IL130138A - Composition and slurry useful for metal chemical mechanical polishing - Google Patents

Composition and slurry useful for metal chemical mechanical polishing

Info

Publication number
IL130138A
IL130138A IL13013897A IL13013897A IL130138A IL 130138 A IL130138 A IL 130138A IL 13013897 A IL13013897 A IL 13013897A IL 13013897 A IL13013897 A IL 13013897A IL 130138 A IL130138 A IL 130138A
Authority
IL
Israel
Prior art keywords
composition
mechanical polishing
chemical mechanical
useful
metal chemical
Prior art date
Application number
IL13013897A
Other languages
English (en)
Other versions
IL130138A0 (en
Original Assignee
Cabot Microelectronics Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=27419449&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=IL130138(A) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Priority claimed from US08/753,482 external-priority patent/US5958288A/en
Application filed by Cabot Microelectronics Corp filed Critical Cabot Microelectronics Corp
Priority to IL15384397A priority Critical patent/IL153843A0/xx
Publication of IL130138A0 publication Critical patent/IL130138A0/xx
Publication of IL130138A publication Critical patent/IL130138A/xx

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K3/00—Materials not provided for elsewhere
    • C09K3/14—Anti-slip materials; Abrasives
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
    • C23F3/00—Brightening metals by chemical means
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09G—POLISHING COMPOSITIONS; SKI WAXES
    • C09G1/00—Polishing compositions
    • C09G1/02—Polishing compositions containing abrasives or grinding agents
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
    • H01L21/3205—Deposition of non-insulating-, e.g. conductive- or resistive-, layers on insulating layers; After-treatment of these layers
    • H01L21/321—After treatment
    • H01L21/32115—Planarisation
    • H01L21/3212—Planarisation by chemical mechanical polishing [CMP]

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Organic Chemistry (AREA)
  • Materials Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Metallurgy (AREA)
  • General Chemical & Material Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Mechanical Engineering (AREA)
  • Power Engineering (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Manufacture And Refinement Of Metals (AREA)
  • Catalysts (AREA)
  • ing And Chemical Polishing (AREA)
  • Pharmaceuticals Containing Other Organic And Inorganic Compounds (AREA)
  • Acyclic And Carbocyclic Compounds In Medicinal Compositions (AREA)
IL13013897A 1996-11-26 1997-11-21 Composition and slurry useful for metal chemical mechanical polishing IL130138A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
IL15384397A IL153843A0 (en) 1996-11-26 1997-11-21 Chemical mechanical metal polishing precursor compositions and method of polishing therewith

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
US08/753,482 US5958288A (en) 1996-11-26 1996-11-26 Composition and slurry useful for metal CMP
US08/827,918 US5980775A (en) 1996-11-26 1997-04-08 Composition and slurry useful for metal CMP
US08/891,468 US6068787A (en) 1996-11-26 1997-07-11 Composition and slurry useful for metal CMP
PCT/US1997/022083 WO1998023408A1 (en) 1996-11-26 1997-11-21 A composition and slurry useful for metal cmp

Publications (2)

Publication Number Publication Date
IL130138A0 IL130138A0 (en) 2001-01-28
IL130138A true IL130138A (en) 2003-03-12

Family

ID=27419449

Family Applications (1)

Application Number Title Priority Date Filing Date
IL13013897A IL130138A (en) 1996-11-26 1997-11-21 Composition and slurry useful for metal chemical mechanical polishing

Country Status (14)

Country Link
US (1) US6068787A (de)
EP (1) EP0844290B1 (de)
JP (1) JP3822339B2 (de)
KR (2) KR100745447B1 (de)
CN (1) CN1131125C (de)
AT (1) ATE214417T1 (de)
AU (1) AU5464298A (de)
DE (1) DE69710993T2 (de)
ES (1) ES2174192T3 (de)
HK (1) HK1022661A1 (de)
ID (1) ID23676A (de)
IL (1) IL130138A (de)
TW (1) TW396201B (de)
WO (1) WO1998023408A1 (de)

Families Citing this family (172)

* Cited by examiner, † Cited by third party
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WO1998023408A1 (en) 1998-06-04
DE69710993T2 (de) 2002-11-28
ATE214417T1 (de) 2002-03-15
TW396201B (en) 2000-07-01
HK1022661A1 (en) 2000-08-18
US6068787A (en) 2000-05-30
KR20060087359A (ko) 2006-08-02
EP0844290A1 (de) 1998-05-27
JPH10265766A (ja) 1998-10-06
ID23676A (id) 2000-05-11
DE69710993D1 (de) 2002-04-18
CN1242729A (zh) 2000-01-26
IL130138A0 (en) 2001-01-28
ES2174192T3 (es) 2002-11-01
AU5464298A (en) 1998-06-22
KR100745447B1 (ko) 2007-10-16
JP3822339B2 (ja) 2006-09-20

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