TWI256423B - Method of stripping silver from a printed circuit boatd - Google Patents

Method of stripping silver from a printed circuit boatd

Info

Publication number
TWI256423B
TWI256423B TW092104260A TW92104260A TWI256423B TW I256423 B TWI256423 B TW I256423B TW 092104260 A TW092104260 A TW 092104260A TW 92104260 A TW92104260 A TW 92104260A TW I256423 B TWI256423 B TW I256423B
Authority
TW
Taiwan
Prior art keywords
printed circuit
silver
stripping
circuit board
boatd
Prior art date
Application number
TW092104260A
Other languages
English (en)
Other versions
TW200304507A (en
Inventor
Donna M Kologe
Raymond A Letize
Brian Larson
Original Assignee
Macdermid Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Macdermid Inc filed Critical Macdermid Inc
Publication of TW200304507A publication Critical patent/TW200304507A/zh
Application granted granted Critical
Publication of TWI256423B publication Critical patent/TWI256423B/zh

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
    • C23F1/00—Etching metallic material by chemical means
    • C23F1/10—Etching compositions
    • C23F1/14—Aqueous compositions
    • C23F1/32—Alkaline compositions
    • C23F1/40—Alkaline compositions for etching other metallic material
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
    • C23F1/00—Etching metallic material by chemical means
    • C23F1/44—Compositions for etching metallic material from a metallic material substrate of different composition
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • H05K3/067—Etchants
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/03—Metal processing
    • H05K2203/0361—Stripping a part of an upper metal layer to expose a lower metal layer, e.g. by etching or using a laser
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0779—Treatments involving liquids, e.g. plating, rinsing characterised by the specific liquids involved
    • H05K2203/0786—Using an aqueous solution, e.g. for cleaning or during drilling of holes
    • H05K2203/0796—Oxidant in aqueous solution, e.g. permanganate

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • ing And Chemical Polishing (AREA)
TW092104260A 2002-03-25 2003-02-27 Method of stripping silver from a printed circuit boatd TWI256423B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US10/106,522 US6783690B2 (en) 2002-03-25 2002-03-25 Method of stripping silver from a printed circuit board

Publications (2)

Publication Number Publication Date
TW200304507A TW200304507A (en) 2003-10-01
TWI256423B true TWI256423B (en) 2006-06-11

Family

ID=28452509

Family Applications (1)

Application Number Title Priority Date Filing Date
TW092104260A TWI256423B (en) 2002-03-25 2003-02-27 Method of stripping silver from a printed circuit boatd

Country Status (8)

Country Link
US (1) US6783690B2 (zh)
EP (1) EP1487646B1 (zh)
JP (1) JP3683896B2 (zh)
CN (1) CN1703327B (zh)
AU (1) AU2003217557A1 (zh)
ES (1) ES2410811T3 (zh)
TW (1) TWI256423B (zh)
WO (1) WO2003082605A1 (zh)

