CN104270893A - 一种pcb板表面处理工艺 - Google Patents

一种pcb板表面处理工艺 Download PDF

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Publication number
CN104270893A
CN104270893A CN201410426296.3A CN201410426296A CN104270893A CN 104270893 A CN104270893 A CN 104270893A CN 201410426296 A CN201410426296 A CN 201410426296A CN 104270893 A CN104270893 A CN 104270893A
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Prior art keywords
pcb board
pcb
surface treatment
conducted
treatment according
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CN201410426296.3A
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杨彦涛
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Wuxi Changhui Machinery & Electronics Technology Co Ltd
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Wuxi Changhui Machinery & Electronics Technology Co Ltd
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Priority to CN201410426296.3A priority Critical patent/CN104270893A/zh
Publication of CN104270893A publication Critical patent/CN104270893A/zh
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    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/22Secondary treatment of printed circuits
    • H05K3/26Cleaning or polishing of the conductive pattern
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/38Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/382Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal
    • H05K3/383Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal by microetching
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0756Uses of liquids, e.g. rinsing, coating, dissolving
    • H05K2203/0766Rinsing, e.g. after cleaning or polishing a conductive pattern
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0779Treatments involving liquids, e.g. plating, rinsing characterised by the specific liquids involved
    • H05K2203/0786Using an aqueous solution, e.g. for cleaning or during drilling of holes
    • H05K2203/0789Aqueous acid solution, e.g. for cleaning or etching
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0779Treatments involving liquids, e.g. plating, rinsing characterised by the specific liquids involved
    • H05K2203/0786Using an aqueous solution, e.g. for cleaning or during drilling of holes
    • H05K2203/0793Aqueous alkaline solution, e.g. for cleaning or etching
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0779Treatments involving liquids, e.g. plating, rinsing characterised by the specific liquids involved
    • H05K2203/0786Using an aqueous solution, e.g. for cleaning or during drilling of holes
    • H05K2203/0796Oxidant in aqueous solution, e.g. permanganate

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • ing And Chemical Polishing (AREA)

Abstract

本发明公开了一种PCB板表面处理工艺,所述步骤如下:1)PCB板进行除油、水洗;2)微蚀,使铜表面粗化,再水洗;3)对PCB板浸洗喷砂处理;4)用碱性药水浸洗PCB板,配合三维高压清洗;5)PCB板表面涂一层表面处理剂,再烘干。PCB板增加了碱性药水配合三维高压清洗,可有效的去除金属表面的杂质,在PCB板的表面涂一层表面处理剂,然后烘干,成本低,性能稳定,对环境污染小。

Description

一种PCB板表面处理工艺
技术领域
本发明涉及PCB制造领域,尤其涉及一种PCB板表面处理工艺。 
背景技术
近些年,PCB板的发展趋势逐渐趋向于印制板上元件组装密度和集成度越来越高,功率消耗越来越大,因而对PCB板的散热性要求越来越高,PCB板与PP片压合前需要对PCB板进行表面粗化处理,使其充分贴合,目前处理方法有磨板、拉丝和纳米处理等,前两者对于粗话效果并不理想,纳米处理效果好但是成本很高,且流程长操作复杂,在现有的PCB板表面处理中,常采用阳极氧化处理,虽然性能稳定但是效率低,成本高,且对环境污染大。 
发明内容
发明目的:本发明解决了上述问题,提供了一种成本低、制作容易且效果好的PCB板表面处理工艺。 
技术方案:本发明所述的一种PCB板表面处理工艺,其步骤包括: 
(1)用强酸对PCB板进行除油处理,再水洗; 
(2)用含有氧化剂的盐酸溶液对PCB板进行浸蚀,再水洗; 
(3)对PCB板浸洗喷砂处理; 
(4),用碱性药水对PCB板浸洗,再利用三维高压清洗将表面洗净,烘干; 
(5)在PCB板表面涂一层表面处理剂,再烘干。 
具体的,步骤(1)中所述的强酸为1-5%的硫酸。 
具体的,步骤(2)中所述的氧化剂为高锰酸钾、过硫酸铵或者过氧化钠;步骤(2)中所述水洗的温度在35-45℃。 
具体的,喷砂的喷料为铜矿砂。 
具体的,步骤(4)中所述的碱性药水为2-5%的氨水或者0.5-1.0g/l的氢氧化钠溶液。 
具体的,步骤(5)中所述的表面处理剂为苯并三氮唑。 
有益效果:本发明与现有技术相比,其优点在于在PCB板增加了碱性药水配合三维高压清洗,可有效的去除金属表面的杂质,在PCB板的表面涂一层表面处理剂,然后烘干,成本低,性能稳定,对环境污染小。 
具体实施方式
本发明公开了一种PCB板表面处理工艺,其流程包括:除油-水洗―微蚀―水洗―喷砂―浸洗―三维高压清洗―烘干―覆表面处理剂―烘干。 
首先,除油是采用1-5%的硫酸通过喷淋的方式将PCB板表面的油污及杂质去除,温度在30-40℃为最佳,然后,再用水喷洗PCB板表面,此步骤保证了PCB板面的洁净。 
微蚀是在PCB板洗净后,用含有氧化剂的盐酸溶液的药水进行喷淋,其中盐酸的浓度在1.6-2.4g/l,氧化剂为0.8-1.2g/l的过氧化钠,操作温度在35-45℃为最佳,其中氧化剂还可以为高锰酸钾、过硫酸铵等;再用水喷洗PCB板表面,此步骤对PCB板表面进行粗化,利于后期焊接。 
喷砂的喷料为铜矿砂,将PCB板表面变为磨砂面,有效的降低了金手指表面的划伤率。 
浸洗是将PCB板浸入2-5%的氨水或者0.5-1.0g/l的氢氧化钠溶液,除去金属杂质,利用全方位三维交叉网格状密布清洗的高压清洗系统,冲洗压力大,高压泵的出口压力高达60-80MPa,清洗干净彻底。且用水少,节约了清洗用水。最后烘干。 
最后,将PCB板放在表面涂覆机上,由于表面涂覆机上具有真空平台,涂覆均匀,表面处理剂为苯并三氮唑,表面处理剂可以提高版面的粘合力,涂覆厚度越厚成本越高,本发明厚度为2-5UM,再烘干。 
完成了PCB板的表面处理,对版面进行测试,经过测试、压合后并未出现介质层掉落和崩边的现象,发现PCB板未出现选择性化金、化银后发黑的问题,因此本发明提高了生产品质,降低了生产成本,性能稳定,对环境污染小。 

