JP5169964B2 - モールドパッケージの実装構造および実装方法 - Google Patents
モールドパッケージの実装構造および実装方法 Download PDFInfo
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Description
図1は、本発明の第1実施形態に係るモールドパッケージ1を放熱部材2に搭載したモールドパッケージ1の実装構造を示す概略断面図である。また、図2は、図1中のモールドパッケージ1の単体構成を示す図であり、(a)は概略平面図、(b)は概略断面図である。なお、図2(a)では、モールド樹脂20の外形を一点鎖線で示し、モールド樹脂20を透過してモールド樹脂20の内部に位置する構成要素を示している。
図5は、本発明の第2実施形態に係るモールドパッケージ1の実装構造の概略断面構成を示す図である。上記第1実施形態では、モールドパッケージ1を放熱部材2の一面2aに対してフェイスアップで搭載したが、本実施形態では、モールドパッケージ1を配線基板4にフェイスダウンで搭載しつつ放熱部材2の一面2aに対してフェイスアップで搭載したところが、上記第1実施形態とは相違するものである。
図7は、本発明の第3実施形態に係るモールドパッケージ1aの単体構成を示す図であり、(a)は概略平面図、(b)は概略断面図である。なお、図7(a)では、モールド樹脂20の外形を一点鎖線で示し、モールド樹脂20を透過してモールド樹脂20の内部に位置する構成要素を示している。
図9は、本発明の第4実施形態に係るモールドパッケージ1bを放熱部材2に搭載したモールドパッケージの実装構造を示す概略断面図である。
図12は、本発明の他の実施形態に係るモールドパッケージの概略断面図である。この図12に示されるものは、上記第4実施形態に示したノンリード構成において、モールド樹脂20の底面20aに位置するリード端子30を、さらにモールド樹脂20の側部からはみ出すように突出させたものである。
2 放熱部材
2a 放熱部材の一面
3 熱伝導性部材
10 半導体チップ
11 半導体チップの一面
12 半導体チップの他面
13 半導体チップの側面
20 モールド樹脂
20a モールド樹脂の底面
21 モールド樹脂の開口部
22 凹み部
31 アイランド
Claims (2)
- 板状の半導体チップ(10)の両板面のうち一面(11)側をモールド樹脂(20)で封止し、他面(12)を前記モールド樹脂(20)より露出させるようにしたモールドパッケージ(1)を、放熱部材(2)の一面(2a)に搭載し、
前記半導体チップ(10)の他面(12)と前記放熱部材(2)の一面(2a)との間に熱伝導性を有する熱伝導性部材(3)を介在させ、この熱伝導性部材(3)を介して前記半導体チップ(10)と前記放熱部材(2)とを熱的に接続してなるモールドパッケージの実装構造であって、
前記半導体チップ(10)の前記両板面(11、12)の外周端部に位置し前記半導体チップ(10)の板厚方向に延びる面である側面(13)が、前記モールド樹脂(20)より露出しており、
前記熱伝導性部材(3)は、前記半導体チップ(10)の前記他面(12)から前記側面(13)まで回り込むように配置されて、当該他面(12)および当該側面(13)に直接接触しており、
前記熱伝導性部材(3)を介して、前記半導体チップ(10)の前記他面(12)および前記側面(13)と前記放熱部材(2)とが熱的に接続されており、
前記モールド樹脂(20)は前記半導体チップ(10)の前記一面(11)から前記側面(13)の外側に回り込んで前記他面(12)側まで配置されており、
前記モールド樹脂(20)における前記半導体チップ(10)の前記他面(12)側に位置する外表面(20a)のうち前記半導体チップ(10)の前記他面(12)に対向する部位には、前記半導体チップ(10)の前記他面(12)を露出させる開口部(21)が設けられており、
前記開口部(21)の底部のうち前記半導体チップ(10)の前記他面(12)の外側に位置する部位は、前記半導体チップ(10)の前記他面(12)よりも凹んだ凹み部(22)となっており、
前記半導体チップ(10)の側面(13)は、前記凹み部(22)に臨んだ状態で前記モールド樹脂(20)より露出しており、
前記半導体チップ(10)の前記他面(12)は、前記モールド樹脂(20)における前記半導体チップ(10)の前記他面(12)側に位置する外表面(20a)よりも引っこんでおり、
前記熱伝導性部材(3)は、前記凹み部(22)を含む前記開口部(21)内に充填されており、
前記モールド樹脂(20)内にて、前記半導体チップ(10)の前記一面(11)には、前記半導体チップ(10)よりも小さい板状のアイランド(31)が接合され、前記半導体チップ(10)は前記アイランド(31)に支持されており、
前記モールド樹脂(20)内にて前記半導体チップ(10)の周囲には、リード端子(30)が設けられ、
