EP1120477A2 - Procédé de fabrication d'une couche d'étain sur la surface interne d'eléments creuses comportant un alliage de cuivre - Google Patents

Procédé de fabrication d'une couche d'étain sur la surface interne d'eléments creuses comportant un alliage de cuivre Download PDF

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Publication number
EP1120477A2
EP1120477A2 EP00128764A EP00128764A EP1120477A2 EP 1120477 A2 EP1120477 A2 EP 1120477A2 EP 00128764 A EP00128764 A EP 00128764A EP 00128764 A EP00128764 A EP 00128764A EP 1120477 A2 EP1120477 A2 EP 1120477A2
Authority
EP
European Patent Office
Prior art keywords
copper
tin layer
tin
copper alloy
hollow components
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
EP00128764A
Other languages
German (de)
English (en)
Other versions
EP1120477B1 (fr
EP1120477A3 (fr
Inventor
Ulrich Dr. Reiter
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
KM Europa Metal AG
Original Assignee
KM Europa Metal AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by KM Europa Metal AG filed Critical KM Europa Metal AG
Priority to DK00128764T priority Critical patent/DK1120477T3/da
Publication of EP1120477A2 publication Critical patent/EP1120477A2/fr
Publication of EP1120477A3 publication Critical patent/EP1120477A3/fr
Application granted granted Critical
Publication of EP1120477B1 publication Critical patent/EP1120477B1/fr
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18—Pretreatment of the material to be coated
    • C23C18/1803—Pretreatment of the material to be coated of metallic material surfaces or of a non-specific material surfaces
    • C23C18/1824—Pretreatment of the material to be coated of metallic material surfaces or of a non-specific material surfaces by chemical pretreatment
    • C23C18/1837—Multistep pretreatment
    • C23C18/1844—Multistep pretreatment with use of organic or inorganic compounds other than metals, first
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31—Coating with metals

Definitions

  • the invention relates to a method for producing a copper solubility in Water-delimiting tin layer on the inner surface of hollow components such as Pipes, pipe connectors or fittings, made of a copper alloy, in particular made of gunmetal or brass.
  • Installation components made of copper or copper alloys have been chosen for Tried and tested drinking water supply systems in domestic installations. At a limit value of the copper ion release of 2 mg / l to be observed at twelve hours Stagnation of water is sought, generally direct contact between copper and water to be avoided by an inner coating. For Ensuring water quality suitable for human consumption According to the Drinking Water Ordinance, tinned internally are preferred Installation components used.
  • a common method of tinning the inside of copper pipes is the chemical deposition of tin on the inside surface of the copper pipes, as described, for example, in US Pat. No. 2,282,511.
  • the copper pipe is flushed with a chemical tinning solution.
  • Tin is then deposited by simple chemical metal displacement (ion exchange). Copper ions dissolve from the base metal and at the same time an equivalent amount of tin ions is deposited from the tinning solution. This is done under the influence of the potential between the - consists tinning solution and the copper. An external voltage or an electrical current is not required.
  • Chemical tinning is characterized by its simple working method comparatively low cost of equipment. Also Can tin on the inside of hollow parts that are difficult to access be deposited.
  • a disadvantage is the fact that the exchange of tin ions for Copper ions depending on the existing potential difference between the Tinning solution and the copper component expires.
  • the deposition rate is increasing therefore depending on the applied layer thickness or Potential difference. This results in materials with inhomogeneous Surfaces to a disturbed layer structure. The reaction comes to a standstill, as soon as the base metal is completely covered by the coating.
  • the invention is based on the object Process for internal tinning of hollow components made of copper alloys containing lead to show which larger tin layer thicknesses with improved adhesion enables.
  • the essence of the invention is the measure that takes place on the inner surface lead and prevents the ion exchange of tin and copper ions corrosive by treatment with an aqueous acid-based reducing solution to remove or to achieve almost lead-free surfaces before these in one subsequent treatment step can be tinned chemically in the usual way.
  • the method according to the invention is particularly suitable for internal tinning of installation components made of gunmetal or brass.
  • the lead on the surface to be tinned which is mixed with usual
  • the degreasing process, which cannot be eliminated, is targeted by the Treatment removed before tinning.
  • chloride and sulfate-free non-oxidizing hydrogen acids as Reduction solution for use, as provided for in claim 2.
  • the tin layer thicknesses achievable in the subsequent tinning process are well over 1 ⁇ m.
  • the adhesion of the tin layer to the base material is also significantly improved.
  • the permeability to lead of the tin layer is also clear decreased.
  • the method according to the invention can be carried out in automated production processes perform economically.
  • the hollow components are made as usual First degrease the inside with an alkaline or an acidic cleaning agent. After the degreasing process, the hollow components are rinsed with water. Here If necessary, a further pretreatment of the inner surface can occur Connect pickling. After pickling, it is optionally rinsed with fully desalinated Water.

