ID25443A - PERKAKAS UNTUK MENIKAT PENURUNAN PNAS SECARA LANGSUNG PADA MODUL-MODUL PEMBAWA CHIP DENGAN MENGGUNAKAN EPOKSI LENTUR (Pecahan dari NO. P950732) - Google Patents

PERKAKAS UNTUK MENIKAT PENURUNAN PNAS SECARA LANGSUNG PADA MODUL-MODUL PEMBAWA CHIP DENGAN MENGGUNAKAN EPOKSI LENTUR (Pecahan dari NO. P950732)

Info

Publication number
ID25443A
ID25443A IDP20000416D ID20000416D ID25443A ID 25443 A ID25443 A ID 25443A ID P20000416 D IDP20000416 D ID P20000416D ID 20000416 D ID20000416 D ID 20000416D ID 25443 A ID25443 A ID 25443A
Authority
ID
Indonesia
Prior art keywords
flexible
cycles
epocess
flex
tools
Prior art date
Application number
IDP20000416D
Other languages
English (en)
Inventor
Thomas Moran Culnane
Michael Anthony Gaynes
Ping Kwang Seto
Hussain Shaukatullah
Original Assignee
Ibm
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ibm filed Critical Ibm
Publication of ID25443A publication Critical patent/ID25443A/id

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H01L21/563—Encapsulation of active face of flip-chip device, e.g. underfilling or underencapsulation of flip-chip, encapsulation preform on chip or mounting substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
    • H01L23/3121—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed a substrate forming part of the encapsulation
    • H01L23/3128—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed a substrate forming part of the encapsulation the substrate having spherical bumps for external connection
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • H01L23/3737—Organic materials with or without a thermoconductive filler
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H01L2224/321—Disposition
    • H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/32225—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73201—Location after the connecting process on the same surface
    • H01L2224/73203—Bump and layer connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73201—Location after the connecting process on the same surface
    • H01L2224/73203—Bump and layer connectors
    • H01L2224/73204—Bump and layer connectors the bump connector being embedded into the layer connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73253—Bump and layer connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/42—Wire connectors; Manufacturing methods related thereto
    • H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L24/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01078—Platinum [Pt]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/013—Alloys
    • H01L2924/0132—Binary Alloys
    • H01L2924/01322—Eutectic Alloys, i.e. obtained by a liquid transforming into two solid phases
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/102—Material of the semiconductor or solid state bodies
    • H01L2924/1025—Semiconducting materials
    • H01L2924/10251—Elemental semiconductors, i.e. Group IV
    • H01L2924/10253—Silicon [Si]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/12—Passive devices, e.g. 2 terminal devices
    • H01L2924/1204—Optical Diode
    • H01L2924/12042—LASER
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/12—Passive devices, e.g. 2 terminal devices
    • H01L2924/1204—Optical Diode
    • H01L2924/12044—OLED
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/1515—Shape
    • H01L2924/15153—Shape the die mounting substrate comprising a recess for hosting the device
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/1517—Multilayer substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/153—Connection portion
    • H01L2924/1531—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface
    • H01L2924/15311—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface being a ball array, e.g. BGA
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/153—Connection portion
    • H01L2924/1531—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface
    • H01L2924/15312—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface being a pin array, e.g. PGA
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/153—Connection portion
    • H01L2924/1532—Connection portion the connection portion being formed on the die mounting surface of the substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/156—Material
    • H01L2924/157—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof
    • H01L2924/15738—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950 C and less than 1550 C
    • H01L2924/15747—Copper [Cu] as principal constituent
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/161—Cap
    • H01L2924/1615—Shape
    • H01L2924/16195—Flat cap [not enclosing an internal cavity]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Power Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Laminated Bodies (AREA)
  • Adhesives Or Adhesive Processes (AREA)
IDP20000416D 1994-07-11 1995-05-11 PERKAKAS UNTUK MENIKAT PENURUNAN PNAS SECARA LANGSUNG PADA MODUL-MODUL PEMBAWA CHIP DENGAN MENGGUNAKAN EPOKSI LENTUR (Pecahan dari NO. P950732) ID25443A (id)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US27325394A 1994-07-11 1994-07-11

Publications (1)

Publication Number Publication Date
ID25443A true ID25443A (id) 1996-02-01

Family

ID=23043180

Family Applications (1)

Application Number Title Priority Date Filing Date
IDP20000416D ID25443A (id) 1994-07-11 1995-05-11 PERKAKAS UNTUK MENIKAT PENURUNAN PNAS SECARA LANGSUNG PADA MODUL-MODUL PEMBAWA CHIP DENGAN MENGGUNAKAN EPOKSI LENTUR (Pecahan dari NO. P950732)

Country Status (6)

Country Link
US (3) US5744863A (id)
JP (1) JP3392590B2 (id)
CN (2) CN1112728C (id)
ID (1) ID25443A (id)
MY (1) MY112145A (id)
SG (1) SG45096A1 (id)

