EP1120477A2 - Verfahren zur Erzeugung einer Zinnschicht auf der inneren Oberfläche von Hohlbauteilen aus Kupferlegierungen - Google Patents
Verfahren zur Erzeugung einer Zinnschicht auf der inneren Oberfläche von Hohlbauteilen aus Kupferlegierungen Download PDFInfo
- Publication number
- EP1120477A2 EP1120477A2 EP00128764A EP00128764A EP1120477A2 EP 1120477 A2 EP1120477 A2 EP 1120477A2 EP 00128764 A EP00128764 A EP 00128764A EP 00128764 A EP00128764 A EP 00128764A EP 1120477 A2 EP1120477 A2 EP 1120477A2
- Authority
- EP
- European Patent Office
- Prior art keywords
- copper
- tin layer
- tin
- copper alloy
- hollow components
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 title claims abstract description 16
- 229910000881 Cu alloy Inorganic materials 0.000 title claims description 6
- 238000004519 manufacturing process Methods 0.000 title abstract description 4
- 229910001369 Brass Inorganic materials 0.000 claims abstract description 5
- 239000002253 acid Substances 0.000 claims abstract description 5
- 239000010951 brass Substances 0.000 claims abstract description 5
- VEXZGXHMUGYJMC-UHFFFAOYSA-M Chloride anion Chemical compound [Cl-] VEXZGXHMUGYJMC-UHFFFAOYSA-M 0.000 claims abstract description 4
- 230000001590 oxidative effect Effects 0.000 claims abstract description 4
- 229910052739 hydrogen Inorganic materials 0.000 claims abstract description 3
- 239000001257 hydrogen Substances 0.000 claims abstract description 3
- 238000000034 method Methods 0.000 claims description 14
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 11
- 239000010949 copper Substances 0.000 claims description 11
- 229910052802 copper Inorganic materials 0.000 claims description 11
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 6
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 claims description 4
- QAOWNCQODCNURD-UHFFFAOYSA-L Sulfate Chemical compound [O-]S([O-])(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-L 0.000 claims description 2
- 239000011260 aqueous acid Substances 0.000 claims description 2
- 125000004435 hydrogen atom Chemical class [H]* 0.000 claims 1
- 238000009434 installation Methods 0.000 abstract description 6
- 239000003651 drinking water Substances 0.000 abstract description 5
- 235000020188 drinking water Nutrition 0.000 abstract description 5
- -1 hydrogen acids Chemical class 0.000 abstract description 2
- JPVYNHNXODAKFH-UHFFFAOYSA-N Cu2+ Chemical compound [Cu+2] JPVYNHNXODAKFH-UHFFFAOYSA-N 0.000 description 5
- 229910001431 copper ion Inorganic materials 0.000 description 5
- 229910001432 tin ion Inorganic materials 0.000 description 4
- 238000005342 ion exchange Methods 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 239000000126 substance Substances 0.000 description 3
- 239000010953 base metal Substances 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 238000005238 degreasing Methods 0.000 description 2
- 238000005554 pickling Methods 0.000 description 2
- 208000036829 Device dislocation Diseases 0.000 description 1
- 229910000978 Pb alloy Inorganic materials 0.000 description 1
- 230000002378 acidificating effect Effects 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 238000005234 chemical deposition Methods 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 239000012459 cleaning agent Substances 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 238000006073 displacement reaction Methods 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 230000035699 permeability Effects 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/1803—Pretreatment of the material to be coated of metallic material surfaces or of a non-specific material surfaces
- C23C18/1824—Pretreatment of the material to be coated of metallic material surfaces or of a non-specific material surfaces by chemical pretreatment
- C23C18/1837—Multistep pretreatment
- C23C18/1844—Multistep pretreatment with use of organic or inorganic compounds other than metals, first
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/31—Coating with metals
Definitions
- the invention relates to a method for producing a copper solubility in Water-delimiting tin layer on the inner surface of hollow components such as Pipes, pipe connectors or fittings, made of a copper alloy, in particular made of gunmetal or brass.
- Installation components made of copper or copper alloys have been chosen for Tried and tested drinking water supply systems in domestic installations. At a limit value of the copper ion release of 2 mg / l to be observed at twelve hours Stagnation of water is sought, generally direct contact between copper and water to be avoided by an inner coating. For Ensuring water quality suitable for human consumption According to the Drinking Water Ordinance, tinned internally are preferred Installation components used.
- a common method of tinning the inside of copper pipes is the chemical deposition of tin on the inside surface of the copper pipes, as described, for example, in US Pat. No. 2,282,511.
- the copper pipe is flushed with a chemical tinning solution.
- Tin is then deposited by simple chemical metal displacement (ion exchange). Copper ions dissolve from the base metal and at the same time an equivalent amount of tin ions is deposited from the tinning solution. This is done under the influence of the potential between the - consists tinning solution and the copper. An external voltage or an electrical current is not required.