Landscapes

  • Chemical & Material Sciences (AREA)
  • Mechanical Engineering (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • General Chemical & Material Sciences (AREA)
  • Metallurgy (AREA)
  • Inorganic Chemistry (AREA)
  • Chemically Coating (AREA)
  • Coating With Molten Metal (AREA)
  • Superconductors And Manufacturing Methods Therefor (AREA)
  • Chemical Treatment Of Metals (AREA)
  • Conductive Materials (AREA)
  • Shaping Metal By Deep-Drawing, Or The Like (AREA)
EP00128764A 2000-01-28 2000-12-30 Procédé de fabrication d'une couche d'étain sur la surface interne d'eléments creux comportant un alliage de cuivre Expired - Lifetime EP1120477B1 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
DK00128764T DK1120477T3 (da) 2000-01-28 2000-12-30 Fremgangsmåde til opnåelse af et tinlag på den indvendige overflade af hulelementer af kobberlegeringer

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE10003582A DE10003582A1 (de) 2000-01-28 2000-01-28 Verfahren zur Erzeugung einer Zinnschicht auf der inneren Oberfläche von Hohlbauteilen aus Kupferlegierungen
DE10003582 2000-01-28

Publications (3)

Publication Number Publication Date
EP1120477A2 true EP1120477A2 (fr) 2001-08-01
EP1120477A3 EP1120477A3 (fr) 2002-06-12
EP1120477B1 EP1120477B1 (fr) 2005-05-25

Family

ID=7628943

Family Applications (1)

Application Number Title Priority Date Filing Date
EP00128764A Expired - Lifetime EP1120477B1 (fr) 2000-01-28 2000-12-30 Procédé de fabrication d'une couche d'étain sur la surface interne d'eléments creux comportant un alliage de cuivre

Country Status (9)

Country Link
US (1) US6572754B2 (fr)
EP (1) EP1120477B1 (fr)
JP (1) JP2001288577A (fr)
AT (1) ATE296364T1 (fr)
DE (2) DE10003582A1 (fr)
DK (1) DK1120477T3 (fr)
ES (1) ES2238967T3 (fr)
HU (1) HUP0100444A3 (fr)
PT (1) PT1120477E (fr)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE10213185A1 (de) * 2002-03-23 2003-10-02 Km Europa Metal Ag Verfahren zur Verringerung der Kupferlöslichkeit an der inneren Oberfläche eines Kupferrohrs
US7771542B1 (en) 2006-05-30 2010-08-10 Stone Chemical Company Compositions and methods for removing lead from metal surfaces

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2282511A (en) * 1940-03-20 1942-05-12 American Brass Co Coating cupreous surfaces with tin
EP0683245A1 (fr) * 1994-05-17 1995-11-22 Imi Yorkshire Fittings Limited Procédé de traitement de composants d'une installation d'alimentation d'eau potable fabriqués en un alliage de cuivre
WO1997006313A1 (fr) * 1995-08-03 1997-02-20 Europa Metalli S.P.A. Elements de plomberie a faible liberation de plomb constitues d'alliages a base de cuivre contenant du plomb et procede de fabrication correspondant

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS56112496A (en) * 1980-02-05 1981-09-04 Mitsubishi Electric Corp Plating method
US4751049A (en) * 1985-07-05 1988-06-14 Shannon John K Connector and alloy
US5169692A (en) * 1991-11-19 1992-12-08 Shipley Company Inc. Tin lead process
US5211831A (en) * 1991-11-27 1993-05-18 Mcgean-Rohco, Inc. Process for extending the life of a displacement plating bath
JP3026527B2 (ja) * 1992-07-27 2000-03-27 株式会社ジャパンエナジー 無電解めっきの前処理方法および前処理液
JP2804722B2 (ja) * 1994-10-26 1998-09-30 株式会社神戸製鋼所 銅又は銅合金管内面への錫めっき方法
US6045860A (en) * 1996-06-05 2000-04-04 Sumitomo Light Metal Industries, Ltd. Process for manufacturing interior tinned copper tube
JP3005469B2 (ja) * 1996-06-05 2000-01-31 住友軽金属工業株式会社 内面スズめっき長尺銅管の製造方法
DE19653765A1 (de) * 1996-12-23 1998-06-25 Km Europa Metal Ag Innen verzinntes Kupferrohr und Verfahren zur Beschichtung eines Kupferrohrs
US6197210B1 (en) * 1998-08-17 2001-03-06 Gerber Plumbing Fixtures Corp. Process for treating brass components to substantially eliminate leachabale lead

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2282511A (en) * 1940-03-20 1942-05-12 American Brass Co Coating cupreous surfaces with tin
EP0683245A1 (fr) * 1994-05-17 1995-11-22 Imi Yorkshire Fittings Limited Procédé de traitement de composants d'une installation d'alimentation d'eau potable fabriqués en un alliage de cuivre
WO1997006313A1 (fr) * 1995-08-03 1997-02-20 Europa Metalli S.P.A. Elements de plomberie a faible liberation de plomb constitues d'alliages a base de cuivre contenant du plomb et procede de fabrication correspondant

Also Published As

Publication number Publication date
ATE296364T1 (de) 2005-06-15
DK1120477T3 (da) 2005-09-26
EP1120477B1 (fr) 2005-05-25
US20010010834A1 (en) 2001-08-02
HU0100444D0 (en) 2001-03-28
JP2001288577A (ja) 2001-10-19
DE10003582A1 (de) 2001-08-02
US6572754B2 (en) 2003-06-03
EP1120477A3 (fr) 2002-06-12
PT1120477E (pt) 2005-08-31
HUP0100444A3 (en) 2003-02-28
HUP0100444A2 (hu) 2001-12-28
ES2238967T3 (es) 2005-09-16
DE50010390D1 (de) 2005-06-30

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