Families Citing this family (228)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
MY112145A (en) * 1994-07-11 2001-04-30 Ibm Direct attachment of heat sink attached directly to flip chip using flexible epoxy
US5972736A (en) * 1994-12-21 1999-10-26 Sun Microsystems, Inc. Integrated circuit package and method
US5745344A (en) * 1995-11-06 1998-04-28 International Business Machines Corporation Heat dissipation apparatus and method for attaching a heat dissipation apparatus to an electronic device
US5706171A (en) * 1995-11-20 1998-01-06 International Business Machines Corporation Flat plate cooling using a thermal paste retainer
US5977629A (en) 1996-01-24 1999-11-02 Micron Technology, Inc. Condensed memory matrix
US6339875B1 (en) 1996-04-08 2002-01-22 Heat Technology, Inc. Method for removing heat from an integrated circuit
JPH09293808A (ja) * 1996-04-25 1997-11-11 Fujitsu Ltd 半導体装置
US5866953A (en) * 1996-05-24 1999-02-02 Micron Technology, Inc. Packaged die on PCB with heat sink encapsulant
JP3321357B2 (ja) * 1996-05-30 2002-09-03 株式会社東芝 半導体装置とその組み立て方法
US5726079A (en) * 1996-06-19 1998-03-10 International Business Machines Corporation Thermally enhanced flip chip package and method of forming
USRE39426E1 (en) 1996-06-19 2006-12-12 International Business Machines Corporation Thermally enhanced flip chip package and method of forming
US5956576A (en) * 1996-09-13 1999-09-21 International Business Machines Corporation Enhanced protection of semiconductors with dual surface seal
US5854512A (en) * 1996-09-20 1998-12-29 Vlsi Technology, Inc. High density leaded ball-grid array package
US6027791A (en) * 1996-09-30 2000-02-22 Kyocera Corporation Structure for mounting a wiring board
US6392431B1 (en) * 1996-10-23 2002-05-21 Aetrium, Inc. Flexibly suspended heat exchange head for a DUT
TW480636B (en) 1996-12-04 2002-03-21 Seiko Epson Corp Electronic component and semiconductor device, method for manufacturing and mounting thereof, and circuit board and electronic equipment
CN100474543C (zh) * 1996-12-04 2009-04-01 精工爱普生株式会社 半导体装置及其制造方法
TW571373B (en) 1996-12-04 2004-01-11 Seiko Epson Corp Semiconductor device, circuit substrate, and electronic machine
US6020221A (en) * 1996-12-12 2000-02-01 Lsi Logic Corporation Process for manufacturing a semiconductor device having a stiffener member
US5891753A (en) * 1997-01-24 1999-04-06 Micron Technology, Inc. Method and apparatus for packaging flip chip bare die on printed circuit boards
US6489668B1 (en) * 1997-03-24 2002-12-03 Seiko Epson Corporation Semiconductor device and method for manufacturing the same
JP2914342B2 (ja) * 1997-03-28 1999-06-28 日本電気株式会社 集積回路装置の冷却構造
US5900675A (en) * 1997-04-21 1999-05-04 International Business Machines Corporation Organic controlled collapse chip connector (C4) ball grid array (BGA) chip carrier with dual thermal expansion rates
US5889652A (en) * 1997-04-21 1999-03-30 Intel Corporation C4-GT stand off rigid flex interposer
US6104093A (en) * 1997-04-24 2000-08-15 International Business Machines Corporation Thermally enhanced and mechanically balanced flip chip package and method of forming
US6037659A (en) * 1997-04-28 2000-03-14 Hewlett-Packard Company Composite thermal interface pad
EP0932198B1 (en) * 1997-05-09 2015-12-09 Citizen Holdings Co., Ltd. Process for manufacturing semiconductor package and circuit board assembly
US5940687A (en) * 1997-06-06 1999-08-17 International Business Machines Corporation Wire mesh insert for thermal adhesives
US5866943A (en) * 1997-06-23 1999-02-02 Lsi Logic Corporation System and method for forming a grid array device package employing electomagnetic shielding
KR100320983B1 (ko) 1997-08-22 2002-06-20 포만 제프리 엘 칩조립체및직접적인개방열전도성경로의제공방법
US6317333B1 (en) * 1997-08-28 2001-11-13 Mitsubishi Denki Kabushiki Kaisha Package construction of semiconductor device
US6002171A (en) * 1997-09-22 1999-12-14 Lsi Logic Corporation Integrated heat spreader/stiffener assembly and method of assembly for semiconductor package
US5909057A (en) * 1997-09-23 1999-06-01 Lsi Logic Corporation Integrated heat spreader/stiffener with apertures for semiconductor package
US6178628B1 (en) * 1997-10-22 2001-01-30 Aavid Thermalloy, Llc Apparatus and method for direct attachment of heat sink to surface mount
US6705388B1 (en) 1997-11-10 2004-03-16 Parker-Hannifin Corporation Non-electrically conductive thermal dissipator for electronic components
JP2001523047A (ja) * 1997-11-10 2001-11-20 パーカー−ハニフイン・コーポレーシヨン 非導電性熱放散器構成要素
US6432744B1 (en) * 1997-11-20 2002-08-13 Texas Instruments Incorporated Wafer-scale assembly of chip-size packages
JPH11186003A (ja) 1997-12-25 1999-07-09 Yazaki Corp Ｐｔｃ素子の放熱構造
US6049125A (en) * 1997-12-29 2000-04-11 Micron Technology, Inc. Semiconductor package with heat sink and method of fabrication
JP3219043B2 (ja) * 1998-01-07 2001-10-15 日本電気株式会社 半導体装置のパッケージ方法および半導体装置
US5955781A (en) * 1998-01-13 1999-09-21 International Business Machines Corporation Embedded thermal conductors for semiconductor chips
US6002165A (en) * 1998-02-23 1999-12-14 Micron Technology, Inc. Multilayered lead frame for semiconductor packages
US6281573B1 (en) 1998-03-31 2001-08-28 International Business Machines Corporation Thermal enhancement approach using solder compositions in the liquid state
US6297550B1 (en) * 1998-04-01 2001-10-02 Lsi Logic Corporation Bondable anodized aluminum heatspreader for semiconductor packages
TW366548B (en) * 1998-04-18 1999-08-11 United Microelectronics Corp Trench bump block and the application of the same
