ATE282098T1 - Kupfergewinnungsverfahren - Google Patents
KupfergewinnungsverfahrenInfo
- Publication number
- ATE282098T1 ATE282098T1 AT00902242T AT00902242T ATE282098T1 AT E282098 T1 ATE282098 T1 AT E282098T1 AT 00902242 T AT00902242 T AT 00902242T AT 00902242 T AT00902242 T AT 00902242T AT E282098 T1 ATE282098 T1 AT E282098T1
- Authority
- AT
- Austria
- Prior art keywords
- copper
- acid solution
- extraction process
- copper extraction
- printed boards
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
- C23F1/00—Etching metallic material by chemical means
- C23F1/46—Regeneration of etching compositions
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22B—PRODUCTION AND REFINING OF METALS; PRETREATMENT OF RAW MATERIALS
- C22B15/00—Obtaining copper
- C22B15/0063—Hydrometallurgy
- C22B15/0084—Treating solutions
- C22B15/0089—Treating solutions by chemical methods
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D21/00—Processes for servicing or operating cells for electrolytic coating
- C25D21/16—Regeneration of process solutions
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P10/00—Technologies related to metal processing
- Y02P10/20—Recycling
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- General Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Manufacturing & Machinery (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Electrolytic Production Of Metals (AREA)
- Electroplating Methods And Accessories (AREA)
- Manufacture And Refinement Of Metals (AREA)
- ing And Chemical Polishing (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
SE9900748A SE512160C2 (sv) | 1999-03-02 | 1999-03-02 | Förfarande för återvinning av koppar från ett alkaliskt etsbad |
PCT/SE2000/000066 WO2000052229A1 (en) | 1999-03-02 | 2000-01-14 | Copper recovery process |
Publications (1)
Publication Number | Publication Date |
---|---|
ATE282098T1 true ATE282098T1 (de) | 2004-11-15 |
Family
ID=20414695
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
AT00902242T ATE282098T1 (de) | 1999-03-02 | 2000-01-14 | Kupfergewinnungsverfahren |
Country Status (9)
Country | Link |
---|---|
US (1) | US6821404B1 (de) |
EP (1) | EP1165861B1 (de) |
CN (1) | CN1342218A (de) |
AT (1) | ATE282098T1 (de) |
AU (1) | AU2337100A (de) |
DE (1) | DE60015736D1 (de) |
HK (1) | HK1043814A1 (de) |
SE (1) | SE512160C2 (de) |
WO (1) | WO2000052229A1 (de) |
Families Citing this family (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6848457B2 (en) * | 2000-05-08 | 2005-02-01 | Tokyo Electron Limited | Liquid treatment equipment, liquid treatment method, semiconductor device manufacturing method, and semiconductor device manufacturing equipment |
US7175819B2 (en) * | 2005-03-04 | 2007-02-13 | Phibro-Tech, Inc. | Regeneration of cupric etchants and recovery of copper sulfate |
CN1904142B (zh) * | 2006-07-08 | 2012-01-25 | 江门市蓬江区大盈机电设备有限公司 | 一种蚀刻废液或低含铜废水的提铜方法 |
CN103695653B (zh) * | 2014-01-02 | 2016-06-08 | 沈少波 | 一种湿法提取电路板上贵金属的方法 |
CN105077561B (zh) * | 2015-08-28 | 2016-08-31 | 安徽中烟工业有限责任公司 | 一种造纸法再造烟叶萃取液中Cu含量的选择性降低方法 |
CN109881200B (zh) * | 2019-04-10 | 2021-05-11 | 深圳市铿东科技有限公司 | 一种碱性蚀刻液再生及其铜回收方法 |
CN110359051B (zh) * | 2019-06-18 | 2020-09-22 | 龙建国 | 线路板蚀刻废液循环再利用的方法 |
CN110636710A (zh) * | 2019-07-17 | 2019-12-31 | 江苏博敏电子有限公司 | 一种印制电路板精细线路电解蚀刻和电镀同步制作方法 |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4083758A (en) * | 1976-09-27 | 1978-04-11 | Criterion | Process for regenerating and for recovering metallic copper from chloride-containing etching solutions |
