TW200607413A - Etching removal method and etching liquid used in the manufacture of a printed wiring board by semiadditive method - Google Patents

Etching removal method and etching liquid used in the manufacture of a printed wiring board by semiadditive method

Info

Publication number
TW200607413A
TW200607413A TW094121364A TW94121364A TW200607413A TW 200607413 A TW200607413 A TW 200607413A TW 094121364 A TW094121364 A TW 094121364A TW 94121364 A TW94121364 A TW 94121364A TW 200607413 A TW200607413 A TW 200607413A
Authority
TW
Taiwan
Prior art keywords
copper plating
etching liquid
manufacture
wiring board
printed wiring
Prior art date
Application number
TW094121364A
Other languages
Chinese (zh)
Other versions
TWI353201B (en
Inventor
Akira Hosomi
Original Assignee
Mitsubishi Gas Chemical Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Gas Chemical Co filed Critical Mitsubishi Gas Chemical Co
Publication of TW200607413A publication Critical patent/TW200607413A/en
Application granted granted Critical
Publication of TWI353201B publication Critical patent/TWI353201B/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
    • C23F1/00—Etching metallic material by chemical means
    • C23F1/02—Local etching
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
    • C23F1/00—Etching metallic material by chemical means
    • C23F1/10—Etching compositions
    • C23F1/14—Aqueous compositions
    • C23F1/16—Acidic compositions
    • C23F1/18—Acidic compositions for etching copper or alloys thereof
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • H05K3/067—Etchants

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Organic Chemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
  • ing And Chemical Polishing (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Inorganic Chemistry (AREA)
  • Electrochemistry (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)

Abstract

Provided is an etching removal method used in the manufacture of a printed wiring board by semiadditive method and an etching liquid used in said method, whereby the chemical copper plating as seed layer is selectively etched with respect to the electrical copper plating as wiring portion. The etching removal method is used in the manufacture of a printed wiring board by a semi-additive method, wherein after a seed layer of a chemical copper plating is formed on an insulating resin layer to form a resist patter, and after a conductor circuit is formed by electrical copper plating, the resist is stripped, and the unwanted chemical copper plating is selectively removed by using a selective etching liquid. The selective etching liquid comprises 0.2 to 15% by weight of hydrogen peroxide, 0.5 to 15% by weight of sulfuric acid and 0.5 to 5 ppm of bromide ion, wherein the molar ratio of the hydrogen peroxide to the sulfuric acid is 5 or less, and the selective etching liquid further contains 0.001 to 0.05% by weight of an azole.
TW094121364A 2004-06-29 2005-06-27 Etching removal method and etching liquid used in TWI353201B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2004191559A JP4488188B2 (en) 2004-06-29 2004-06-29 Semi-additive process etchant for printed wiring board manufacturing

Publications (2)

Publication Number Publication Date
TW200607413A true TW200607413A (en) 2006-02-16
TWI353201B TWI353201B (en) 2011-11-21

Family

ID=35780184

Family Applications (1)

Application Number Title Priority Date Filing Date
TW094121364A TWI353201B (en) 2004-06-29 2005-06-27 Etching removal method and etching liquid used in

Country Status (4)

Country Link
JP (1) JP4488188B2 (en)
KR (1) KR101162370B1 (en)
CN (1) CN1889812A (en)
TW (1) TWI353201B (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI630261B (en) * 2013-11-22 2018-07-21 三菱瓦斯化學股份有限公司 Etching composition and method of manufacturing printed circuit board using the same

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5273710B2 (en) * 2007-11-27 2013-08-28 メック株式会社 Etching agent
JP5531708B2 (en) 2010-03-26 2014-06-25 メック株式会社 Copper etching solution and substrate manufacturing method
WO2013136729A1 (en) * 2012-03-16 2013-09-19 住友ベークライト株式会社 Manufacturing method for laminated board and printed wiring board
CN103510089B (en) * 2012-06-29 2017-04-12 三菱瓦斯化学株式会社 Liquid composition for etching and preparing method of multilayer printed wiring board using same
JP6120147B2 (en) * 2012-06-29 2017-04-26 三菱瓦斯化学株式会社 Etching liquid composition and method for producing multilayer printed wiring board using the same
TWI606760B (en) * 2013-04-23 2017-11-21 Mitsubishi Gas Chemical Co Circuit board processing method and printed circuit board manufactured by the method
JP6464578B2 (en) * 2013-08-01 2019-02-06 三菱瓦斯化学株式会社 Method for manufacturing printed wiring board
CN103966606B (en) * 2014-05-06 2016-04-06 汕头超声印制板（二厂）有限公司 A kind ofly subtract copper etching solution for printed circuit board
KR102048495B1 (en) * 2018-03-27 2019-11-25 김용석 Etching solution for msap substrate

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000064067A (en) * 1998-06-09 2000-02-29 Ebara Densan Ltd Etching solution and roughening treatment of copper surface
JP4687852B2 (en) 2001-06-25 2011-05-25 三菱瓦斯化学株式会社 Surface treatment agent for copper and copper alloys
JP4032712B2 (en) * 2001-11-22 2008-01-16 日立化成工業株式会社 Method for manufacturing printed wiring board

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI630261B (en) * 2013-11-22 2018-07-21 三菱瓦斯化學股份有限公司 Etching composition and method of manufacturing printed circuit board using the same

Also Published As

Publication number Publication date
JP2006013340A (en) 2006-01-12
CN1889812A (en) 2007-01-03
KR101162370B1 (en) 2012-07-04
KR20060046430A (en) 2006-05-17
TWI353201B (en) 2011-11-21
JP4488188B2 (en) 2010-06-23

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees