ES2410811T3 - Método para separar plata de una tarjeta de circuito impreso - Google Patents
Método para separar plata de una tarjeta de circuito impreso Download PDFInfo
- Publication number
- ES2410811T3 ES2410811T3 ES03713509T ES03713509T ES2410811T3 ES 2410811 T3 ES2410811 T3 ES 2410811T3 ES 03713509 T ES03713509 T ES 03713509T ES 03713509 T ES03713509 T ES 03713509T ES 2410811 T3 ES2410811 T3 ES 2410811T3
- Authority
- ES
- Spain
- Prior art keywords
- silver
- printed circuit
- circuit board
- solution
- sodium
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 229910052709 silver Inorganic materials 0.000 title claims abstract description 48
- 239000004332 silver Substances 0.000 title claims abstract description 48
- 238000000034 method Methods 0.000 title claims abstract description 26
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims abstract description 46
- 238000000926 separation method Methods 0.000 claims abstract description 25
- 239000002904 solvent Substances 0.000 claims abstract description 10
- KZNICNPSHKQLFF-UHFFFAOYSA-N succinimide Chemical group O=C1CCC(=O)N1 KZNICNPSHKQLFF-UHFFFAOYSA-N 0.000 claims abstract description 10
- 239000007800 oxidant agent Substances 0.000 claims abstract description 9
- 239000010953 base metal Substances 0.000 claims abstract description 8
- 239000003002 pH adjusting agent Substances 0.000 claims abstract description 7
- 239000012286 potassium permanganate Substances 0.000 claims abstract description 6
- 229960002317 succinimide Drugs 0.000 claims abstract description 5
- JYLNVJYYQQXNEK-UHFFFAOYSA-N 3-amino-2-(4-chlorophenyl)-1-propanesulfonic acid Chemical group OS(=O)(=O)CC(CN)C1=CC=C(Cl)C=C1 JYLNVJYYQQXNEK-UHFFFAOYSA-N 0.000 claims abstract description 4
- VKJKEPKFPUWCAS-UHFFFAOYSA-M potassium chlorate Chemical compound [K+].[O-]Cl(=O)=O VKJKEPKFPUWCAS-UHFFFAOYSA-M 0.000 claims abstract description 4
- VISKNDGJUCDNMS-UHFFFAOYSA-M potassium;chlorite Chemical compound [K+].[O-]Cl=O VISKNDGJUCDNMS-UHFFFAOYSA-M 0.000 claims abstract description 4
- BZSXEZOLBIJVQK-UHFFFAOYSA-N 2-methylsulfonylbenzoic acid Chemical compound CS(=O)(=O)C1=CC=CC=C1C(O)=O BZSXEZOLBIJVQK-UHFFFAOYSA-N 0.000 claims abstract description 3
- QGZKDVFQNNGYKY-UHFFFAOYSA-O Ammonium Chemical compound [NH4+] QGZKDVFQNNGYKY-UHFFFAOYSA-O 0.000 claims abstract description 3
- UKLNMMHNWFDKNT-UHFFFAOYSA-M sodium chlorite Chemical compound [Na+].[O-]Cl=O UKLNMMHNWFDKNT-UHFFFAOYSA-M 0.000 claims abstract description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 9
- 229910052802 copper Inorganic materials 0.000 claims description 9
- 239000010949 copper Substances 0.000 claims description 9
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 6
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical group [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 claims description 6
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 claims description 6
- 238000006386 neutralization reaction Methods 0.000 claims description 5
- QGZKDVFQNNGYKY-UHFFFAOYSA-N Ammonia Chemical compound N QGZKDVFQNNGYKY-UHFFFAOYSA-N 0.000 claims description 4
- ATRRKUHOCOJYRX-UHFFFAOYSA-N Ammonium bicarbonate Chemical compound [NH4+].OC([O-])=O ATRRKUHOCOJYRX-UHFFFAOYSA-N 0.000 claims description 4
