Classifications

• • G—PHYSICS
  • G08—SIGNALLING
  • G08B—SIGNALLING OR CALLING SYSTEMS; ORDER TELEGRAPHS; ALARM SYSTEMS
  • G08B17/00—Fire alarms; Alarms responsive to explosion
  • G08B17/06—Electric actuation of the alarm, e.g. using a thermally-operated switch
• • C—CHEMISTRY; METALLURGY
  • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
  • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
  • C25D3/00—Electroplating: Baths therefor
  • C25D3/02—Electroplating: Baths therefor from solutions
  • C25D3/38—Electroplating: Baths therefor from solutions of copper
• • C—CHEMISTRY; METALLURGY
  • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
  • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
  • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
  • C25D5/48—After-treatment of electroplated surfaces
• • G—PHYSICS
  • G08—SIGNALLING
  • G08B—SIGNALLING OR CALLING SYSTEMS; ORDER TELEGRAPHS; ALARM SYSTEMS
  • G08B25/00—Alarm systems in which the location of the alarm condition is signalled to a central station, e.g. fire or police telegraphic systems
  • G08B25/01—Alarm systems in which the location of the alarm condition is signalled to a central station, e.g. fire or police telegraphic systems characterised by the transmission medium
  • G08B25/10—Alarm systems in which the location of the alarm condition is signalled to a central station, e.g. fire or police telegraphic systems characterised by the transmission medium using wireless transmission systems
• • G—PHYSICS
  • G08—SIGNALLING
  • G08B—SIGNALLING OR CALLING SYSTEMS; ORDER TELEGRAPHS; ALARM SYSTEMS
  • G08B3/00—Audible signalling systems; Audible personal calling systems
  • G08B3/10—Audible signalling systems; Audible personal calling systems using electric transmission; using electromagnetic transmission
  • G08B3/1008—Personal calling arrangements or devices, i.e. paging systems
  • G08B3/1016—Personal calling arrangements or devices, i.e. paging systems using wireless transmission
  • G08B3/1025—Paging receivers with audible signalling details
  • G08B3/1033—Paging receivers with audible signalling details with voice message alert
• • G—PHYSICS
  • G08—SIGNALLING
  • G08B—SIGNALLING OR CALLING SYSTEMS; ORDER TELEGRAPHS; ALARM SYSTEMS
  • G08B5/00—Visible signalling systems, e.g. personal calling systems, remote indication of seats occupied
  • G08B5/22—Visible signalling systems, e.g. personal calling systems, remote indication of seats occupied using electric transmission; using electromagnetic transmission
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
  • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
  • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
  • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
  • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
  • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
  • H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
  • H01L21/3205—Deposition of non-insulating-, e.g. conductive- or resistive-, layers on insulating layers; After-treatment of these layers
  • H01L21/321—After treatment
  • H01L21/32115—Planarisation
  • H01L21/3212—Planarisation by chemical mechanical polishing [CMP]
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
  • H01L23/00—Details of semiconductor or other solid state devices
  • H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
  • H01L23/522—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body
  • H01L23/532—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body characterised by the materials
  • H01L23/53204—Conductive materials
  • H01L23/53209—Conductive materials based on metals, e.g. alloys, metal silicides
  • H01L23/53228—Conductive materials based on metals, e.g. alloys, metal silicides the principal metal being copper
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
  • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
  • H01L2924/0001—Technical content checked by a classifier
  • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• • H—ELECTRICITY
  • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
  • H05K3/00—Apparatus or processes for manufacturing printed circuits
  • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
  • H05K3/42—Plated through-holes or plated via connections
  • H05K3/423—Plated through-holes or plated via connections characterised by electroplating method

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• Physics & Mathematics (AREA)
• Engineering & Computer Science (AREA)
• Chemical & Material Sciences (AREA)
• General Physics & Mathematics (AREA)
• Chemical Kinetics & Catalysis (AREA)
• Emergency Management (AREA)
• Electromagnetism (AREA)
• Business, Economics & Management (AREA)
• Computer Networks & Wireless Communication (AREA)
• Electrochemistry (AREA)
• Materials Engineering (AREA)
• Metallurgy (AREA)
• Organic Chemistry (AREA)
• Electroplating And Plating Baths Therefor (AREA)
• Electroplating Methods And Accessories (AREA)
• Electrodes Of Semiconductors (AREA)

Applications Claiming Priority (4)

Publications (2)

Family

ID=26933186

Family Applications (1)

Country Status (3)

Cited By (7)

Families Citing this family (1)

Family Cites Families (7)

• 2001
  • 2001-10-12 KR KR1020010062915A patent/KR20020029626A/ko not_active Ceased
  • 2001-10-12 EP EP01308710A patent/EP1197586A3/en not_active Withdrawn
  • 2001-10-15 JP JP2001316476A patent/JP2002302789A/ja active Pending
• 2009
  • 2009-02-27 KR KR1020090016864A patent/KR100971267B1/ko not_active Expired - Lifetime

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