JPH11307719A (ja) * 1998-04-20 1999-11-05 Mitsubishi Electric Corp 半導体装置
US6140707A (en) * 1998-05-07 2000-10-31 3M Innovative Properties Co. Laminated integrated circuit package
US5923958A (en) * 1998-05-28 1999-07-13 Pan Pacific Semiconductor Co., Ltd. Method for semiconductor chip packaging
US6075288A (en) * 1998-06-08 2000-06-13 Micron Technology, Inc. Semiconductor package having interlocking heat sinks and method of fabrication
JP3070579B2 (ja) * 1998-06-10 2000-07-31 日本電気株式会社 半導体装置の実装構造および実装方法
EP0969704A1 (en) * 1998-06-18 2000-01-05 TRW Inc. Method for reversibly bonding electronics packages in thermal and electrical contact with a surface
US6081037A (en) * 1998-06-22 2000-06-27 Motorola, Inc. Semiconductor component having a semiconductor chip mounted to a chip mount
US6409859B1 (en) * 1998-06-30 2002-06-25 Amerasia International Technology, Inc. Method of making a laminated adhesive lid, as for an Electronic device
US6215175B1 (en) 1998-07-06 2001-04-10 Micron Technology, Inc. Semiconductor package having metal foil die mounting plate
WO2000005748A2 (en) * 1998-07-22 2000-02-03 Digirad Corporation Blind pin placement on circuit boards
US6117797A (en) 1998-09-03 2000-09-12 Micron Technology, Inc. Attachment method for heat sinks and devices involving removal of misplaced encapsulant
US6498390B1 (en) * 1998-09-16 2002-12-24 Intel Corporation Integrated circuit package that includes a thermally conductive tape which attaches a thermal element to a plastic housing
US6255140B1 (en) * 1998-10-19 2001-07-03 Industrial Technology Research Institute Flip chip chip-scale package
US6118177A (en) * 1998-11-17 2000-09-12 Lucent Technologies, Inc. Heatspreader for a flip chip device, and method for connecting the heatspreader
US6552425B1 (en) 1998-12-18 2003-04-22 Intel Corporation Integrated circuit package
US6197619B1 (en) * 1999-01-28 2001-03-06 International Business Machines Corporation Method for reinforcing a semiconductor device to prevent cracking
US6206997B1 (en) 1999-02-11 2001-03-27 International Business Machines Corporation Method for bonding heat sinks to overmolds and device formed thereby
US20020145207A1 (en) * 1999-03-05 2002-10-10 Anderson Sidney Larry Method and structure for integrated circuit package
US6380618B1 (en) * 1999-03-15 2002-04-30 Advanced Micro Devices, Inc. Fabrication of integrated circuits on both sides of a semiconductor wafer
JP3428488B2 (ja) * 1999-04-12 2003-07-22 株式会社村田製作所 電子部品の製造方法
US6531771B1 (en) 1999-04-20 2003-03-11 Tyco Electronics Corporation Dissipation of heat from a circuit board having bare silicon chips mounted thereon
US6162663A (en) * 1999-04-20 2000-12-19 Schoenstein; Paul G. Dissipation of heat from a circuit board having bare silicon chips mounted thereon
US6219238B1 (en) 1999-05-10 2001-04-17 International Business Machines Corporation Structure for removably attaching a heat sink to surface mount packages
US6376769B1 (en) * 1999-05-18 2002-04-23 Amerasia International Technology, Inc. High-density electronic package, and method for making same
US6137174A (en) * 1999-05-26 2000-10-24 Chipmos Technologies Inc. Hybrid ASIC/memory module package
DE19924289A1 (de) 1999-05-27 2000-12-07 Siemens Ag Elektronisches Schaltungsmodul mit flexibler Zwischenschicht zwischen elektronischen Bauelementen und einem Kühlkörper
US6717819B1 (en) * 1999-06-01 2004-04-06 Amerasia International Technology, Inc. Solderable flexible adhesive interposer as for an electronic package, and method for making same
US6188130B1 (en) * 1999-06-14 2001-02-13 Advanced Technology Interconnect Incorporated Exposed heat spreader with seal ring
US6544880B1 (en) * 1999-06-14 2003-04-08 Micron Technology, Inc. Method of improving copper interconnects of semiconductor devices for bonding
US6255143B1 (en) * 1999-08-04 2001-07-03 St. Assembly Test Services Pte Ltd. Flip chip thermally enhanced ball grid array
TW561799B (en) 1999-08-11 2003-11-11 Fujikura Ltd Chip assembly module of bump connection type using a multi-layer printed circuit substrate
JP3414342B2 (ja) * 1999-11-25 2003-06-09 日本電気株式会社 集積回路チップの実装構造および実装方法
US6648045B2 (en) * 1999-11-30 2003-11-18 Toray Engineering Co., Ltd. Chip bonding apparatus
US6338196B1 (en) * 1999-12-15 2002-01-15 Auer Precision Company, Inc Method of forming heat sinks having fully anodized surfaces
US6763881B1 (en) * 2000-02-18 2004-07-20 Agilent Technologies, Inc. Thermally matched gradient heat sink
US6567541B1 (en) * 2000-02-25 2003-05-20 Ahbee 1, L.P. Method and apparatus for adhesion testing of thin film materials
US6372997B1 (en) 2000-02-25 2002-04-16 Thermagon, Inc. Multi-layer structure and method for forming a thermal interface with low contact resistance between a microelectronic component package and heat sink
US6580031B2 (en) 2000-03-14 2003-06-17 Amerasia International Technology, Inc. Method for making a flexible circuit interposer having high-aspect ratio conductors
US6364669B1 (en) * 2000-07-12 2002-04-02 Advanced Micro Devices, Inc. Spring contact for providing high current power to an integrated circuit
JP2002033411A (ja) * 2000-07-13 2002-01-31 Nec Corp ヒートスプレッダ付き半導体装置及びその製造方法
US6724078B1 (en) 2000-08-31 2004-04-20 Intel Corporation Electronic assembly comprising solderable thermal interface
US6614103B1 (en) * 2000-09-01 2003-09-02 General Electric Company Plastic packaging of LED arrays
US6787388B1 (en) * 2000-09-07 2004-09-07 Stmicroelectronics, Inc. Surface mount package with integral electro-static charge dissipating ring using lead frame as ESD device
