpermanganatloesung und ihre anwendung beim entgraten und/oder aetzen gedruckter schaltungen.
DE60210135D1 (de) Elektronischer schaltungsmodul und verfahren zu dessen bestückung
WO2004022814A3 (en) Device and method for electrolytically treating an at least superficially electrically conducting work piece
SG108908A1 (en) Production method of printed circuit board
MY145344A (en) Galvanic process for filling through-holes with metals, in particular of printed circuit boards with copper
ATE287111T1 (de) Tragbare vorrichtung mit einer integrierten schaltung und verfahren zum herstellen derselben
TW200615712A (en) Removing apparatus, protective film forming apparatus, substrate processing system and removing method
AU5253899A (en) A printed circuit board, biosensor and method of using same
GB2361714B (en) Copper foil for printed circuit boards and its surface treatment method
TWI256865B (en) Printed wiring board, electronic component mounting method, and electronic apparatus
TW200516177A (en) Improved methods of cleaning copper surfaces in the manufacture of printed circuit boards
ATE411415T1 (de) Einrichtung zur behandlung von gegenständen, insbesondere galvanisierung für leiterplatten
TW200730670A (en) Method of using ultrasonics to plate silver
EP1009203A3 (en) Methods for manufacture of electronic devices
DK0839440T3 (da) Kobberfolie til fremstilling af trykte kredsløb og fremgangsmåde til fremstilling af samme

Legal Events

Date Code Title Description
MK4A Expiration of patent term of an invention patent