KR20020029626A - 전해질 - Google Patents

전해질 Download PDF

Info

Publication number
KR20020029626A
KR20020029626A KR1020010062915A KR20010062915A KR20020029626A KR 20020029626 A KR20020029626 A KR 20020029626A KR 1020010062915 A KR1020010062915 A KR 1020010062915A KR 20010062915 A KR20010062915 A KR 20010062915A KR 20020029626 A KR20020029626 A KR 20020029626A
Authority
KR
South Korea
Prior art keywords
acids
acid
copper
group
ion source
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
KR1020010062915A
Other languages
English (en)
Korean (ko)
Inventor
모리세이데니스
미콜라로버트디.
칼버트제프리엠.
Original Assignee
마티네즈 길러모
쉬플리 캄파니, 엘.엘.씨.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 마티네즈 길러모, 쉬플리 캄파니, 엘.엘.씨. filed Critical 마티네즈 길러모
Publication of KR20020029626A publication Critical patent/KR20020029626A/ko
Ceased legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/38—Electroplating: Baths therefor from solutions of copper
    • G—PHYSICS
    • G08—SIGNALLING
    • G08B—SIGNALLING OR CALLING SYSTEMS; ORDER TELEGRAPHS; ALARM SYSTEMS
    • G08B17/00—Fire alarms; Alarms responsive to explosion
    • G08B17/06—Electric actuation of the alarm, e.g. using a thermally-operated switch
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/48—After-treatment of electroplated surfaces
    • G—PHYSICS
    • G08—SIGNALLING
    • G08B—SIGNALLING OR CALLING SYSTEMS; ORDER TELEGRAPHS; ALARM SYSTEMS
    • G08B25/00—Alarm systems in which the location of the alarm condition is signalled to a central station, e.g. fire or police telegraphic systems
    • G08B25/01—Alarm systems in which the location of the alarm condition is signalled to a central station, e.g. fire or police telegraphic systems characterised by the transmission medium
    • G08B25/10—Alarm systems in which the location of the alarm condition is signalled to a central station, e.g. fire or police telegraphic systems characterised by the transmission medium using wireless transmission systems
    • G—PHYSICS
    • G08—SIGNALLING
    • G08B—SIGNALLING OR CALLING SYSTEMS; ORDER TELEGRAPHS; ALARM SYSTEMS
    • G08B3/00—Audible signalling systems; Audible personal calling systems
    • G08B3/10—Audible signalling systems; Audible personal calling systems using electric transmission; using electromagnetic transmission
    • G08B3/1008—Personal calling arrangements or devices, i.e. paging systems
    • G08B3/1016—Personal calling arrangements or devices, i.e. paging systems using wireless transmission
    • G08B3/1025—Paging receivers with audible signalling details
    • G08B3/1033—Paging receivers with audible signalling details with voice message alert
    • G—PHYSICS
    • G08—SIGNALLING
    • G08B—SIGNALLING OR CALLING SYSTEMS; ORDER TELEGRAPHS; ALARM SYSTEMS
    • G08B5/00—Visible signalling systems, e.g. personal calling systems, remote indication of seats occupied
    • G08B5/22—Visible signalling systems, e.g. personal calling systems, remote indication of seats occupied using electric transmission; using electromagnetic transmission
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
    • H01L21/3205—Deposition of non-insulating-, e.g. conductive- or resistive-, layers on insulating layers; After-treatment of these layers
    • H01L21/321—After treatment
    • H01L21/32115—Planarisation
    • H01L21/3212—Planarisation by chemical mechanical polishing [CMP]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
    • H01L23/522—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body
    • H01L23/532—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body characterised by the materials
    • H01L23/53204—Conductive materials
    • H01L23/53209—Conductive materials based on metals, e.g. alloys, metal silicides
    • H01L23/53228—Conductive materials based on metals, e.g. alloys, metal silicides the principal metal being copper
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H05K3/423—Plated through-holes or plated via connections characterised by electroplating method