- Chemical tinning is characterized by its simple working method comparatively low cost of equipment. Also Can tin on the inside of hollow parts that are difficult to access be deposited.
- a disadvantage is the fact that the exchange of tin ions for Copper ions depending on the existing potential difference between the Tinning solution and the copper component expires.
- the deposition rate is increasing therefore depending on the applied layer thickness or Potential difference. This results in materials with inhomogeneous Surfaces to a disturbed layer structure. The reaction comes to a standstill, as soon as the base metal is completely covered by the coating.
- the invention is based on the object Process for internal tinning of hollow components made of copper alloys containing lead to show which larger tin layer thicknesses with improved adhesion enables.
- the essence of the invention is the measure that takes place on the inner surface lead and prevents the ion exchange of tin and copper ions corrosive by treatment with an aqueous acid-based reducing solution to remove or to achieve almost lead-free surfaces before these in one subsequent treatment step can be tinned chemically in the usual way.
- the method according to the invention is particularly suitable for internal tinning of installation components made of gunmetal or brass.
- the lead on the surface to be tinned which is mixed with usual
- the degreasing process, which cannot be eliminated, is targeted by the Treatment removed before tinning.
- chloride and sulfate-free non-oxidizing hydrogen acids as Reduction solution for use, as provided for in claim 2.
- the tin layer thicknesses achievable in the subsequent tinning process are well over 1 ⁇ m.
- the adhesion of the tin layer to the base material is also significantly improved.
- the permeability to lead of the tin layer is also clear decreased.
- the method according to the invention can be carried out in automated production processes perform economically.
- the hollow components are made as usual First degrease the inside with an alkaline or an acidic cleaning agent. After the degreasing process, the hollow components are rinsed with water. Here If necessary, a further pretreatment of the inner surface can occur Connect pickling. After pickling, it is optionally rinsed with fully desalinated Water.
Landscapes
- Chemical & Material Sciences (AREA)
- Mechanical Engineering (AREA)
- Organic Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- General Chemical & Material Sciences (AREA)
- Metallurgy (AREA)
- Inorganic Chemistry (AREA)
- Chemically Coating (AREA)
- Coating With Molten Metal (AREA)
- Shaping Metal By Deep-Drawing, Or The Like (AREA)
- Chemical Treatment Of Metals (AREA)
- Conductive Materials (AREA)
- Superconductors And Manufacturing Methods Therefor (AREA)
Abstract
Description
Claims (2)
- Verfahren zur Erzeugung einer die Kupferlöslichkeit in Wasser begrenzenden Zinnschicht an der inneren Oberfläche von Hohlbauteilen, wie Rohren, Rohrverbindern oder Armaturen, aus einer Kupferlegierung, insbesondere aus Rotguß oder Messing, bei welchem zunächst der Bleigehalt an der inneren Oberfläche der Hohlbauteile durch Behandlung mit einer wässrigen Reduktionslösung auf Säurebasis verringert wird, wobei als Reduktionslösung eine Wasserstoffsäure verwendet wird und anschließend die Hohlbauteile chemisch verzinnt werden.
- Verfahren nach Anspruch 1, bei welchem eine chlorid- und sulfatfreie nicht oxidierende Wasserstoffsäure als Reduktionslösung zur Anwendung gelangt.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DK00128764T DK1120477T3 (da) | 2000-01-28 | 2000-12-30 | Fremgangsmåde til opnåelse af et tinlag på den indvendige overflade af hulelementer af kobberlegeringer |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE10003582A DE10003582A1 (de) | 2000-01-28 | 2000-01-28 | Verfahren zur Erzeugung einer Zinnschicht auf der inneren Oberfläche von Hohlbauteilen aus Kupferlegierungen |
DE10003582 | 2000-01-28 |
Publications (3)
Publication Number | Publication Date |
---|---|
EP1120477A2 true EP1120477A2 (de) | 2001-08-01 |
EP1120477A3 EP1120477A3 (de) | 2002-06-12 |
EP1120477B1 EP1120477B1 (de) | 2005-05-25 |
Family
ID=7628943
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