KR20020029990A (ko) * 2000-10-16 2002-04-22 윤종용 실장리드가 구비된 기판을 포함하는 반도체 패키지 및 그제조방법
JP2002170739A (ja) * 2000-11-29 2002-06-14 Murata Mfg Co Ltd 積層セラミックコンデンサモジュール
EP1346411A2 (en) 2000-12-01 2003-09-24 Broadcom Corporation Thermally and electrically enhanced ball grid array packaging
US6906414B2 (en) * 2000-12-22 2005-06-14 Broadcom Corporation Ball grid array package with patterned stiffener layer
US7161239B2 (en) * 2000-12-22 2007-01-09 Broadcom Corporation Ball grid array package enhanced with a thermal and electrical connector
US20020079572A1 (en) * 2000-12-22 2002-06-27 Khan Reza-Ur Rahman Enhanced die-up ball grid array and method for making the same
US7132744B2 (en) 2000-12-22 2006-11-07 Broadcom Corporation Enhanced die-up ball grid array packages and method for making the same
US6545869B2 (en) * 2001-01-17 2003-04-08 International Business Machines Corporation Adjusting fillet geometry to couple a heat spreader to a chip carrier
US6879492B2 (en) 2001-03-28 2005-04-12 International Business Machines Corporation Hyperbga buildup laminate
US7060747B2 (en) * 2001-03-30 2006-06-13 Intel Corporation Chain extension for thermal materials
US7259448B2 (en) * 2001-05-07 2007-08-21 Broadcom Corporation Die-up ball grid array package with a heat spreader and method for making the same
US6491426B1 (en) 2001-06-25 2002-12-10 Sbs Technologies Inc. Thermal bond verification
US6734552B2 (en) 2001-07-11 2004-05-11 Asat Limited Enhanced thermal dissipation integrated circuit package
US7015072B2 (en) 2001-07-11 2006-03-21 Asat Limited Method of manufacturing an enhanced thermal dissipation integrated circuit package
US7182672B2 (en) * 2001-08-02 2007-02-27 Sv Probe Pte. Ltd. Method of probe tip shaping and cleaning
KR100442695B1 (ko) 2001-09-10 2004-08-02 삼성전자주식회사 열 방출판이 부착된 플립칩 패키지 제조 방법
US20030054583A1 (en) * 2001-09-20 2003-03-20 Eastman Kodak Company Method for producing an image sensor assembly
US7045890B2 (en) * 2001-09-28 2006-05-16 Intel Corporation Heat spreader and stiffener having a stiffener extension
US6627978B2 (en) * 2001-09-28 2003-09-30 Intel Corporation Chip package enabling increased input/output density
US6625027B2 (en) 2001-10-31 2003-09-23 Baker Hughes Incorporated Method for increasing the dielectric strength of isolated base integrated circuits used with variable frequency drives
US6879039B2 (en) 2001-12-18 2005-04-12 Broadcom Corporation Ball grid array package substrates and method of making the same
US6751099B2 (en) * 2001-12-20 2004-06-15 Intel Corporation Coated heat spreaders
US20050136640A1 (en) * 2002-01-07 2005-06-23 Chuan Hu Die exhibiting an effective coefficient of thermal expansion equivalent to a substrate mounted thereon, and processes of making same
US6841413B2 (en) 2002-01-07 2005-01-11 Intel Corporation Thinned die integrated circuit package
US6590278B1 (en) 2002-01-08 2003-07-08 International Business Machines Corporation Electronic package
US7550845B2 (en) * 2002-02-01 2009-06-23 Broadcom Corporation Ball grid array package with separated stiffener layer
US6861750B2 (en) * 2002-02-01 2005-03-01 Broadcom Corporation Ball grid array package with multiple interposers
US6825108B2 (en) * 2002-02-01 2004-11-30 Broadcom Corporation Ball grid array package fabrication with IC die support structures
US6876553B2 (en) 2002-03-21 2005-04-05 Broadcom Corporation Enhanced die-up ball grid array package with two substrates
US20030178719A1 (en) * 2002-03-22 2003-09-25 Combs Edward G. Enhanced thermal dissipation integrated circuit package and method of manufacturing enhanced thermal dissipation integrated circuit package
US7196415B2 (en) * 2002-03-22 2007-03-27 Broadcom Corporation Low voltage drop and high thermal performance ball grid array package
US6534859B1 (en) * 2002-04-05 2003-03-18 St. Assembly Test Services Ltd. Semiconductor package having heat sink attached to pre-molded cavities and method for creating the package
US6987032B1 (en) * 2002-07-19 2006-01-17 Asat Ltd. Ball grid array package and process for manufacturing same
US6979594B1 (en) 2002-07-19 2005-12-27 Asat Ltd. Process for manufacturing ball grid array package
JP3847691B2 (ja) * 2002-09-26 2006-11-22 三菱電機株式会社 電力用半導体装置
US7061088B2 (en) * 2002-10-08 2006-06-13 Chippac, Inc. Semiconductor stacked multi-package module having inverted second package
US7034387B2 (en) * 2003-04-04 2006-04-25 Chippac, Inc. Semiconductor multipackage module including processor and memory package assemblies
AU2003284065A1 (en) * 2002-10-11 2005-05-05 Chien-Min Sung Carbonaceous heat spreader and associated methods
TWI221664B (en) * 2002-11-07 2004-10-01 Via Tech Inc Structure of chip package and process thereof
CN100352324C (zh) * 2002-11-21 2007-11-28 华为技术有限公司 通信设备中具有散热结构的器件进行散热处理的方法
US6867977B2 (en) * 2002-12-30 2005-03-15 Intel Corporation Method and apparatus for protecting thermal interfaces
US6825559B2 (en) * 2003-01-02 2004-11-30 Cree, Inc. Group III nitride based flip-chip intergrated circuit and method for fabricating
US20070164424A1 (en) * 2003-04-02 2007-07-19 Nancy Dean Thermal interconnect and interface systems, methods of production and uses thereof
US6965245B2 (en) * 2003-05-01 2005-11-15 K&S Interconnect, Inc. Prefabricated and attached interconnect structure
KR20060025155A (ko) * 2003-06-06 2006-03-20 허니웰 인터내셔날 인코포레이티드 열적 상호접속 시스템, 그 제조 방법 및 사용법
KR100541729B1 (ko) * 2003-06-23 2006-01-10 삼성전자주식회사 반도체소자 검사장치