Claims (7)

1.一种PCB板表面处理工艺,包括以下步骤:
(1)用强酸对PCB板进行除油处理,再水洗;
(2)用含有氧化剂的盐酸溶液对PCB板进行浸蚀,再水洗;
(3)对PCB板浸洗喷砂处理;
(4)用碱性药水对PCB板浸洗,再利用三维高压清洗将表面洗净,再烘干;
(5)在PCB板表面涂一层表面处理剂,再烘干。
2.根据权利要求1所述的一种PCB板表面处理工艺,其特征在于:步骤(1)中所述的强酸为1-5%的硫酸。
3.根据权利要求1所述的一种PCB板表面处理工艺,其特征在于:步骤(2)中所述的氧化剂为高锰酸钾、过硫酸铵或者过氧化钠。
4.根据权利要求1所述的一种PCB板表面处理工艺,其特征在于:步骤(2)中所述水洗的温度在35-45℃。
5.根据权利要求1所述的一种PCB板表面处理工艺,其特征在于:步骤(3)中所述喷砂的喷料为铜矿砂。
6.根据权利要求1所述的一种PCB板表面处理工艺,其特征在于:步骤(4)中所述的碱性药水为2-5%的氨水或者0.5-1.0g/l的氢氧化钠溶液。
7.根据权利要求1所述的一种PCB板表面处理工艺,其特征在于:步骤(5)中所述的表面处理剂为苯并三氮唑。
CN201410426296.3A 2014-08-27 2014-08-27 一种pcb板表面处理工艺 Pending CN104270893A (zh)

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Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105208785A (zh) * 2015-08-07 2015-12-30 苏州晶雷光电照明科技有限公司 对制备led用pcb基板的清洗工艺
CN106255324A (zh) * 2016-08-22 2016-12-21 景旺电子科技(龙川)有限公司 一种提高金属基印制线路板电镀银表面亮度的方法
CN107278043A (zh) * 2017-08-15 2017-10-20 东莞塘厦裕华电路板有限公司 电路板抗氧化的生产工艺
CN109302809A (zh) * 2017-07-25 2019-02-01 王家富 一种印刷电路板表面处理工艺
CN111615270A (zh) * 2020-04-29 2020-09-01 东莞联桥电子有限公司 一种pcb板的全塞孔加工方法

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JPH067749A (ja) * 1992-06-29 1994-01-18 Hitachi Chem Co Ltd 金属はく張り積層板の洗浄方法及び洗浄装置
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CN102036485A (zh) * 2010-09-30 2011-04-27 北大方正集团有限公司 喷淋装置以及药水槽
CN102181866A (zh) * 2011-04-14 2011-09-14 惠州中京电子科技股份有限公司 铝基板表面粗化处理方法
CN102497734A (zh) * 2011-11-30 2012-06-13 景旺电子(深圳)有限公司 一种铝基覆铜板铝表面的处理方法
CN102548066A (zh) * 2012-02-08 2012-07-04 惠州中京电子科技股份有限公司 一种pcb板表面处理工艺

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JPH067749A (ja) * 1992-06-29 1994-01-18 Hitachi Chem Co Ltd 金属はく張り積層板の洗浄方法及び洗浄装置
CN101758338A (zh) * 2009-12-23 2010-06-30 长沙理工大学 一种有机保焊剂的低温增溶剂及其应用方法
CN102036485A (zh) * 2010-09-30 2011-04-27 北大方正集团有限公司 喷淋装置以及药水槽
CN102181866A (zh) * 2011-04-14 2011-09-14 惠州中京电子科技股份有限公司 铝基板表面粗化处理方法
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Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105208785A (zh) * 2015-08-07 2015-12-30 苏州晶雷光电照明科技有限公司 对制备led用pcb基板的清洗工艺
CN105208785B (zh) * 2015-08-07 2018-03-06 苏州晶雷光电照明科技有限公司 对制备led用pcb基板的清洗工艺
CN106255324A (zh) * 2016-08-22 2016-12-21 景旺电子科技(龙川)有限公司 一种提高金属基印制线路板电镀银表面亮度的方法
CN109302809A (zh) * 2017-07-25 2019-02-01 王家富 一种印刷电路板表面处理工艺
CN107278043A (zh) * 2017-08-15 2017-10-20 东莞塘厦裕华电路板有限公司 电路板抗氧化的生产工艺
CN111615270A (zh) * 2020-04-29 2020-09-01 东莞联桥电子有限公司 一种pcb板的全塞孔加工方法

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