SE512160C2 - Förfarande för återvinning av koppar från ett alkaliskt etsbad - Google Patents
Förfarande för återvinning av koppar från ett alkaliskt etsbadInfo
- Publication number
- SE512160C2 SE512160C2 SE9900748A SE9900748A SE512160C2 SE 512160 C2 SE512160 C2 SE 512160C2 SE 9900748 A SE9900748 A SE 9900748A SE 9900748 A SE9900748 A SE 9900748A SE 512160 C2 SE512160 C2 SE 512160C2
- Authority
- SE
- Sweden
- Prior art keywords
- copper
- plating
- extraction
- organic solution
- content
- Prior art date
Links
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 title claims abstract description 103
- 239000010949 copper Substances 0.000 title claims abstract description 100
- 229910052802 copper Inorganic materials 0.000 title claims abstract description 100
- 238000000034 method Methods 0.000 title claims abstract description 71
- 238000005530 etching Methods 0.000 title claims abstract description 49
- 238000011084 recovery Methods 0.000 title abstract 3
- 238000007747 plating Methods 0.000 claims abstract description 72
- 238000000605 extraction Methods 0.000 claims abstract description 56
- 239000002253 acid Substances 0.000 claims abstract description 35
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 18
- 238000005868 electrolysis reaction Methods 0.000 claims abstract description 9
- 239000000243 solution Substances 0.000 claims description 61
- 230000001105 regulatory effect Effects 0.000 claims description 16
- 239000008237 rinsing water Substances 0.000 claims description 13
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 claims description 12
- 239000000126 substance Substances 0.000 claims description 9
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 8
- 238000005406 washing Methods 0.000 claims description 7
- QGZKDVFQNNGYKY-UHFFFAOYSA-N Ammonia Chemical compound N QGZKDVFQNNGYKY-UHFFFAOYSA-N 0.000 claims description 6
- 230000009467 reduction Effects 0.000 claims description 6
- 239000000654 additive Substances 0.000 claims description 5
- 239000003153 chemical reaction reagent Substances 0.000 claims description 5
- 239000007864 aqueous solution Substances 0.000 claims description 4
- 229910052799 carbon Inorganic materials 0.000 claims description 4
- 150000001875 compounds Chemical class 0.000 claims description 4
- 229910021529 ammonia Inorganic materials 0.000 claims description 3
- 150000001450 anions Chemical class 0.000 claims description 3
- 239000011368 organic material Substances 0.000 claims description 3
- 238000009713 electroplating Methods 0.000 claims description 2
- 238000004519 manufacturing process Methods 0.000 claims description 2
- 238000000926 separation method Methods 0.000 claims description 2
- -1 by electrolysis Chemical compound 0.000 abstract 1
- 239000011248 coating agent Substances 0.000 description 6
- 238000000576 coating method Methods 0.000 description 6
- 230000008901 benefit Effects 0.000 description 5
- 239000010410 layer Substances 0.000 description 4
- 238000004064 recycling Methods 0.000 description 4
- 238000004062 sedimentation Methods 0.000 description 4
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 3
- 239000007788 liquid Substances 0.000 description 3
- JJLJMEJHUUYSSY-UHFFFAOYSA-L Copper hydroxide Chemical compound [OH-].[OH-].[Cu+2] JJLJMEJHUUYSSY-UHFFFAOYSA-L 0.000 description 2
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 2
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 2
- 238000009835 boiling Methods 0.000 description 2
- 239000003792 electrolyte Substances 0.000 description 2
- 238000002474 experimental method Methods 0.000 description 2
- 230000002349 favourable effect Effects 0.000 description 2
- 238000002347 injection Methods 0.000 description 2
- 239000007924 injection Substances 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 239000002245 particle Substances 0.000 description 2
- 230000010349 pulsation Effects 0.000 description 2
- 238000003860 storage Methods 0.000 description 2
- NLXLAEXVIDQMFP-UHFFFAOYSA-N Ammonia chloride Chemical compound [NH4+].[Cl-] NLXLAEXVIDQMFP-UHFFFAOYSA-N 0.000 description 1
- 239000005750 Copper hydroxide Substances 0.000 description 1
- QAOWNCQODCNURD-UHFFFAOYSA-L Sulfate Chemical compound [O-]S([O-])(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-L 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- 238000013019 agitation Methods 0.000 description 1