- 239000001099 ammonium carbonate Substances 0.000 claims description 4
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 3
- 229910052737 gold Inorganic materials 0.000 claims description 3
- 239000010931 gold Substances 0.000 claims description 3
- 229910052759 nickel Inorganic materials 0.000 claims description 3
- ZNBNBTIDJSKEAM-UHFFFAOYSA-N 4-[7-hydroxy-2-[5-[5-[6-hydroxy-6-(hydroxymethyl)-3,5-dimethyloxan-2-yl]-3-methyloxolan-2-yl]-5-methyloxolan-2-yl]-2,8-dimethyl-1,10-dioxaspiro[4.5]decan-9-yl]-2-methyl-3-propanoyloxypentanoic acid Chemical compound C1C(O)C(C)C(C(C)C(OC(=O)CC)C(C)C(O)=O)OC11OC(C)(C2OC(C)(CC2)C2C(CC(O2)C2C(CC(C)C(O)(CO)O2)C)C)CC1 ZNBNBTIDJSKEAM-UHFFFAOYSA-N 0.000 claims description 2
- 229910000013 Ammonium bicarbonate Inorganic materials 0.000 claims description 2
- 229910021529 ammonia Inorganic materials 0.000 claims description 2
- 235000012538 ammonium bicarbonate Nutrition 0.000 claims description 2
- 235000012501 ammonium carbonate Nutrition 0.000 claims description 2
- 229910000378 hydroxylammonium sulfate Inorganic materials 0.000 claims description 2
- 230000003472 neutralizing effect Effects 0.000 abstract description 3
- 229960002218 sodium chlorite Drugs 0.000 abstract description 2
- 238000003466 welding Methods 0.000 description 13
- 230000008021 deposition Effects 0.000 description 10
- 238000007654 immersion Methods 0.000 description 6
- 229910052751 metal Inorganic materials 0.000 description 6
- 239000002184 metal Substances 0.000 description 6
- XFXPMWWXUTWYJX-UHFFFAOYSA-N Cyanide Chemical compound N#[C-] XFXPMWWXUTWYJX-UHFFFAOYSA-N 0.000 description 5
- 239000000203 mixture Substances 0.000 description 5
- 239000000126 substance Substances 0.000 description 5
- 239000000758 substrate Substances 0.000 description 5
- 239000002253 acid Substances 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 4
- DGAQECJNVWCQMB-PUAWFVPOSA-M Ilexoside XXIX Chemical compound C[C@@H]1CC[C@@]2(CC[C@@]3(C(=CC[C@H]4[C@]3(CC[C@@H]5[C@@]4(CC[C@@H](C5(C)C)OS(=O)(=O)[O-])C)C)[C@@H]2[C@]1(C)O)C)C(=O)O[C@H]6[C@@H]([C@H]([C@@H]([C@H](O6)CO)O)O)O.[Na+] DGAQECJNVWCQMB-PUAWFVPOSA-M 0.000 description 3
- KWYUFKZDYYNOTN-UHFFFAOYSA-M Potassium hydroxide Chemical compound [OH-].[K+] KWYUFKZDYYNOTN-UHFFFAOYSA-M 0.000 description 3
- 150000007513 acids Chemical class 0.000 description 3
- 229910052708 sodium Inorganic materials 0.000 description 3
- 239000011734 sodium Substances 0.000 description 3
- 238000001994 activation Methods 0.000 description 2
- ZCDOYSPFYFSLEW-UHFFFAOYSA-N chromate(2-) Chemical class [O-][Cr]([O-])(=O)=O ZCDOYSPFYFSLEW-UHFFFAOYSA-N 0.000 description 2
- 238000005137 deposition process Methods 0.000 description 2
- 239000004615 ingredient Substances 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 230000003647 oxidation Effects 0.000 description 2
- 238000007254 oxidation reaction Methods 0.000 description 2
- -1 silver ions Chemical class 0.000 description 2
- CMWKITSNTDAEDT-UHFFFAOYSA-N 2-nitrobenzaldehyde Chemical class [O-][N+](=O)C1=CC=CC=C1C=O CMWKITSNTDAEDT-UHFFFAOYSA-N 0.000 description 1
- VHUUQVKOLVNVRT-UHFFFAOYSA-N Ammonium hydroxide Chemical compound [NH4+].[OH-] VHUUQVKOLVNVRT-UHFFFAOYSA-N 0.000 description 1
