JP2002302789A5 - - Google Patents
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- Publication number
- JP2002302789A5 JP2002302789A5 JP2001316476A JP2001316476A JP2002302789A5 JP 2002302789 A5 JP2002302789 A5 JP 2002302789A5 JP 2001316476 A JP2001316476 A JP 2001316476A JP 2001316476 A JP2001316476 A JP 2001316476A JP 2002302789 A5 JP2002302789 A5 JP 2002302789A5
- Authority
- JP
- Japan
- Prior art keywords
- acid
- copper
- acids
- additives
- process according
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000000034 method Methods 0.000 claims 11
- 239000002253 acid Substances 0.000 claims 8
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims 5
- 229910052802 copper Inorganic materials 0.000 claims 5
- 239000010949 copper Substances 0.000 claims 5
- NBIIXXVUZAFLBC-UHFFFAOYSA-N Phosphoric acid Chemical compound OP(O)(O)=O NBIIXXVUZAFLBC-UHFFFAOYSA-N 0.000 claims 4
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 claims 4
- 150000007513 acids Chemical class 0.000 claims 4
- 239000000654 additive Substances 0.000 claims 4
- -1 alkyl sulfonic acids Chemical class 0.000 claims 4
- 150000001879 copper Chemical class 0.000 claims 4
- 150000007522 mineralic acids Chemical class 0.000 claims 4
- 150000007524 organic acids Chemical class 0.000 claims 4
- 238000009713 electroplating Methods 0.000 claims 3
- 239000004065 semiconductor Substances 0.000 claims 3
- RILZRCJGXSFXNE-UHFFFAOYSA-N 2-[4-(trifluoromethoxy)phenyl]ethanol Chemical compound OCCC1=CC=C(OC(F)(F)F)C=C1 RILZRCJGXSFXNE-UHFFFAOYSA-N 0.000 claims 2
- GRYLNZFGIOXLOG-UHFFFAOYSA-N Nitric acid Chemical compound O[N+]([O-])=O GRYLNZFGIOXLOG-UHFFFAOYSA-N 0.000 claims 2
- 229910000147 aluminium phosphate Inorganic materials 0.000 claims 2
- 150000001735 carboxylic acids Chemical class 0.000 claims 2
- 229910000365 copper sulfate Inorganic materials 0.000 claims 2
- XTVVROIMIGLXTD-UHFFFAOYSA-N copper(II) nitrate Chemical compound [Cu+2].[O-][N+]([O-])=O.[O-][N+]([O-])=O XTVVROIMIGLXTD-UHFFFAOYSA-N 0.000 claims 2
- ARUVKPQLZAKDPS-UHFFFAOYSA-L copper(II) sulfate Chemical group [Cu+2].[O-][S+2]([O-])([O-])[O-] ARUVKPQLZAKDPS-UHFFFAOYSA-L 0.000 claims 2
- OPQARKPSCNTWTJ-UHFFFAOYSA-L copper(ii) acetate Chemical compound [Cu+2].CC([O-])=O.CC([O-])=O OPQARKPSCNTWTJ-UHFFFAOYSA-L 0.000 claims 2
- 239000003792 electrolyte Substances 0.000 claims 2
- 239000003112 inhibitor Substances 0.000 claims 2
- 239000000203 mixture Substances 0.000 claims 2
- LNOPIUAQISRISI-UHFFFAOYSA-N n'-hydroxy-2-propan-2-ylsulfonylethanimidamide Chemical compound CC(C)S(=O)(=O)CC(N)=NO LNOPIUAQISRISI-UHFFFAOYSA-N 0.000 claims 2
- 229910017604 nitric acid Inorganic materials 0.000 claims 2
- 239000000080 wetting agent Substances 0.000 claims 2
- 238000000151 deposition Methods 0.000 claims 1
- 238000004519 manufacturing process Methods 0.000 claims 1
- 239000002184 metal Substances 0.000 claims 1
- 229910052751 metal Inorganic materials 0.000 claims 1