SE411231B (sv) * | 1978-05-02 | 1979-12-10 | Mx Processer Reinhardt | Forfarande for atervinning av ett ammonialkaliskt etsbad |
US5261154A (en) * | 1991-07-22 | 1993-11-16 | Macdermid, Incorporated | Process for fabricating multilayer printed circuits |
DE19506832A1 (de) * | 1995-02-28 | 1996-08-29 | Eilenburger Elektrolyse & Umwelttechnik Gmbh | Kreislaufverfahren zum Beizen von Kupfer und Kupferlegierungen |
US5705048A (en) * | 1996-03-27 | 1998-01-06 | Oxley Research, Inc. | Apparatus and a process for regenerating a CUCl2 etchant |
US6071398A (en) * | 1997-10-06 | 2000-06-06 | Learonal, Inc. | Programmed pulse electroplating process |
-
1999
- 1999-03-02 SE SE9900748A patent/SE512160C2/sv not_active IP Right Cessation
-
2000
- 2000-01-14 EP EP00902242A patent/EP1165861B1/de not_active Expired - Lifetime
- 2000-01-14 WO PCT/SE2000/000066 patent/WO2000052229A1/en active IP Right Grant
- 2000-01-14 DE DE60015736T patent/DE60015736D1/de not_active Expired - Lifetime
- 2000-01-14 AT AT00902242T patent/ATE282098T1/de not_active IP Right Cessation
- 2000-01-14 CN CN00804514A patent/CN1342218A/zh active Pending
- 2000-01-14 AU AU23371/00A patent/AU2337100A/en not_active Abandoned
- 2000-01-14 US US09/913,938 patent/US6821404B1/en not_active Expired - Fee Related
-
2002
- 2002-04-30 HK HK02103248.2A patent/HK1043814A1/zh unknown
Also Published As
Publication number | Publication date |
---|---|
CN1342218A (zh) | 2002-03-27 |
AU2337100A (en) | 2000-09-21 |
WO2000052229A1 (en) | 2000-09-08 |
US6821404B1 (en) | 2004-11-23 |
EP1165861A1 (de) | 2002-01-02 |
SE512160C2 (sv) | 2000-02-07 |
HK1043814A1 (zh) | 2002-09-27 |
DE60015736D1 (de) | 2004-12-16 |
EP1165861B1 (de) | 2004-11-10 |
SE9900748D0 (sv) | 1999-03-02 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US6391188B1 (en) | Processes and apparatus for recovery and removal of copper from fluids | |
TW200513154A (en) | Producing method of flexible wired circuit board | |
DE60327061D1 (de) | Verfahren zum auflösen von kupfermetall | |
TWI282377B (en) | Etchant, replenishment solution and method for producing copper wiring using the same | |
DE60015736D1 (de) | Kupfergewinnungsverfahren | |
TW200723982A (en) | Wiring board manufacturing method | |
CN108950562B (zh) | 一种pcb板两段法退锡的方法 | |
CN104080278B (zh) | 线路板高分子导电膜孔工艺及其搭配图形电镀的生产工艺 | |
TW200607413A (en) | Etching removal method and etching liquid used in the manufacture of a printed wiring board by semiadditive method | |
CN103233128A (zh) | 一种从酸性废蚀刻液中回收铜的方法 | |
TW201008882A (en) | Waste micro etchant treatment | |
EA200600460A1 (ru) | Способ обработки анодного шлама | |
CN104270893A (zh) | 一种pcb板表面处理工艺 | |
KR20070061518A (ko) | 전기분해에 의하여 재생가능한 식각액 | |
MXPA04000902A (es) | Mejoras en los procesos de extraccion con disolventes para la recuperacion de metales. | |
CN106283057A (zh) | 一种浓缩金镀层退镀液及其使用方法 | |
RU2004116335A (ru) | Извлечение меди из халькопирита | |
CN211339693U (zh) | 一种碱性含铜蚀刻废液再生及氨氮废水循环系统 | |
CN112941563A (zh) | 一种旋流电积阴极筒体残余铜的回收方法 | |
CN108774747A (zh) | 一种电解蚀刻制备pcb精细线路的电解蚀刻液 | |
Gyliene et al. | Recovery of EDTA from aqueous solutions as the sparingly-soluble copper complex | |
JP2002266087A5 (de) | ||
JPS5590423A (en) | Recovery method for iron from etching waste liquor | |
YU15801A (sh) | Postupak izdvajanja bakra iz jamskih voda, topioničkih prašina i otpadnih rastvora elektrolitičke rafinacije bakra | |
CN112663090A (zh) | 一种从含铜锡泥中回收铜的方法 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
RER | Ceased as to paragraph 5 lit. 3 law introducing patent treaties |