US7144538B2 (en) * 2003-06-26 2006-12-05 Semiconductor Components Industries, Llc Method for making a direct chip attach device and structure
KR100541730B1 (ko) * 2003-06-26 2006-01-10 삼성전자주식회사 반도체소자 검사장치
FR2857502B1 (fr) * 2003-07-10 2006-02-24 Soitec Silicon On Insulator Substrats pour systemes contraints
US20050093181A1 (en) * 2003-11-04 2005-05-05 Brandenburg Scott D. Heat sinkable package
US7180173B2 (en) * 2003-11-20 2007-02-20 Taiwan Semiconductor Manufacturing Co. Ltd. Heat spreader ball grid array (HSBGA) design for low-k integrated circuits (IC)
US8970049B2 (en) * 2003-12-17 2015-03-03 Chippac, Inc. Multiple chip package module having inverted package stacked over die
US20050133907A1 (en) * 2003-12-23 2005-06-23 Hildner Thomas R. Mechanism for maintaining consistent thermal interface layer in an integrated circuit assembly
US7061101B2 (en) * 2004-03-11 2006-06-13 Mirae Corporation Carrier module
CN1302946C (zh) * 2004-04-09 2007-03-07 李岭群 吊轨管道真空永磁双吸平衡补偿式悬浮路－车系统
CN1302945C (zh) * 2004-04-09 2007-03-07 李岭群 吊轨永磁双吸平衡补偿式悬浮路－车系统
CN1302944C (zh) * 2004-04-09 2007-03-07 李岭群 暗轨永磁双吸平衡补偿式悬浮路－车系统
US8552551B2 (en) * 2004-05-24 2013-10-08 Chippac, Inc. Adhesive/spacer island structure for stacking over wire bonded die
US20050258527A1 (en) * 2004-05-24 2005-11-24 Chippac, Inc. Adhesive/spacer island structure for multiple die package
US20050269692A1 (en) * 2004-05-24 2005-12-08 Chippac, Inc Stacked semiconductor package having adhesive/spacer structure and insulation
US7411281B2 (en) * 2004-06-21 2008-08-12 Broadcom Corporation Integrated circuit device package having both wire bond and flip-chip interconnections and method of making the same
US7482686B2 (en) * 2004-06-21 2009-01-27 Braodcom Corporation Multipiece apparatus for thermal and electromagnetic interference (EMI) shielding enhancement in die-up array packages and method of making the same
US7432586B2 (en) * 2004-06-21 2008-10-07 Broadcom Corporation Apparatus and method for thermal and electromagnetic interference (EMI) shielding enhancement in die-up array packages
US7253511B2 (en) * 2004-07-13 2007-08-07 Chippac, Inc. Semiconductor multipackage module including die and inverted land grid array package stacked over ball grid array package
US7138300B2 (en) 2004-09-22 2006-11-21 Taiwan Semiconductor Manufacturing Co., Ltd. Structural design for flip-chip assembly
US7786591B2 (en) * 2004-09-29 2010-08-31 Broadcom Corporation Die down ball grid array package
US7145232B2 (en) * 2004-09-30 2006-12-05 Lsi Logic Corporation Construction to improve thermal performance and reduce die backside warpage
US7743963B1 (en) 2005-03-01 2010-06-29 Amerasia International Technology, Inc. Solderable lid or cover for an electronic circuit
US7166540B2 (en) * 2005-03-03 2007-01-23 Intel Corporation Method for reducing assembly-induced stress in a semiconductor die
KR101172527B1 (ko) * 2005-03-31 2012-08-10 스태츠 칩팩, 엘티디. 상부면 및 하부면에서 노출된 기판 표면들을 갖는 반도체적층 패키지 어셈블리
US7429787B2 (en) * 2005-03-31 2008-09-30 Stats Chippac Ltd. Semiconductor assembly including chip scale package and second substrate with exposed surfaces on upper and lower sides
US7364945B2 (en) 2005-03-31 2008-04-29 Stats Chippac Ltd. Method of mounting an integrated circuit package in an encapsulant cavity
EP1873819A4 (en) * 2005-04-06 2012-07-11 Panasonic Corp BALL CONNECTION METHOD AND CONNECTION BALL FORMATION METHOD
KR100660604B1 (ko) * 2005-04-21 2006-12-22 (주)웨이브닉스이에스피 금속 박편을 이용한 수동 소자 및 반도체 패키지의제조방법
US7354800B2 (en) 2005-04-29 2008-04-08 Stats Chippac Ltd. Method of fabricating a stacked integrated circuit package system
US7429786B2 (en) * 2005-04-29 2008-09-30 Stats Chippac Ltd. Semiconductor package including second substrate and having exposed substrate surfaces on upper and lower sides
US7582960B2 (en) * 2005-05-05 2009-09-01 Stats Chippac Ltd. Multiple chip package module including die stacked over encapsulated package
US7561436B2 (en) * 2005-06-06 2009-07-14 Delphi Technologies, Inc. Circuit assembly with surface-mount IC package and heat sink
US7394148B2 (en) * 2005-06-20 2008-07-01 Stats Chippac Ltd. Module having stacked chip scale semiconductor packages
US7566591B2 (en) * 2005-08-22 2009-07-28 Broadcom Corporation Method and system for secure heat sink attachment on semiconductor devices with macroscopic uneven surface features
US7543373B2 (en) * 2005-09-26 2009-06-09 International Business Machines Corporation Gel package structural enhancement of compression system board connections
TWI273683B (en) * 2005-11-02 2007-02-11 Siliconware Precision Industries Co Ltd Semiconductor package and substrate structure thereof
US7456088B2 (en) 2006-01-04 2008-11-25 Stats Chippac Ltd. Integrated circuit package system including stacked die
US7768125B2 (en) * 2006-01-04 2010-08-03 Stats Chippac Ltd. Multi-chip package system
US7750482B2 (en) * 2006-02-09 2010-07-06 Stats Chippac Ltd. Integrated circuit package system including zero fillet resin
US8704349B2 (en) * 2006-02-14 2014-04-22 Stats Chippac Ltd. Integrated circuit package system with exposed interconnects
US7176707B1 (en) * 2006-02-23 2007-02-13 Lockheed Martin Corporation Back side component placement and bonding
US9713258B2 (en) * 2006-04-27 2017-07-18 International Business Machines Corporation Integrated circuit chip packaging
US8183680B2 (en) * 2006-05-16 2012-05-22 Broadcom Corporation No-lead IC packages having integrated heat spreader for electromagnetic interference (EMI) shielding and thermal enhancement
JP4589269B2 (ja) * 2006-06-16 2010-12-01 ソニー株式会社 半導体装置およびその製造方法