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- PIICEJLVQHRZGT-UHFFFAOYSA-N Ethylenediamine Chemical compound NCCN PIICEJLVQHRZGT-UHFFFAOYSA-N 0.000 description 1
- 230000004913 activation Effects 0.000 description 1
- 229910001854 alkali hydroxide Inorganic materials 0.000 description 1
- 150000008044 alkali metal hydroxides Chemical class 0.000 description 1
- 229910052784 alkaline earth metal Inorganic materials 0.000 description 1
- 150000001342 alkaline earth metals Chemical class 0.000 description 1
- ICAIHGOJRDCMHE-UHFFFAOYSA-O ammonium cyanide Chemical compound [NH4+].N#[C-] ICAIHGOJRDCMHE-UHFFFAOYSA-O 0.000 description 1
- 239000000908 ammonium hydroxide Substances 0.000 description 1
- 238000004061 bleaching Methods 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 230000003197 catalytic effect Effects 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 238000002845 discoloration Methods 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-M hydroxide Chemical group [OH-] XLYOFNOQVPJJNP-UHFFFAOYSA-M 0.000 description 1
- 239000003112 inhibitor Substances 0.000 description 1
- 229910052500 inorganic mineral Chemical class 0.000 description 1
- 239000011707 mineral Chemical class 0.000 description 1
- 150000002825 nitriles Chemical class 0.000 description 1
- 150000002828 nitro derivatives Chemical class 0.000 description 1
- 150000005181 nitrobenzenes Chemical class 0.000 description 1
- 150000005338 nitrobenzoic acids Chemical class 0.000 description 1
- 230000000737 periodic effect Effects 0.000 description 1
- 231100000614 poison Toxicity 0.000 description 1
- 238000004321 preservation Methods 0.000 description 1
- 239000003755 preservative agent Substances 0.000 description 1
- 229940100890 silver compound Drugs 0.000 description 1
- 150000003379 silver compounds Chemical class 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 150000003460 sulfonic acids Chemical class 0.000 description 1
- 239000003440 toxic substance Substances 0.000 description 1
- 238000011179 visual inspection Methods 0.000 description 1
- 230000004580 weight loss Effects 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
- C23F1/00—Etching metallic material by chemical means
- C23F1/10—Etching compositions
- C23F1/14—Aqueous compositions
- C23F1/32—Alkaline compositions
- C23F1/40—Alkaline compositions for etching other metallic material
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
- C23F1/00—Etching metallic material by chemical means
- C23F1/44—Compositions for etching metallic material from a metallic material substrate of different composition
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
- H05K3/067—Etchants
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/03—Metal processing
- H05K2203/0361—Stripping a part of an upper metal layer to expose a lower metal layer, e.g. by etching or using a laser
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
- H05K2203/0779—Treatments involving liquids, e.g. plating, rinsing characterised by the specific liquids involved
- H05K2203/0786—Using an aqueous solution, e.g. for cleaning or during drilling of holes
- H05K2203/0796—Oxidant in aqueous solution, e.g. permanganate
