JP2002266087A5 - - Google Patents

Info

Publication number

JP2002266087A5

JP2002266087A5 JP2001063714A JP2001063714A JP2002266087A5 JP 2002266087 A5 JP2002266087 A5 JP 2002266087A5 JP 2001063714 A JP2001063714 A JP 2001063714A JP 2001063714 A JP2001063714 A JP 2001063714A JP 2002266087 A5 JP2002266087 A5 JP 2002266087A5

Authority

JP

Japan

Prior art keywords

sulfate

copper

etching solution

solution according

hydrogen

Prior art date

2001-03-07

Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)

Pending

Links

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• RYGMFSIKBFXOCR-UHFFFAOYSA-N copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims 8
• 229910052802 copper Inorganic materials 0.000 claims 8
• 239000010949 copper Substances 0.000 claims 8
• 238000005530 etching Methods 0.000 claims 8
• ARUVKPQLZAKDPS-UHFFFAOYSA-L Copper(II) sulfate Chemical compound [Cu+2].[O-][S+2]([O-])([O-])[O-] ARUVKPQLZAKDPS-UHFFFAOYSA-L 0.000 claims 4
• QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 claims 4
• 229910000365 copper sulfate Inorganic materials 0.000 claims 4
• 238000004519 manufacturing process Methods 0.000 claims 4
• QAOWNCQODCNURD-UHFFFAOYSA-L sulfate Chemical compound [O-]S([O-])(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-L 0.000 claims 4
• 239000004020 conductor Substances 0.000 claims 3
• 239000011889 copper foil Substances 0.000 claims 3
• QAOWNCQODCNURD-UHFFFAOYSA-M hydrogensulfate Chemical compound OS([O-])(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-M 0.000 claims 3
• ZCDOYSPFYFSLEW-UHFFFAOYSA-N chromate(2-) Chemical compound [O-][Cr]([O-])(=O)=O ZCDOYSPFYFSLEW-UHFFFAOYSA-N 0.000 claims 2
• MHAJPDPJQMAIIY-UHFFFAOYSA-N hydrogen peroxide Chemical compound OO MHAJPDPJQMAIIY-UHFFFAOYSA-N 0.000 claims 2
• 229910052751 metal Inorganic materials 0.000 claims 2
• 239000002184 metal Substances 0.000 claims 2
• 238000000034 method Methods 0.000 claims 2
• CSNNHWWHGAXBCP-UHFFFAOYSA-L mgso4 Chemical compound [Mg+2].[O-][S+2]([O-])([O-])[O-] CSNNHWWHGAXBCP-UHFFFAOYSA-L 0.000 claims 2
• 239000011347 resin Substances 0.000 claims 2
• 229920005989 resin Polymers 0.000 claims 2
• -1 sulfate ions Chemical class 0.000 claims 2
• BAUYGSIQEAFULO-UHFFFAOYSA-L Iron(II) sulfate Chemical compound [Fe+2].[O-]S([O-])(=O)=O BAUYGSIQEAFULO-UHFFFAOYSA-L 0.000 claims 1
• NWONKYPBYAMBJT-UHFFFAOYSA-L Zinc sulfate Chemical compound [Zn+2].[O-]S([O-])(=O)=O NWONKYPBYAMBJT-UHFFFAOYSA-L 0.000 claims 1
• 229910052936 alkali metal sulfate Inorganic materials 0.000 claims 1
• 229910052784 alkaline earth metal Inorganic materials 0.000 claims 1
• 238000009713 electroplating Methods 0.000 claims 1
• UFHFLCQGNIYNRP-UHFFFAOYSA-N hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 claims 1
• 229910052739 hydrogen Inorganic materials 0.000 claims 1
• 239000001257 hydrogen Substances 0.000 claims 1
• 150000002500 ions Chemical class 0.000 claims 1
• 229910000358 iron sulfate Inorganic materials 0.000 claims 1
• 238000010030 laminating Methods 0.000 claims 1
• 229910052943 magnesium sulfate Inorganic materials 0.000 claims 1
• 235000019341 magnesium sulphate Nutrition 0.000 claims 1
• PMZURENOXWZQFD-UHFFFAOYSA-L na2so4 Chemical compound [Na+].[Na+].[O-]S([O-])(=O)=O PMZURENOXWZQFD-UHFFFAOYSA-L 0.000 claims 1
• 238000007747 plating Methods 0.000 claims 1
• 229910052938 sodium sulfate Inorganic materials 0.000 claims 1
• 235000011152 sodium sulphate Nutrition 0.000 claims 1
• 239000000758 substrate Substances 0.000 claims 1
• 150000003467 sulfuric acid derivatives Chemical class 0.000 claims 1
• 229960001763 zinc sulfate Drugs 0.000 claims 1
• 229910000368 zinc sulfate Inorganic materials 0.000 claims 1