US7476568B2 (en) * 2006-06-30 2009-01-13 Intel Corporation Wafer-level assembly of heat spreaders for dual IHS packages
KR20080035741A (ko) * 2006-10-20 2008-04-24 삼성전자주식회사 광원 유닛의 제조방법과 광원 유닛을 구비한 백라이트 유닛및 이를 구비한 액정표시장치
DE102007016126A1 (de) * 2007-03-29 2008-10-02 Robert Bosch Gmbh Anordnung mit mindestens einem in Berührungskontakt mit mindestens einem Kunststoffbauelement stehenden Metallteil
JP2008270455A (ja) * 2007-04-19 2008-11-06 Hitachi Ltd パワー半導体モジュール
TWI338938B (en) * 2007-05-11 2011-03-11 Siliconware Precision Industries Co Ltd Heat-dissipating type semiconductor package
US20080307643A1 (en) * 2007-06-15 2008-12-18 Sozansky Wayne A Method of assembly to achieve thermal bondline with minimal lead bending
US7791188B2 (en) * 2007-06-18 2010-09-07 Chien-Min Sung Heat spreader having single layer of diamond particles and associated methods
US7982137B2 (en) * 2007-06-27 2011-07-19 Hamilton Sundstrand Corporation Circuit board with an attached die and intermediate interposer
US7678615B2 (en) * 2007-08-29 2010-03-16 Advanced Micro Devices, Inc. Semiconductor device with gel-type thermal interface material
US7833839B1 (en) * 2007-09-15 2010-11-16 Globalfoundries Inc. Method for decreasing surface delamination of gel-type thermal interface material by management of the material cure temperature
KR20090062612A (ko) * 2007-12-13 2009-06-17 페어차일드코리아반도체 주식회사 멀티 칩 패키지
US20090166890A1 (en) * 2007-12-31 2009-07-02 Chrysler Gregory M Flip-chip package
US8013440B2 (en) * 2008-03-28 2011-09-06 Conexant Systems, Inc. Enhanced thermal dissipation ball grid array package
JP4621778B2 (ja) * 2009-01-29 2011-01-26 株式会社東芝 電子機器及び回路基板
JP5169964B2 (ja) * 2009-04-10 2013-03-27 株式会社デンソー モールドパッケージの実装構造および実装方法
US8564114B1 (en) 2010-03-23 2013-10-22 Amkor Technology, Inc. Semiconductor package thermal tape window frame for heat sink attachment
US9006086B2 (en) 2010-09-21 2015-04-14 Chien-Min Sung Stress regulated semiconductor devices and associated methods
US8778784B2 (en) 2010-09-21 2014-07-15 Ritedia Corporation Stress regulated semiconductor devices and associated methods
CN103221180A (zh) 2010-09-21 2013-07-24 铼钻科技股份有限公司 具有基本平坦颗粒尖端的超研磨工具及其相关方法
US9312240B2 (en) 2011-01-30 2016-04-12 UTAC Headquarters Pte. Ltd. Semiconductor packages and methods of packaging semiconductor devices
US8703534B2 (en) * 2011-01-30 2014-04-22 United Test And Assembly Center Ltd. Semiconductor packages and methods of packaging semiconductor devices
US8552540B2 (en) 2011-05-10 2013-10-08 Conexant Systems, Inc. Wafer level package with thermal pad for higher power dissipation
JP6296687B2 (ja) * 2012-04-27 2018-03-20 キヤノン株式会社 電子部品、電子モジュールおよびこれらの製造方法。
JP5885690B2 (ja) 2012-04-27 2016-03-15 キヤノン株式会社 電子部品および電子機器
JP2013243340A (ja) 2012-04-27 2013-12-05 Canon Inc 電子部品、実装部材、電子機器およびこれらの製造方法
JP5980566B2 (ja) * 2012-05-17 2016-08-31 新光電気工業株式会社 半導体装置及びその製造方法
US20130308274A1 (en) * 2012-05-21 2013-11-21 Triquint Semiconductor, Inc. Thermal spreader having graduated thermal expansion parameters
US10958348B2 (en) 2012-12-29 2021-03-23 Zephyr Photonics Inc. Method for manufacturing modular multi-function active optical cables
US10133636B2 (en) 2013-03-12 2018-11-20 Formulus Black Corporation Data storage and retrieval mediation system and methods for using same
US9304703B1 (en) 2015-04-15 2016-04-05 Symbolic Io Corporation Method and apparatus for dense hyper IO digital retention
US9817728B2 (en) 2013-02-01 2017-11-14 Symbolic Io Corporation Fast system state cloning
CN103199068B (zh) * 2013-04-11 2016-06-08 余原生 一体化电路集成结构
CN103414356A (zh) * 2013-08-16 2013-11-27 张晓民 共单极悬浮式整流模块
CN103507818A (zh) * 2013-09-09 2014-01-15 李安庆 单轨高速复式机动车驱动桥总成
CN103579017B (zh) * 2013-11-14 2016-04-27 无锡中微高科电子有限公司 用于陶瓷柱栅阵列封装的自动植柱及焊接装置
US9355927B2 (en) * 2013-11-25 2016-05-31 Taiwan Semiconductor Manufacturing Company Ltd. Semiconductor packaging and manufacturing method thereof
US9559064B2 (en) * 2013-12-04 2017-01-31 Taiwan Semiconductor Manufacturing Company, Ltd. Warpage control in package-on-package structures
US9502269B2 (en) * 2014-04-03 2016-11-22 Bae Systems Information And Electronic Systems Integration Inc. Method and apparatus for cooling electonic components
US10061514B2 (en) 2015-04-15 2018-08-28 Formulus Black Corporation Method and apparatus for dense hyper IO digital retention
US9706662B2 (en) 2015-06-30 2017-07-11 Raytheon Company Adaptive interposer and electronic apparatus
USD742887S1 (en) 2015-07-22 2015-11-10 Symbolic Io Corporation Tray
US9648729B1 (en) 2015-11-20 2017-05-09 Raytheon Company Stress reduction interposer for ceramic no-lead surface mount electronic device
JP7077526B2 (ja) * 2016-12-16 2022-05-31 東洋インキＳｃホールディングス株式会社 複合部材
US10153261B2 (en) * 2017-04-03 2018-12-11 Cisco Technology, Inc. Cooling system for high power application specific integrated circuit with embedded high bandwidth memory
US10572186B2 (en) 2017-12-18 2020-02-25 Formulus Black Corporation Random access memory (RAM)-based computer systems, devices, and methods
CN111602239B (zh) * 2018-01-11 2023-10-24 阿莫善斯有限公司 功率半导体模块
US10725853B2 (en) 2019-01-02 2020-07-28 Formulus Black Corporation Systems and methods for memory failure prevention, management, and mitigation
EP3937227A1 (en) * 2020-07-09 2022-01-12 Infineon Technologies Austria AG A semiconductor device package comprising a thermal interface material with improved handling properties
CN114520197A (zh) * 2020-11-19 2022-05-20 颀邦科技股份有限公司 挠性半导体封装构造
JP7516230B2 (ja) * 2020-12-03 2024-07-16 新光電気工業株式会社 半導体装置及び半導体装置の製造方法