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing Of Printed Wiring (AREA)
- ing And Chemical Polishing (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US106522 | 2002-03-25 | ||
| US10/106,522 US6783690B2 (en) | 2002-03-25 | 2002-03-25 | Method of stripping silver from a printed circuit board |
| PCT/US2003/004784 WO2003082605A1 (en) | 2002-03-25 | 2003-02-18 | Method of stripping silver from a printed circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| ES2410811T3 true ES2410811T3 (es) | 2013-07-03 |
Family
ID=28452509
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| ES03713509T Expired - Lifetime ES2410811T3 (es) | 2002-03-25 | 2003-02-18 | Método para separar plata de una tarjeta de circuito impreso |
Country Status (8)
| Country | Link |
|---|---|
| US (1) | US6783690B2 (enExample) |
| EP (1) | EP1487646B1 (enExample) |
| JP (1) | JP3683896B2 (enExample) |
| CN (1) | CN1703327B (enExample) |
| AU (1) | AU2003217557A1 (enExample) |
| ES (1) | ES2410811T3 (enExample) |
| TW (1) | TWI256423B (enExample) |
| WO (1) | WO2003082605A1 (enExample) |
Families Citing this family (17)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4268515B2 (ja) * | 2003-12-26 | 2009-05-27 | 新光電気工業株式会社 | 電解剥離方法 |
| KR100712879B1 (ko) * | 2005-04-06 | 2007-04-30 | 주식회사 잉크테크 | 에칭액 조성물 |
| US20070232510A1 (en) * | 2006-03-29 | 2007-10-04 | Kucera Alvin A | Method and composition for selectively stripping silver from a substrate |
| DE112009000839T5 (de) * | 2008-04-10 | 2011-05-12 | World Properties, Inc., Lincolnwood | Schaltungsmaterialien mit verbesserter Bindung, Verfahren zur Herstellung hiervon und hieraus hergestellte Artikel |
| US8753561B2 (en) * | 2008-06-20 | 2014-06-17 | Baxter International Inc. | Methods for processing substrates comprising metallic nanoparticles |
| US8178120B2 (en) * | 2008-06-20 | 2012-05-15 | Baxter International Inc. | Methods for processing substrates having an antimicrobial coating |
| US8277826B2 (en) | 2008-06-25 | 2012-10-02 | Baxter International Inc. | Methods for making antimicrobial resins |
| US20090324738A1 (en) * | 2008-06-30 | 2009-12-31 | Baxter International Inc. | Methods for making antimicrobial coatings |
| US20100227052A1 (en) * | 2009-03-09 | 2010-09-09 | Baxter International Inc. | Methods for processing substrates having an antimicrobial coating |
| KR101701537B1 (ko) * | 2009-05-08 | 2017-02-01 | 바스프 에스이 | 루테늄 비롯한 귀금속의 화학적 기계적 평탄화를 위한 산화 입자계 슬러리 |
| CN103237419B (zh) * | 2013-04-22 | 2016-04-20 | 胜华电子（惠阳）有限公司 | 一种化银线路板银面剥除方法 |
| WO2015095664A2 (en) | 2013-12-20 | 2015-06-25 | Greene Lyon Group, Inc. | Method and apparatus for recovery of noble metals, including recovery of noble metals from plated and/or filled scrap |
| WO2016210051A1 (en) | 2015-06-24 | 2016-12-29 | Greene Lyon Group, Inc. | Selective removal of noble metals using acidic fluids, including fluids containing nitrate ions |
| US20220151795A1 (en) | 2019-03-11 | 2022-05-19 | Shoulder Innovations, Inc. | Total reverse shoulder systems and methods |
| CN114074492B (zh) * | 2020-08-18 | 2024-06-25 | 光群雷射科技股份有限公司 | 去除转印滚轮的拆版线的方法 |
| TWI755229B (zh) * | 2020-12-30 | 2022-02-11 | 力橋國際有限公司 | 無氰之電解剝銀劑及電解剝銀方法 |
| CN113846326A (zh) * | 2021-09-23 | 2021-12-28 | 江苏富乐德半导体科技有限公司 | 一种陶瓷覆铜基板表面化学镀银退镀方法 |