- 239000012670 alkaline solution Substances 0.000 description 1
- 235000012538 ammonium bicarbonate Nutrition 0.000 description 1
- 235000019270 ammonium chloride Nutrition 0.000 description 1
- 150000003863 ammonium salts Chemical class 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 230000033228 biological regulation Effects 0.000 description 1
- 238000005253 cladding Methods 0.000 description 1
- 239000004927 clay Substances 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 239000000356 contaminant Substances 0.000 description 1
- 238000010924 continuous production Methods 0.000 description 1
- 229910001956 copper hydroxide Inorganic materials 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 238000004090 dissolution Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 238000005188 flotation Methods 0.000 description 1
- 239000013505 freshwater Substances 0.000 description 1
- 230000005484 gravity Effects 0.000 description 1
- 239000010797 grey water Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 238000001556 precipitation Methods 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 230000001172 regenerating effect Effects 0.000 description 1
- 230000000717 retained effect Effects 0.000 description 1
- 229910021653 sulphate ion Inorganic materials 0.000 description 1
- 239000002344 surface layer Substances 0.000 description 1
- 239000010936 titanium Substances 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
- 239000002966 varnish Substances 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
- C23F1/00—Etching metallic material by chemical means
- C23F1/46—Regeneration of etching compositions
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22B—PRODUCTION AND REFINING OF METALS; PRETREATMENT OF RAW MATERIALS
- C22B15/00—Obtaining copper
- C22B15/0063—Hydrometallurgy
- C22B15/0084—Treating solutions
- C22B15/0089—Treating solutions by chemical methods
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D21/00—Processes for servicing or operating cells for electrolytic coating
- C25D21/16—Regeneration of process solutions
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P10/00—Technologies related to metal processing
- Y02P10/20—Recycling
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- General Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Manufacturing & Machinery (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Electrolytic Production Of Metals (AREA)
- Electroplating Methods And Accessories (AREA)
- ing And Chemical Polishing (AREA)
- Manufacture And Refinement Of Metals (AREA)
Priority Applications (9)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| SE9900748A SE512160C2 (sv) | 1999-03-02 | 1999-03-02 | Förfarande för återvinning av koppar från ett alkaliskt etsbad |
| DE60015736T DE60015736D1 (de) | 1999-03-02 | 2000-01-14 | Kupfergewinnungsverfahren |
| PCT/SE2000/000066 WO2000052229A1 (en) | 1999-03-02 | 2000-01-14 | Copper recovery process |
| AT00902242T ATE282098T1 (de) | 1999-03-02 | 2000-01-14 | Kupfergewinnungsverfahren |
| EP00902242A EP1165861B1 (de) | 1999-03-02 | 2000-01-14 | Kupfergewinnungsverfahren |
| HK02103248.2A HK1043814A1 (zh) | 1999-03-02 | 2000-01-14 | 銅回收法 |
| CN00804514A CN1342218A (zh) | 1999-03-02 | 2000-01-14 | 铜回收法 |
| US09/913,938 US6821404B1 (en) | 1999-03-02 | 2000-01-14 | Copper recovery process |
| AU23371/00A AU2337100A (en) | 1999-03-02 | 2000-01-14 | Copper recovery process |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| SE9900748A SE512160C2 (sv) | 1999-03-02 | 1999-03-02 | Förfarande för återvinning av koppar från ett alkaliskt etsbad |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| SE9900748D0 SE9900748D0 (sv) | 1999-03-02 |
| SE512160C2 true SE512160C2 (sv) | 2000-02-07 |
Family
ID=20414695
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| SE9900748A SE512160C2 (sv) | 1999-03-02 | 1999-03-02 | Förfarande för återvinning av koppar från ett alkaliskt etsbad |
Country Status (9)
| Country | Link |
|---|---|
| US (1) | US6821404B1 (de) |
| EP (1) | EP1165861B1 (de) |
| CN (1) | CN1342218A (de) |
| AT (1) | ATE282098T1 (de) |
| AU (1) | AU2337100A (de) |
| DE (1) | DE60015736D1 (de) |
| HK (1) | HK1043814A1 (de) |
| SE (1) | SE512160C2 (de) |
| WO (1) | WO2000052229A1 (de) |