Family Cites Families (31)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3458925A (en) * 1966-01-20 1969-08-05 Ibm Method of forming solder mounds on substrates
US4000509A (en) * 1975-03-31 1976-12-28 International Business Machines Corporation High density air cooled wafer package having improved thermal dissipation
US4092697A (en) * 1976-12-06 1978-05-30 International Business Machines Corporation Heat transfer mechanism for integrated circuit package
US4604644A (en) * 1985-01-28 1986-08-05 International Business Machines Corporation Solder interconnection structure for joining semiconductor devices to substrates that have improved fatigue life, and process for making
JPS61271319A (ja) * 1985-05-24 1986-12-01 Shin Etsu Chem Co Ltd 半導体封止用エポキシ樹脂組成物
JPS62136865A (ja) * 1985-12-11 1987-06-19 Hitachi Ltd モジユ−ル実装構造
JPH0777247B2 (ja) * 1986-09-17 1995-08-16 富士通株式会社 半導体装置の製造方法
US5159535A (en) * 1987-03-11 1992-10-27 International Business Machines Corporation Method and apparatus for mounting a flexible film semiconductor chip carrier on a circuitized substrate
US4878108A (en) * 1987-06-15 1989-10-31 International Business Machines Corporation Heat dissipation package for integrated circuits
JPS6429158A (en) * 1987-07-24 1989-01-31 Fujitsu Ltd Display device mounting discrimination system
JPH01217951A (ja) * 1988-02-26 1989-08-31 Hitachi Ltd 半導体装置
JPH0756887B2 (ja) * 1988-04-04 1995-06-14 株式会社日立製作所 半導体パッケージ及びそれを用いたコンピュータ
DE3813565A1 (de) * 1988-04-22 1989-11-02 Bosch Gmbh Robert Elektrischer anschluss von hybridbaugruppen
US4914551A (en) * 1988-07-13 1990-04-03 International Business Machines Corporation Electronic package with heat spreader member
JPH02136865A (ja) * 1988-11-18 1990-05-25 Dainippon Ink & Chem Inc 静電荷現像用黄色トナー
JPH0312955A (ja) * 1989-06-12 1991-01-21 Fujitsu Ltd 半導体装置
US5041902A (en) * 1989-12-14 1991-08-20 Motorola, Inc. Molded electronic package with compression structures
US5121190A (en) * 1990-03-14 1992-06-09 International Business Machines Corp. Solder interconnection structure on organic substrates
US5147084A (en) * 1990-07-18 1992-09-15 International Business Machines Corporation Interconnection structure and test method
US5235347A (en) * 1990-09-07 1993-08-10 Hewlett-Packard Company Light emitting diode print head
JPH04192552A (ja) * 1990-11-27 1992-07-10 Nec Corp 半導体素子用パッケージ
US5291064A (en) * 1991-04-16 1994-03-01 Nec Corporation Package structure for semiconductor device having a flexible wiring circuit member spaced from the package casing
US5375320A (en) * 1991-08-13 1994-12-27 Micron Technology, Inc. Method of forming "J" leads on a semiconductor device
JP3000307B2 (ja) * 1991-08-28 2000-01-17 株式会社日立製作所 冷却装置付き半導体装置およびその製造方法
US5198693A (en) * 1992-02-05 1993-03-30 International Business Machines Corporation Aperture formation in aluminum circuit card for enhanced thermal dissipation
US5262927A (en) * 1992-02-07 1993-11-16 Lsi Logic Corporation Partially-molded, PCB chip carrier package
EP0566872A3 (en) * 1992-04-21 1994-05-11 Motorola Inc A thermally enhanced semiconductor device and method for making the same
US5249101A (en) * 1992-07-06 1993-09-28 International Business Machines Corporation Chip carrier with protective coating for circuitized surface
US5367196A (en) * 1992-09-17 1994-11-22 Olin Corporation Molded plastic semiconductor package including an aluminum alloy heat spreader
US5461257A (en) * 1994-03-31 1995-10-24 Sgs-Thomson Microelectronics, Inc. Integrated circuit package with flat-topped heat sink
MY112145A (en) * 1994-07-11 2001-04-30 Ibm Direct attachment of heat sink attached directly to flip chip using flexible epoxy