Family Cites Families (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| FR1583955A (enExample) * | 1968-04-19 | 1969-12-12 | ||
| US3860423A (en) | 1973-08-24 | 1975-01-14 | Rca Corp | Etching solution for silver |
| US4204013A (en) | 1978-10-20 | 1980-05-20 | Oxy Metal Industries Corporation | Method for treating polymeric substrates prior to plating employing accelerating composition containing an alkyl amine |
| US4448637A (en) | 1981-12-28 | 1984-05-15 | Daicel Chemical Industries, Ltd. | Etching method of conductive film |
| US4960490A (en) | 1983-06-13 | 1990-10-02 | Minnesota Mining And Manufacturing Company | Method of making multiple-connector adhesive tape |
| US5002649A (en) | 1988-03-28 | 1991-03-26 | Sifco Industries, Inc. | Selective stripping apparatus |
| JPH03232980A (ja) * | 1990-02-06 | 1991-10-16 | Shinko Electric Ind Co Ltd | 銅もしくは銅合金上の銀剥離液 |
| DE4031609A1 (de) | 1990-03-16 | 1991-09-19 | Kodak Ag | Verfahren und vorrichtung zur aufbereitung von fluessigen rueckstaenden aus photographischen prozessen |
| USH1136H (en) | 1991-11-29 | 1993-02-02 | The United States Of America As Represented By The Secretary Of The Air Force | Electrolytic deposition and recovery of silver |
| JPH07316845A (ja) * | 1994-05-19 | 1995-12-05 | Hitachi Cable Ltd | 銀めっき部材の表面処理液 |
| US5611905A (en) * | 1995-06-09 | 1997-03-18 | Shipley Company, L.L.C. | Electroplating process |
| US6200451B1 (en) | 1996-03-22 | 2001-03-13 | Macdermid, Incorporated | Method for enhancing the solderability of a surface |
| TW385375B (en) * | 1996-07-26 | 2000-03-21 | Asahi Glass Co Ltd | Transparent conductive film and forming method for transparent electrode |
| US6126720A (en) | 1997-06-16 | 2000-10-03 | Mitsubishi Materials Corporation | Method for smelting noble metal |
| US6238592B1 (en) | 1999-03-10 | 2001-05-29 | 3M Innovative Properties Company | Working liquids and methods for modifying structured wafers suited for semiconductor fabrication |
-
2002
- 2002-03-25 US US10/106,522 patent/US6783690B2/en not_active Expired - Lifetime
-
2003
- 2003-02-18 CN CN038066629A patent/CN1703327B/zh not_active Expired - Fee Related
- 2003-02-18 EP EP03713509.2A patent/EP1487646B1/en not_active Expired - Lifetime
- 2003-02-18 WO PCT/US2003/004784 patent/WO2003082605A1/en not_active Ceased
- 2003-02-18 JP JP2003580104A patent/JP3683896B2/ja not_active Expired - Lifetime
- 2003-02-18 ES ES03713509T patent/ES2410811T3/es not_active Expired - Lifetime
- 2003-02-18 AU AU2003217557A patent/AU2003217557A1/en not_active Abandoned
- 2003-02-27 TW TW092104260A patent/TWI256423B/zh not_active IP Right Cessation
Also Published As
| Publication number | Publication date |
|---|---|
| JP3683896B2 (ja) | 2005-08-17 |
| TW200304507A (en) | 2003-10-01 |
| AU2003217557A1 (en) | 2003-10-13 |
| WO2003082605A1 (en) | 2003-10-09 |
| EP1487646A4 (en) | 2010-01-13 |
| EP1487646A1 (en) | 2004-12-22 |
| CN1703327B (zh) | 2010-06-09 |
| US20030183598A1 (en) | 2003-10-02 |
| TWI256423B (en) | 2006-06-11 |
| EP1487646B1 (en) | 2013-05-22 |
| JP2005520936A (ja) | 2005-07-14 |
| US6783690B2 (en) | 2004-08-31 |
| CN1703327A (zh) | 2005-11-30 |
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