EP00128764A Expired - Lifetime EP1120477B1 (de) | 2000-01-28 | 2000-12-30 | Verfahren zur Erzeugung einer Zinnschicht auf der inneren Oberfläche von Hohlbauteilen aus Kupferlegierungen |
Country Status (9)
Country | Link |
---|---|
US (1) | US6572754B2 (de) |
EP (1) | EP1120477B1 (de) |
JP (1) | JP2001288577A (de) |
AT (1) | ATE296364T1 (de) |
DE (2) | DE10003582A1 (de) |
DK (1) | DK1120477T3 (de) |
ES (1) | ES2238967T3 (de) |
HU (1) | HUP0100444A3 (de) |
PT (1) | PT1120477E (de) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE10213185A1 (de) * | 2002-03-23 | 2003-10-02 | Km Europa Metal Ag | Verfahren zur Verringerung der Kupferlöslichkeit an der inneren Oberfläche eines Kupferrohrs |
US7771542B1 (en) | 2006-05-30 | 2010-08-10 | Stone Chemical Company | Compositions and methods for removing lead from metal surfaces |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US2282511A (en) * | 1940-03-20 | 1942-05-12 | American Brass Co | Coating cupreous surfaces with tin |
EP0683245A1 (de) * | 1994-05-17 | 1995-11-22 | Imi Yorkshire Fittings Limited | Verfahren zur Behandlung von Komponenten einer Trinkwasserversorgungsanlage aus Legierungen auf Kupfer-Basis |
WO1997006313A1 (en) * | 1995-08-03 | 1997-02-20 | Europa Metalli S.P.A. | Low lead release plumbing components made of copper based alloys containing lead, and a method for obtaining the same |
Family Cites Families (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS56112496A (en) * | 1980-02-05 | 1981-09-04 | Mitsubishi Electric Corp | Plating method |
US4751049A (en) * | 1985-07-05 | 1988-06-14 | Shannon John K | Connector and alloy |
US5169692A (en) * | 1991-11-19 | 1992-12-08 | Shipley Company Inc. | Tin lead process |
US5211831A (en) * | 1991-11-27 | 1993-05-18 | Mcgean-Rohco, Inc. | Process for extending the life of a displacement plating bath |
JP3026527B2 (ja) * | 1992-07-27 | 2000-03-27 | 株式会社ジャパンエナジー | 無電解めっきの前処理方法および前処理液 |
JP2804722B2 (ja) * | 1994-10-26 | 1998-09-30 | 株式会社神戸製鋼所 | 銅又は銅合金管内面への錫めっき方法 |
EP0848084B1 (de) * | 1996-06-05 | 2002-10-09 | Sumitomo Light Metal Industries, Ltd. | Herstellungsverfahren zum zinnplattieren einer kupferröhre von innen |
JP3005469B2 (ja) * | 1996-06-05 | 2000-01-31 | 住友軽金属工業株式会社 | 内面スズめっき長尺銅管の製造方法 |
DE19653765A1 (de) * | 1996-12-23 | 1998-06-25 | Km Europa Metal Ag | Innen verzinntes Kupferrohr und Verfahren zur Beschichtung eines Kupferrohrs |
US6197210B1 (en) * | 1998-08-17 | 2001-03-06 | Gerber Plumbing Fixtures Corp. | Process for treating brass components to substantially eliminate leachabale lead |
-
2000
- 2000-01-28 DE DE10003582A patent/DE10003582A1/de not_active Withdrawn
- 2000-12-30 EP EP00128764A patent/EP1120477B1/de not_active Expired - Lifetime
- 2000-12-30 ES ES00128764T patent/ES2238967T3/es not_active Expired - Lifetime
- 2000-12-30 DK DK00128764T patent/DK1120477T3/da active
- 2000-12-30 DE DE50010390T patent/DE50010390D1/de not_active Expired - Fee Related
- 2000-12-30 PT PT00128764T patent/PT1120477E/pt unknown
- 2000-12-30 AT AT00128764T patent/ATE296364T1/de not_active IP Right Cessation
-
2001
- 2001-01-26 JP JP2001018310A patent/JP2001288577A/ja active Pending
- 2001-01-26 HU HU0100444A patent/HUP0100444A3/hu unknown
- 2001-01-29 US US09/772,331 patent/US6572754B2/en not_active Expired - Fee Related
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US2282511A (en) * | 1940-03-20 | 1942-05-12 | American Brass Co | Coating cupreous surfaces with tin |
EP0683245A1 (de) * | 1994-05-17 | 1995-11-22 | Imi Yorkshire Fittings Limited | Verfahren zur Behandlung von Komponenten einer Trinkwasserversorgungsanlage aus Legierungen auf Kupfer-Basis |
WO1997006313A1 (en) * | 1995-08-03 | 1997-02-20 | Europa Metalli S.P.A. | Low lead release plumbing components made of copper based alloys containing lead, and a method for obtaining the same |
Also Published As
Publication number | Publication date |
---|---|
HUP0100444A2 (hu) | 2001-12-28 |
JP2001288577A (ja) | 2001-10-19 |
PT1120477E (pt) | 2005-08-31 |
EP1120477A3 (de) | 2002-06-12 |
DE10003582A1 (de) | 2001-08-02 |
HU0100444D0 (en) | 2001-03-28 |
US20010010834A1 (en) | 2001-08-02 |
HUP0100444A3 (en) | 2003-02-28 |
DE50010390D1 (de) | 2005-06-30 |
DK1120477T3 (da) | 2005-09-26 |
US6572754B2 (en) | 2003-06-03 |
ATE296364T1 (de) | 2005-06-15 |
EP1120477B1 (de) | 2005-05-25 |
ES2238967T3 (es) | 2005-09-16 |
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