Also Published As

Publication number Publication date
US5744863A (en) 1998-04-28
JPH0831995A (ja) 1996-02-02
JP3392590B2 (ja) 2003-03-31
CN1123468A (zh) 1996-05-29
MY112145A (en) 2001-04-30
US5672548A (en) 1997-09-30
CN1112728C (zh) 2003-06-25
CN1259764A (zh) 2000-07-12
SG45096A1 (en) 1998-01-16
US5785799A (en) 1998-07-28
CN1148792C (zh) 2004-05-05

Similar Documents

Publication Publication Date Title
ID25443A (id) PERKAKAS UNTUK MENIKAT PENURUNAN PNAS SECARA LANGSUNG PADA MODUL-MODUL PEMBAWA CHIP DENGAN MENGGUNAKAN EPOKSI LENTUR (Pecahan dari NO. P950732)
EP0817253A3 (en) Attaching heat sinks directly to flip chips and ceramic chip carriers
US4731644A (en) Semiconductor power module with ceramic substrate
US7186590B2 (en) Thermally enhanced lid for multichip modules
WO2006089033A3 (en) Led light module assembly
DE69833865D1 (de) Hitzehärtende harzzusammensetzungen verwendbar als unterfüllungs dichtungsmassen
EP0865082A4 (en) SEMICONDUCTOR DEVICE, PROCESS FOR PRODUCING THE SAME, AND ENCAPSULATED SUBSTRATE
KR960006721A (ko) 칩을 흡열부에 직접 결합하기 위한 방법 및 장치
JPS5527721A (en) Diaphragm for electroacoustic converter
ATE337614T1 (de) Wärmeableitung von einer leiterplatte mit blossen chips
MY118700A (en) Thermosetting resin compositions
TW200642055A (en) Area mount type semiconductor device, and die bonding resin composition and encapsulating resin composition used for the same
MA26134A1 (fr) Utilisation de divers materiaux dans un assemblage d'appareils electroniques contenant une cavite d'air.
JPH03116948A (ja) 超高周波ｉｃ用窒化アルミニウムパッケージ
Nishimura et al. All lead free IGBT module with excellent reliability
US6933443B2 (en) Method for bonding ceramic to copper, without creating a bow in the copper
TH62430A (th) การติดอุปกรณ์ระบายความร้อนต่อโดยตรงกับโมดูลซิพพาหะโดยใช้อีพ๊อกซี่ยืดหยุ่น
US5723905A (en) Semiconductor package with low strain seal
SE9902998L (sv) Kylare
KR19990044862A (ko) 열전달 증강 부착 방법 및 장치
JPH01248548A (ja) 混成集積回路装置
EP3624182A1 (en) Power semiconductor module arrangement, substrate arrangement, and method for producing the same
JPS644029A (en) Semiconductor device
JPS645044A (en) Semiconductor integrated circuit device
Bonneau New die attach adhesives that stick