- 238000007747 plating Methods 0.000 claims 1
Applications Claiming Priority (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US24014200P | 2000-10-13 | 2000-10-13 | |
| US24064300P | 2000-10-16 | 2000-10-16 | |
| US60/240643 | 2000-10-16 | ||
| US60/240142 | 2000-10-16 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2002302789A JP2002302789A (ja) | 2002-10-18 |
| JP2002302789A5 true JP2002302789A5 (enExample) | 2005-06-30 |
Family
ID=26933186
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2001316476A Pending JP2002302789A (ja) | 2000-10-13 | 2001-10-15 | 電解質 |
Country Status (3)
| Country | Link |
|---|---|
| EP (1) | EP1197586A3 (enExample) |
| JP (1) | JP2002302789A (enExample) |
| KR (2) | KR20020029626A (enExample) |
Families Citing this family (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6858124B2 (en) * | 2002-12-16 | 2005-02-22 | 3M Innovative Properties Company | Methods for polishing and/or cleaning copper interconnects and/or film and compositions therefor |
| WO2005038088A1 (ja) * | 2003-10-20 | 2005-04-28 | Kansai Technology Licensing Organization Co., Ltd. | 無電解銅めっき液及びそれを用いた配線基板の製造方法 |
| US7282602B2 (en) * | 2004-09-21 | 2007-10-16 | Bionumerik Pharmaceuticals, Inc. | Medicinal disulfide salts |
| TWI400365B (zh) * | 2004-11-12 | 2013-07-01 | Enthone | 微電子裝置上的銅電沈積 |
| KR100688766B1 (ko) * | 2004-12-08 | 2007-03-02 | 삼성전기주식회사 | 초임계 유체를 이용한 인쇄회로기판의 동도금방법 |
| JP4750486B2 (ja) * | 2005-07-06 | 2011-08-17 | 株式会社Adeka | 電解銅メッキ用添加剤、該添加剤を含有する電解銅メッキ浴及び該メッキ浴を使用する電解銅メッキ方法 |
| WO2011001847A1 (ja) * | 2009-07-01 | 2011-01-06 | Jx日鉱日石金属株式会社 | Ｕｌｓｉ微細銅配線埋め込み用電気銅めっき液 |
| US11946153B2 (en) | 2019-02-01 | 2024-04-02 | Ishihara Chemical Co., Ltd. | Copper or copper alloy electroplating bath |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US2871173A (en) * | 1958-02-04 | 1959-01-27 | Seymour Mfg Company | Method of making ductile copper platings |
| SU1650786A1 (ru) * | 1987-05-19 | 1991-05-23 | Волгоградский инженерно-строительный институт | Электролит меднени |
| US5252196A (en) * | 1991-12-05 | 1993-10-12 | Shipley Company Inc. | Copper electroplating solutions and processes |
| KR20000057470A (ko) * | 1996-12-16 | 2000-09-15 | 포만 제프리 엘 | 집적 회로 칩 상의 전기 도금된 상호 접속 구조체 |
| US6024857A (en) * | 1997-10-08 | 2000-02-15 | Novellus Systems, Inc. | Electroplating additive for filling sub-micron features |
| US6113771A (en) * | 1998-04-21 | 2000-09-05 | Applied Materials, Inc. | Electro deposition chemistry |
| JP2000269217A (ja) | 1999-03-18 | 2000-09-29 | Kobe Steel Ltd | 銅配線膜の形成方法 |
-
2001
- 2001-10-12 KR KR1020010062915A patent/KR20020029626A/ko not_active Ceased
- 2001-10-12 EP EP01308710A patent/EP1197586A3/en not_active Withdrawn
- 2001-10-15 JP JP2001316476A patent/JP2002302789A/ja active Pending
-
2009
- 2009-02-27 KR KR1020090016864A patent/KR100971267B1/ko not_active Expired - Lifetime
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