DK1120477T3 - Fremgangsmåde til opnåelse af et tinlag på den indvendige overflade af hulelementer af kobberlegeringer - Google Patents

Fremgangsmåde til opnåelse af et tinlag på den indvendige overflade af hulelementer af kobberlegeringer

Info

Publication number
DK1120477T3
DK1120477T3 DK00128764T DK00128764T DK1120477T3 DK 1120477 T3 DK1120477 T3 DK 1120477T3 DK 00128764 T DK00128764 T DK 00128764T DK 00128764 T DK00128764 T DK 00128764T DK 1120477 T3 DK1120477 T3 DK 1120477T3
Authority
DK
Denmark
Prior art keywords
tin layer
obtaining
copper alloys
hollow elements
reduction solution
Prior art date
Application number
DK00128764T
Other languages
English (en)
Inventor
Ulrich Reiter
Original Assignee
Km Europa Metal Ag
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Km Europa Metal Ag filed Critical Km Europa Metal Ag
Application granted granted Critical
Publication of DK1120477T3 publication Critical patent/DK1120477T3/da

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18—Pretreatment of the material to be coated
    • C23C18/1803—Pretreatment of the material to be coated of metallic material surfaces or of a non-specific material surfaces
    • C23C18/1824—Pretreatment of the material to be coated of metallic material surfaces or of a non-specific material surfaces by chemical pretreatment
    • C23C18/1837—Multistep pretreatment
    • C23C18/1844—Multistep pretreatment with use of organic or inorganic compounds other than metals, first
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31—Coating with metals
DK00128764T 2000-01-28 2000-12-30 Fremgangsmåde til opnåelse af et tinlag på den indvendige overflade af hulelementer af kobberlegeringer DK1120477T3 (da)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE10003582A DE10003582A1 (de) 2000-01-28 2000-01-28 Verfahren zur Erzeugung einer Zinnschicht auf der inneren Oberfläche von Hohlbauteilen aus Kupferlegierungen
EP00128764A EP1120477B1 (de) 2000-01-28 2000-12-30 Verfahren zur Erzeugung einer Zinnschicht auf der inneren Oberfläche von Hohlbauteilen aus Kupferlegierungen

Publications (1)

Publication Number Publication Date
DK1120477T3 true DK1120477T3 (da) 2005-09-26

Family

ID=7628943

Family Applications (1)

Application Number Title Priority Date Filing Date
DK00128764T DK1120477T3 (da) 2000-01-28 2000-12-30 Fremgangsmåde til opnåelse af et tinlag på den indvendige overflade af hulelementer af kobberlegeringer

Country Status (9)

Country Link
US (1) US6572754B2 (da)
EP (1) EP1120477B1 (da)
JP (1) JP2001288577A (da)
AT (1) ATE296364T1 (da)
DE (2) DE10003582A1 (da)
DK (1) DK1120477T3 (da)
ES (1) ES2238967T3 (da)
HU (1) HUP0100444A3 (da)
PT (1) PT1120477E (da)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE10213185A1 (de) * 2002-03-23 2003-10-02 Km Europa Metal Ag Verfahren zur Verringerung der Kupferlöslichkeit an der inneren Oberfläche eines Kupferrohrs
US7771542B1 (en) 2006-05-30 2010-08-10 Stone Chemical Company Compositions and methods for removing lead from metal surfaces

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2282511A (en) * 1940-03-20 1942-05-12 American Brass Co Coating cupreous surfaces with tin
JPS56112496A (en) * 1980-02-05 1981-09-04 Mitsubishi Electric Corp Plating method
US4751049A (en) * 1985-07-05 1988-06-14 Shannon John K Connector and alloy
US5169692A (en) * 1991-11-19 1992-12-08 Shipley Company Inc. Tin lead process
US5211831A (en) * 1991-11-27 1993-05-18 Mcgean-Rohco, Inc. Process for extending the life of a displacement plating bath
JP3026527B2 (ja) * 1992-07-27 2000-03-27 株式会社ジャパンエナジー 無電解めっきの前処理方法および前処理液
GB9409811D0 (en) * 1994-05-17 1994-07-06 Imi Yorkshire Fittings Improvements in copper alloy water fittings
JP2804722B2 (ja) * 1994-10-26 1998-09-30 株式会社神戸製鋼所 銅又は銅合金管内面への錫めっき方法
ES2158118T3 (es) * 1995-08-03 2001-09-01 Europa Metalli Spa Elementos de fontaneria con escasa liberacion de plomo hechos a base de cobre que contienen plomo y procedimiento de fabricacion correspondiente.
JP3005469B2 (ja) * 1996-06-05 2000-01-31 住友軽金属工業株式会社 内面スズめっき長尺銅管の製造方法
AU2792697A (en) * 1996-06-05 1998-01-05 Sumitomo Light Metal Industries, Ltd. Internally tin-plated copper pipe manufacturing method
DE19653765A1 (de) * 1996-12-23 1998-06-25 Km Europa Metal Ag Innen verzinntes Kupferrohr und Verfahren zur Beschichtung eines Kupferrohrs
US6197210B1 (en) * 1998-08-17 2001-03-06 Gerber Plumbing Fixtures Corp. Process for treating brass components to substantially eliminate leachabale lead

Also Published As

Publication number Publication date
JP2001288577A (ja) 2001-10-19
DE50010390D1 (de) 2005-06-30
HU0100444D0 (en) 2001-03-28
EP1120477B1 (de) 2005-05-25
US6572754B2 (en) 2003-06-03
DE10003582A1 (de) 2001-08-02
EP1120477A3 (de) 2002-06-12
US20010010834A1 (en) 2001-08-02
ES2238967T3 (es) 2005-09-16
HUP0100444A2 (hu) 2001-12-28
HUP0100444A3 (en) 2003-02-28
EP1120477A2 (de) 2001-08-01
ATE296364T1 (de) 2005-06-15
PT1120477E (pt) 2005-08-31

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