Families Citing this family (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6848457B2 (en) * | 2000-05-08 | 2005-02-01 | Tokyo Electron Limited | Liquid treatment equipment, liquid treatment method, semiconductor device manufacturing method, and semiconductor device manufacturing equipment |
| US7175819B2 (en) * | 2005-03-04 | 2007-02-13 | Phibro-Tech, Inc. | Regeneration of cupric etchants and recovery of copper sulfate |
| CN1904142B (zh) * | 2006-07-08 | 2012-01-25 | 江门市蓬江区大盈机电设备有限公司 | 一种蚀刻废液或低含铜废水的提铜方法 |
| CN103695653B (zh) * | 2014-01-02 | 2016-06-08 | 沈少波 | 一种湿法提取电路板上贵金属的方法 |
| CN105077561B (zh) * | 2015-08-28 | 2016-08-31 | 安徽中烟工业有限责任公司 | 一种造纸法再造烟叶萃取液中Cu含量的选择性降低方法 |
| CN109881200B (zh) * | 2019-04-10 | 2021-05-11 | 深圳市铿东科技有限公司 | 一种碱性蚀刻液再生及其铜回收方法 |
| CN110359051B (zh) * | 2019-06-18 | 2020-09-22 | 龙建国 | 线路板蚀刻废液循环再利用的方法 |
| CN110636710A (zh) * | 2019-07-17 | 2019-12-31 | 江苏博敏电子有限公司 | 一种印制电路板精细线路电解蚀刻和电镀同步制作方法 |
| CN115852457A (zh) * | 2022-09-06 | 2023-03-28 | 徐州上达芯源半导体技术有限公司 | 一种半导体的生产加工电镀装置 |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4083758A (en) * | 1976-09-27 | 1978-04-11 | Criterion | Process for regenerating and for recovering metallic copper from chloride-containing etching solutions |
| SE411231B (sv) * | 1978-05-02 | 1979-12-10 | Mx Processer Reinhardt | Forfarande for atervinning av ett ammonialkaliskt etsbad |
| US5261154A (en) * | 1991-07-22 | 1993-11-16 | Macdermid, Incorporated | Process for fabricating multilayer printed circuits |
| DE19506832A1 (de) * | 1995-02-28 | 1996-08-29 | Eilenburger Elektrolyse & Umwelttechnik Gmbh | Kreislaufverfahren zum Beizen von Kupfer und Kupferlegierungen |
| US5705048A (en) * | 1996-03-27 | 1998-01-06 | Oxley Research, Inc. | Apparatus and a process for regenerating a CUCl2 etchant |
| US6071398A (en) * | 1997-10-06 | 2000-06-06 | Learonal, Inc. | Programmed pulse electroplating process |
-
1999
- 1999-03-02 SE SE9900748A patent/SE512160C2/sv not_active IP Right Cessation
-
2000
- 2000-01-14 WO PCT/SE2000/000066 patent/WO2000052229A1/en not_active Ceased
- 2000-01-14 EP EP00902242A patent/EP1165861B1/de not_active Expired - Lifetime
- 2000-01-14 US US09/913,938 patent/US6821404B1/en not_active Expired - Fee Related
- 2000-01-14 AU AU23371/00A patent/AU2337100A/en not_active Abandoned
- 2000-01-14 DE DE60015736T patent/DE60015736D1/de not_active Expired - Lifetime
- 2000-01-14 AT AT00902242T patent/ATE282098T1/de not_active IP Right Cessation
- 2000-01-14 CN CN00804514A patent/CN1342218A/zh active Pending
- 2000-01-14 HK HK02103248.2A patent/HK1043814A1/zh unknown
Also Published As
| Publication number | Publication date |
|---|---|
| HK1043814A1 (zh) | 2002-09-27 |
| WO2000052229A1 (en) | 2000-09-08 |
| DE60015736D1 (de) | 2004-12-16 |
| EP1165861B1 (de) | 2004-11-10 |
| ATE282098T1 (de) | 2004-11-15 |
| CN1342218A (zh) | 2002-03-27 |
| EP1165861A1 (de) | 2002-01-02 |
| AU2337100A (en) | 2000-09-21 |
| US6821404B1 (en) | 2004-11-23 |
| SE9900748D0 (sv) | 1999-03-02 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| EP0005415B1 (de) | Verfahren zur Regenerierung einer ammoniakalischen Ätzlösung | |
| SE531697C2 (sv) | Etsnings- och återvinningsförfarande | |
| SE512160C2 (sv) | Förfarande för återvinning av koppar från ett alkaliskt etsbad | |
| CN109868476A (zh) | 一种含铜离子和硝酸根的刻蚀液回收再利用方法 | |
| CN204417598U (zh) | 一种含铜微蚀废液再生回收装置 | |
| CN101492186A (zh) | 一种酸性废蚀刻液的循环再生方法及装置 | |
| CN107385470A (zh) | 含铜废蚀刻液回收方法 | |
| CN108950562B (zh) | 一种pcb板两段法退锡的方法 | |
| WO1996035827A1 (fr) | Procede permettant de recycler une solution de decapage usee | |
| CN101024546A (zh) | 铜蚀刻液再生循环方法及装置 | |
| CA1131162A (en) | Electrolytically detinning electrolyte and removing foreign metal ions by cation exchanger | |
| CN207227554U (zh) | 一种退锡废液循环再生的系统 | |
| CN101008052A (zh) | 以溶剂萃取为分离技术从pcb蚀铜液中回收铜的方法 | |
| CN210314493U (zh) | 一种新型退锡水循环利用系统 | |
| CN202610332U (zh) | 酸性蚀刻液再生回收系统 | |
| CN101003396A (zh) | 一种印刷线路板微蚀含铜废水进行处理的系统及方法 | |
| CN109112312A (zh) | 一种从微蚀废液中回收铜的方法 | |
| CN103614558A (zh) | 一种pcb蚀刻废液萃取分离铜的方法 | |
| CN204151416U (zh) | 一种酸性蚀刻液再生循环生产线 | |
| CN108456783B (zh) | 一种线路板废金、废锡边框提金、提锡的复合设备及工艺 | |
| CN201933158U (zh) | 一种酸性废蚀刻液的循环再生装置 | |
| CN102995094A (zh) | 电镀槽中金属离子浓度稳定的方法 | |
| CN204898082U (zh) | 蚀刻液循环再生处理系统 | |
| CN108658321B (zh) | 扩散渗析处理硝酸型退锡废液的系统及方法 | |
| JP3392336B2 (ja) | エッチング廃液の再利用方法 |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| NUG | Patent has lapsed |