JP3683896B2 - プリント配線基板からの銀メッキ剥離方法 - Google Patents

プリント配線基板からの銀メッキ剥離方法 Download PDF

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Publication number
JP3683896B2
JP3683896B2 JP2003580104A JP2003580104A JP3683896B2 JP 3683896 B2 JP3683896 B2 JP 3683896B2 JP 2003580104 A JP2003580104 A JP 2003580104A JP 2003580104 A JP2003580104 A JP 2003580104A JP 3683896 B2 JP3683896 B2 JP 3683896B2
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JP
Japan
Prior art keywords
silver plating
silver
printed wiring
wiring board
peeling method
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP2003580104A
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English (en)
Japanese (ja)
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JP2005520936A5 (enExample
JP2005520936A (ja
Inventor
ドナ エム コログ
レイモンド エー レティズ
ブライアン ラーソン
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
MacDermid Inc
Original Assignee
MacDermid Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by MacDermid Inc filed Critical MacDermid Inc
Publication of JP2005520936A publication Critical patent/JP2005520936A/ja
Application granted granted Critical
Publication of JP3683896B2 publication Critical patent/JP3683896B2/ja
Publication of JP2005520936A5 publication Critical patent/JP2005520936A5/ja
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Expired - Lifetime legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
    • C23F1/00—Etching metallic material by chemical means
    • C23F1/10—Etching compositions
    • C23F1/14—Aqueous compositions
    • C23F1/32—Alkaline compositions
    • C23F1/40—Alkaline compositions for etching other metallic material
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
    • C23F1/00—Etching metallic material by chemical means
    • C23F1/44—Compositions for etching metallic material from a metallic material substrate of different composition
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • H05K3/067—Etchants
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/03—Metal processing
    • H05K2203/0361—Stripping a part of an upper metal layer to expose a lower metal layer, e.g. by etching or using a laser
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0779—Treatments involving liquids, e.g. plating, rinsing characterised by the specific liquids involved
    • H05K2203/0786—Using an aqueous solution, e.g. for cleaning or during drilling of holes
    • H05K2203/0796—Oxidant in aqueous solution, e.g. permanganate

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • ing And Chemical Polishing (AREA)
JP2003580104A 2002-03-25 2003-02-18 プリント配線基板からの銀メッキ剥離方法 Expired - Lifetime JP3683896B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US10/106,522 2002-03-25
US10/106,522 US6783690B2 (en) 2002-03-25 2002-03-25 Method of stripping silver from a printed circuit board
PCT/US2003/004784 WO2003082605A1 (en) 2002-03-25 2003-02-18 Method of stripping silver from a printed circuit board

Publications (3)

Publication Number Publication Date
JP2005520936A JP2005520936A (ja) 2005-07-14
JP3683896B2 true JP3683896B2 (ja) 2005-08-17
JP2005520936A5 JP2005520936A5 (enExample) 2005-12-22

Family

ID=28452509

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2003580104A Expired - Lifetime JP3683896B2 (ja) 2002-03-25 2003-02-18 プリント配線基板からの銀メッキ剥離方法

Country Status (8)

Country Link
US (1) US6783690B2 (enExample)
EP (1) EP1487646B1 (enExample)
JP (1) JP3683896B2 (enExample)
CN (1) CN1703327B (enExample)
AU (1) AU2003217557A1 (enExample)
ES (1) ES2410811T3 (enExample)
TW (1) TWI256423B (enExample)
WO (1) WO2003082605A1 (enExample)

Families Citing this family (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4268515B2 (ja) * 2003-12-26 2009-05-27 新光電気工業株式会社 電解剥離方法
KR100712879B1 (ko) * 2005-04-06 2007-04-30 주식회사 잉크테크 에칭액 조성물
US20070232510A1 (en) * 2006-03-29 2007-10-04 Kucera Alvin A Method and composition for selectively stripping silver from a substrate
DE112009000839T5 (de) * 2008-04-10 2011-05-12 World Properties, Inc., Lincolnwood Schaltungsmaterialien mit verbesserter Bindung, Verfahren zur Herstellung hiervon und hieraus hergestellte Artikel
US8753561B2 (en) * 2008-06-20 2014-06-17 Baxter International Inc. Methods for processing substrates comprising metallic nanoparticles
US8178120B2 (en) * 2008-06-20 2012-05-15 Baxter International Inc. Methods for processing substrates having an antimicrobial coating
US8277826B2 (en) 2008-06-25 2012-10-02 Baxter International Inc. Methods for making antimicrobial resins
US20090324738A1 (en) * 2008-06-30 2009-12-31 Baxter International Inc. Methods for making antimicrobial coatings
US20100227052A1 (en) * 2009-03-09 2010-09-09 Baxter International Inc. Methods for processing substrates having an antimicrobial coating
KR101701537B1 (ko) * 2009-05-08 2017-02-01 바스프 에스이 루테늄 비롯한 귀금속의 화학적 기계적 평탄화를 위한 산화 입자계 슬러리
CN103237419B (zh) * 2013-04-22 2016-04-20 胜华电子（惠阳）有限公司 一种化银线路板银面剥除方法
WO2015095664A2 (en) 2013-12-20 2015-06-25 Greene Lyon Group, Inc. Method and apparatus for recovery of noble metals, including recovery of noble metals from plated and/or filled scrap
WO2016210051A1 (en) 2015-06-24 2016-12-29 Greene Lyon Group, Inc. Selective removal of noble metals using acidic fluids, including fluids containing nitrate ions
US20220151795A1 (en) 2019-03-11 2022-05-19 Shoulder Innovations, Inc. Total reverse shoulder systems and methods
CN114074492B (zh) * 2020-08-18 2024-06-25 光群雷射科技股份有限公司 去除转印滚轮的拆版线的方法
TWI755229B (zh) * 2020-12-30 2022-02-11 力橋國際有限公司 無氰之電解剝銀劑及電解剝銀方法
CN113846326A (zh) * 2021-09-23 2021-12-28 江苏富乐德半导体科技有限公司 一种陶瓷覆铜基板表面化学镀银退镀方法

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR1583955A (enExample) * 1968-04-19 1969-12-12
US3860423A (en) 1973-08-24 1975-01-14 Rca Corp Etching solution for silver
US4204013A (en) 1978-10-20 1980-05-20 Oxy Metal Industries Corporation Method for treating polymeric substrates prior to plating employing accelerating composition containing an alkyl amine
US4448637A (en) 1981-12-28 1984-05-15 Daicel Chemical Industries, Ltd. Etching method of conductive film
US4960490A (en) 1983-06-13 1990-10-02 Minnesota Mining And Manufacturing Company Method of making multiple-connector adhesive tape
US5002649A (en) 1988-03-28 1991-03-26 Sifco Industries, Inc. Selective stripping apparatus
JPH03232980A (ja) * 1990-02-06 1991-10-16 Shinko Electric Ind Co Ltd 銅もしくは銅合金上の銀剥離液
DE4031609A1 (de) 1990-03-16 1991-09-19 Kodak Ag Verfahren und vorrichtung zur aufbereitung von fluessigen rueckstaenden aus photographischen prozessen
USH1136H (en) 1991-11-29 1993-02-02 The United States Of America As Represented By The Secretary Of The Air Force Electrolytic deposition and recovery of silver
JPH07316845A (ja) * 1994-05-19 1995-12-05 Hitachi Cable Ltd 銀めっき部材の表面処理液
US5611905A (en) * 1995-06-09 1997-03-18 Shipley Company, L.L.C. Electroplating process
US6200451B1 (en) 1996-03-22 2001-03-13 Macdermid, Incorporated Method for enhancing the solderability of a surface
TW385375B (en) * 1996-07-26 2000-03-21 Asahi Glass Co Ltd Transparent conductive film and forming method for transparent electrode
US6126720A (en) 1997-06-16 2000-10-03 Mitsubishi Materials Corporation Method for smelting noble metal
US6238592B1 (en) 1999-03-10 2001-05-29 3M Innovative Properties Company Working liquids and methods for modifying structured wafers suited for semiconductor fabrication

Also Published As

Publication number Publication date
ES2410811T3 (es) 2013-07-03
TW200304507A (en) 2003-10-01
AU2003217557A1 (en) 2003-10-13
WO2003082605A1 (en) 2003-10-09
EP1487646A4 (en) 2010-01-13
EP1487646A1 (en) 2004-12-22
CN1703327B (zh) 2010-06-09
US20030183598A1 (en) 2003-10-02
TWI256423B (en) 2006-06-11
EP1487646B1 (en) 2013-05-22
JP2005520936A (ja) 2005-07-14
US6783690B2 (en) 2004-08-31
CN1703327A (zh) 2005-11-30

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