Landscapes

  • Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Business, Economics & Management (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Computer Networks & Wireless Communication (AREA)
  • Materials Engineering (AREA)
  • Emergency Management (AREA)
  • Electrochemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electromagnetism (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Electrodes Of Semiconductors (AREA)
KR1020010062915A 2000-10-13 2001-10-12 전해질 Ceased KR20020029626A (ko)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
US24014200P 2000-10-13 2000-10-13
US60/240,142 2000-10-13
US24064300P 2000-10-16 2000-10-16
US60/240,643 2000-10-16

Related Child Applications (1)

Application Number Title Priority Date Filing Date
KR1020090016864A Division KR100971267B1 (ko) 2000-10-13 2009-02-27 전해질

Publications (1)

Publication Number Publication Date
KR20020029626A true KR20020029626A (ko) 2002-04-19

Family

ID=26933186

Family Applications (2)

Application Number Title Priority Date Filing Date
KR1020010062915A Ceased KR20020029626A (ko) 2000-10-13 2001-10-12 전해질
KR1020090016864A Expired - Lifetime KR100971267B1 (ko) 2000-10-13 2009-02-27 전해질

Family Applications After (1)

Application Number Title Priority Date Filing Date
KR1020090016864A Expired - Lifetime KR100971267B1 (ko) 2000-10-13 2009-02-27 전해질

Country Status (3)

Country Link
EP (1) EP1197586A3 (enExample)
JP (1) JP2002302789A (enExample)
KR (2) KR20020029626A (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100688766B1 (ko) * 2004-12-08 2007-03-02 삼성전기주식회사 초임계 유체를 이용한 인쇄회로기판의 동도금방법

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6858124B2 (en) * 2002-12-16 2005-02-22 3M Innovative Properties Company Methods for polishing and/or cleaning copper interconnects and/or film and compositions therefor
WO2005038088A1 (ja) * 2003-10-20 2005-04-28 Kansai Technology Licensing Organization Co., Ltd. 無電解銅めっき液及びそれを用いた配線基板の製造方法
US7282602B2 (en) * 2004-09-21 2007-10-16 Bionumerik Pharmaceuticals, Inc. Medicinal disulfide salts
TWI400365B (zh) * 2004-11-12 2013-07-01 Enthone 微電子裝置上的銅電沈積
JP4750486B2 (ja) * 2005-07-06 2011-08-17 株式会社Adeka 電解銅メッキ用添加剤、該添加剤を含有する電解銅メッキ浴及び該メッキ浴を使用する電解銅メッキ方法
WO2011001847A1 (ja) * 2009-07-01 2011-01-06 Jx日鉱日石金属株式会社 Ｕｌｓｉ微細銅配線埋め込み用電気銅めっき液
US11946153B2 (en) 2019-02-01 2024-04-02 Ishihara Chemical Co., Ltd. Copper or copper alloy electroplating bath

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2871173A (en) * 1958-02-04 1959-01-27 Seymour Mfg Company Method of making ductile copper platings
SU1650786A1 (ru) * 1987-05-19 1991-05-23 Волгоградский инженерно-строительный институт Электролит меднени
US5252196A (en) * 1991-12-05 1993-10-12 Shipley Company Inc. Copper electroplating solutions and processes
KR20000057470A (ko) * 1996-12-16 2000-09-15 포만 제프리 엘 집적 회로 칩 상의 전기 도금된 상호 접속 구조체
US6024857A (en) * 1997-10-08 2000-02-15 Novellus Systems, Inc. Electroplating additive for filling sub-micron features
US6113771A (en) * 1998-04-21 2000-09-05 Applied Materials, Inc. Electro deposition chemistry
JP2000269217A (ja) 1999-03-18 2000-09-29 Kobe Steel Ltd 銅配線膜の形成方法

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100688766B1 (ko) * 2004-12-08 2007-03-02 삼성전기주식회사 초임계 유체를 이용한 인쇄회로기판의 동도금방법

Also Published As

Publication number Publication date
KR20090031539A (ko) 2009-03-26
KR100971267B1 (ko) 2010-07-20
EP1197586A3 (en) 2002-09-25
EP1197586A2 (en) 2002-04-17
JP2002302789A (ja) 2002-10-18

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