Families Citing this family (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4268515B2 (ja) * 2003-12-26 2009-05-27 新光電気工業株式会社 電解剥離方法
KR100712879B1 (ko) * 2005-04-06 2007-04-30 주식회사 잉크테크 에칭액 조성물
US20070232510A1 (en) * 2006-03-29 2007-10-04 Kucera Alvin A Method and composition for selectively stripping silver from a substrate
GB2472702A (en) * 2008-04-10 2011-02-16 World Properties Inc Circuit materials with improved bond, method of manufacture thereof, and articles formed therefrom
US8178120B2 (en) * 2008-06-20 2012-05-15 Baxter International Inc. Methods for processing substrates having an antimicrobial coating
US8753561B2 (en) * 2008-06-20 2014-06-17 Baxter International Inc. Methods for processing substrates comprising metallic nanoparticles
US8277826B2 (en) * 2008-06-25 2012-10-02 Baxter International Inc. Methods for making antimicrobial resins
US20090324738A1 (en) * 2008-06-30 2009-12-31 Baxter International Inc. Methods for making antimicrobial coatings
US20100227052A1 (en) * 2009-03-09 2010-09-09 Baxter International Inc. Methods for processing substrates having an antimicrobial coating
EP2427524B1 (en) * 2009-05-08 2013-07-17 Basf Se Oxidizing particles based slurry for nobel metal including ruthenium chemical mechanical planarization
CN103237419B (zh) * 2013-04-22 2016-04-20 胜华电子（惠阳）有限公司 一种化银线路板银面剥除方法
EP3083016B1 (en) 2013-12-20 2020-07-29 Greene Lyon Group Inc. Method and apparatus for recovery of noble metals, including recovery of noble metals from plated and/or filled scrap
JP2018524480A (ja) 2015-06-24 2018-08-30 グリーン リヨン グループ, インコーポレーテッドGreene Lyon Group, Inc. 硝酸イオン含有流体を包含する酸性流体を用いる貴金属の選択的取り出し関連出願
AU2020237088A1 (en) 2019-03-11 2021-10-07 Shoulder Innovations, Inc. Total reverse shoulder systems and methods
CN114074492B (zh) * 2020-08-18 2024-06-25 光群雷射科技股份有限公司 去除转印滚轮的拆版线的方法
TWI755229B (zh) * 2020-12-30 2022-02-11 力橋國際有限公司 無氰之電解剝銀劑及電解剝銀方法
CN113846326A (zh) * 2021-09-23 2021-12-28 江苏富乐德半导体科技有限公司 一种陶瓷覆铜基板表面化学镀银退镀方法

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR1583955A (zh) * 1968-04-19 1969-12-12
US3860423A (en) 1973-08-24 1975-01-14 Rca Corp Etching solution for silver
US4204013A (en) 1978-10-20 1980-05-20 Oxy Metal Industries Corporation Method for treating polymeric substrates prior to plating employing accelerating composition containing an alkyl amine
US4448637A (en) 1981-12-28 1984-05-15 Daicel Chemical Industries, Ltd. Etching method of conductive film
US4960490A (en) 1983-06-13 1990-10-02 Minnesota Mining And Manufacturing Company Method of making multiple-connector adhesive tape
US5002649A (en) 1988-03-28 1991-03-26 Sifco Industries, Inc. Selective stripping apparatus
JPH03232980A (ja) * 1990-02-06 1991-10-16 Shinko Electric Ind Co Ltd 銅もしくは銅合金上の銀剥離液
DE4031609A1 (de) 1990-03-16 1991-09-19 Kodak Ag Verfahren und vorrichtung zur aufbereitung von fluessigen rueckstaenden aus photographischen prozessen
USH1136H (en) 1991-11-29 1993-02-02 The United States Of America As Represented By The Secretary Of The Air Force Electrolytic deposition and recovery of silver
JPH07316845A (ja) * 1994-05-19 1995-12-05 Hitachi Cable Ltd 銀めっき部材の表面処理液
US5611905A (en) * 1995-06-09 1997-03-18 Shipley Company, L.L.C. Electroplating process
US6200451B1 (en) 1996-03-22 2001-03-13 Macdermid, Incorporated Method for enhancing the solderability of a surface
TW385375B (en) * 1996-07-26 2000-03-21 Asahi Glass Co Ltd Transparent conductive film and forming method for transparent electrode
JP3879126B2 (ja) 1997-06-16 2007-02-07 三菱マテリアル株式会社 貴金属製錬方法
US6238592B1 (en) 1999-03-10 2001-05-29 3M Innovative Properties Company Working liquids and methods for modifying structured wafers suited for semiconductor fabrication

Also Published As

Publication number Publication date
WO2003082605A1 (en) 2003-10-09
CN1703327B (zh) 2010-06-09
EP1487646A1 (en) 2004-12-22
AU2003217557A1 (en) 2003-10-13
CN1703327A (zh) 2005-11-30
JP3683896B2 (ja) 2005-08-17
EP1487646A4 (en) 2010-01-13
US6783690B2 (en) 2004-08-31
JP2005520936A (ja) 2005-07-14
EP1487646B1 (en) 2013-05-22
TW200304507A (en) 2003-10-01
US20030183598A1 (en) 2003-10-02
ES2410811T3 (es) 2013-07-03

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Legal Events

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MK4A Expiration of patent term of an invention patent