さらに、前記モールド樹脂(20)内にて、前記半導体チップ(10)の前記一面(11)と前記リード端子(30)とが、ワイヤ(40)により接続されていることを特徴とするモールドパッケージの実装構造。 - 請求項1に記載の実装構造を形成するモールドパッケージ(1)の実装方法であって、
前記半導体チップ(10)の全体を前記モールド樹脂(20)で封止した後、前記モールド樹脂(20)のうち前記半導体チップ(10)の前記他面(12)および前記側面(13)を封止する部位を、レーザを照射して除去することにより、前記半導体チップ(10)の前記他面(12)および前記側面(13)を露出させ、
続いて、露出した前記半導体チップ(10)の前記他面(12)および前記側面(13)に前記レーザを照射して、これら各面を粗化する粗化処理を行い、
しかる後、粗化された前記半導体チップ(10)の前記他面(12)および前記側面(13)と前記放熱部材(2)との間に前記熱伝導性部材(3)を介在させつつ、前記モールドパッケージ(1)を前記放熱部材(2)の一面(2a)に搭載することを特徴とするモールドパッケージの実装方法。
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CN103077901A (zh) * | 2013-02-06 | 2013-05-01 | 日月光半导体制造股份有限公司 | 半导体封装件的封装方法及应用其形成的半导体封装件 |
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JP5843539B2 (ja) * | 2011-09-16 | 2016-01-13 | 三菱電機株式会社 | 半導体装置及び当該半導体装置の製造方法 |
JP6076675B2 (ja) * | 2011-10-31 | 2017-02-08 | ローム株式会社 | 半導体装置 |
JP2016018979A (ja) | 2014-07-11 | 2016-02-01 | 株式会社デンソー | モールドパッケージ |
JP6818801B2 (ja) * | 2019-04-01 | 2021-01-20 | ローム株式会社 | パワーモジュールおよびその製造方法 |
EP4333046A1 (en) * | 2021-04-28 | 2024-03-06 | Sony Semiconductor Solutions Corporation | Semiconductor device |
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JPH02240953A (ja) * | 1989-03-14 | 1990-09-25 | Sharp Corp | 半導体装置 |
JP3222660B2 (ja) * | 1993-10-26 | 2001-10-29 | 松下電工株式会社 | 基材表面の処理方法 |
MY112145A (en) * | 1994-07-11 | 2001-04-30 | Ibm | Direct attachment of heat sink attached directly to flip chip using flexible epoxy |
JPH1168016A (ja) * | 1997-08-12 | 1999-03-09 | Nec Corp | 樹脂封止型半導体装置 |
JP2000236058A (ja) * | 1999-02-15 | 2000-08-29 | Matsushita Electronics Industry Corp | 半導体装置及びその製造方法 |
JP2007180089A (ja) * | 2005-12-27 | 2007-07-12 | Auto Network Gijutsu Kenkyusho:Kk | 回路導体パターンを有する樹脂成形部品の製造方法 |
JP4589269B2 (ja) * | 2006-06-16 | 2010-12-01 | ソニー株式会社 | 半導体装置およびその製造方法 |
JP4963879B2 (ja) * | 2006-06-16 | 2012-06-27 | 株式会社ソニー・コンピュータエンタテインメント | 半導体装置および半導体装置の製造方法 |
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CN103077901A (zh) * | 2013-02-06 | 2013-05-01 | 日月光半导体制造股份有限公司 | 半导体封装件的封装方法及应用其形成的半导体封装件 |
CN103077901B (zh) * | 2013-02-06 | 2015-10-28 | 日月光半导体制造股份有限公司 | 半导体封装件的封装方法及应用其形成的半导体封装件 |
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