HUE042401T2 - Ólommentes forrasztó ötvözet és jármûbe épített elektronikus áramkör - Google Patents

Ólommentes forrasztó ötvözet és jármûbe épített elektronikus áramkör

Info

Publication number
HUE042401T2
HUE042401T2 HUE14779645A HUE14779645A HUE042401T2 HU E042401 T2 HUE042401 T2 HU E042401T2 HU E14779645 A HUE14779645 A HU E14779645A HU E14779645 A HUE14779645 A HU E14779645A HU E042401 T2 HUE042401 T2 HU E042401T2
Authority
HU
Hungary
Prior art keywords
lead
electronic circuit
free solder
solder alloy
vehicle electronic
Prior art date
Application number
HUE14779645A
Other languages
English (en)
Inventor
Shunsaku Yoshikawa
Naoko Hirai
Ken Tachibana
Yoshie Tachibana
Original Assignee
Senju Metal Industry Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Senju Metal Industry Co filed Critical Senju Metal Industry Co
Publication of HUE042401T2 publication Critical patent/HUE042401T2/hu

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/58—Means for relieving strain on wire connection, e.g. cord grip, for avoiding loosening of connections between wires and terminals within a coupling device terminating a cable
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457—Solder materials or compositions; Methods of application thereof
    • H05K3/3463—Solder compositions in relation to features of the printed circuit board or the mounting process
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
    • B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering, brazing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
    • B23K35/262—Sn as the principal constituent
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C13/00—Alloys based on tin
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C13/00—Alloys based on tin
    • C22C13/02—Alloys based on tin with antimony or bismuth as the next major constituent
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/70—Coupling devices
    • H01R12/71—Coupling devices for rigid printing circuits or like structures
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
    • H01R4/02—Soldered or welded connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457—Solder materials or compositions; Methods of application thereof
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • B23K2101/42—Printed circuits

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
HUE14779645A 2013-04-02 2014-04-03 Ólommentes forrasztó ötvözet és jármûbe épített elektronikus áramkör HUE042401T2 (hu)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2013077289A JP2015077601A (ja) 2013-04-02 2013-04-02 鉛フリーはんだ合金
EP14779645.2A EP2982469B1 (en) 2013-04-02 2014-04-03 Lead-free solder alloy and in-vehicle electronic circuit

Publications (1)

Publication Number Publication Date
HUE042401T2 true HUE042401T2 (hu) 2019-06-28

Family

ID=51658458

Family Applications (1)

Application Number Title Priority Date Filing Date
HUE14779645A HUE042401T2 (hu) 2013-04-02 2014-04-03 Ólommentes forrasztó ötvözet és jármûbe épített elektronikus áramkör

Country Status (13)

Country Link
US (1) US9837757B2 (hu)
EP (1) EP2982469B1 (hu)
JP (2) JP2015077601A (hu)
KR (2) KR102038189B1 (hu)
CN (2) CN108581266A (hu)
BR (1) BR112015025125B1 (hu)
ES (1) ES2718523T3 (hu)
HU (1) HUE042401T2 (hu)
MX (1) MX357114B (hu)
MY (1) MY158373A (hu)
PH (1) PH12015502283B1 (hu)
PT (1) PT2982469T (hu)
WO (1) WO2014163167A1 (hu)

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JP5723056B1 (ja) 2014-12-15 2015-05-27 ハリマ化成株式会社 はんだ合金、ソルダペーストおよび電子回路基板
JP6200534B2 (ja) * 2015-03-24 2017-09-20 株式会社タムラ製作所 鉛フリーはんだ合金、電子回路基板および電子制御装置
US20160279741A1 (en) * 2015-03-24 2016-09-29 Tamura Corporation Lead-free solder alloy, electronic circuit board, and electronic control device
US11229979B2 (en) 2015-05-05 2022-01-25 Indium Corporation High reliability lead-free solder alloys for harsh environment electronics applications
EP3326745B1 (en) * 2015-07-24 2020-09-02 Harima Chemicals, Inc. Solder alloy, solder paste, and electronic circuit board
JP6053248B1 (ja) * 2015-07-24 2016-12-27 ハリマ化成株式会社 はんだ合金、ソルダペーストおよび電子回路基板
CN107427968B (zh) 2015-09-17 2020-11-24 富士电机株式会社 半导体装置用软钎焊材料
CN108430690B (zh) * 2016-02-01 2021-05-14 株式会社村田制作所 接合材料、使用该接合材料的接合方法和接合结构
JP6489037B2 (ja) 2016-02-10 2019-03-27 株式会社デンソー 電子装置及びその製造方法
JP2017157582A (ja) * 2016-02-29 2017-09-07 株式会社東芝 半導体装置
JP6560272B2 (ja) * 2017-01-31 2019-08-14 株式会社タムラ製作所 ソルダペースト、電子回路基板及び電子制御装置
JP6275178B2 (ja) * 2016-03-22 2018-02-07 株式会社タムラ製作所 鉛フリーはんだ合金、電子回路基板および電子制御装置
CN108500499B (zh) * 2016-03-22 2019-10-22 株式会社田村制作所 无铅软钎料合金、电子电路基板和电子控制装置
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JP6047254B1 (ja) * 2016-03-22 2016-12-21 株式会社タムラ製作所 鉛フリーはんだ合金、電子回路基板および電子制御装置
JP6230674B2 (ja) * 2016-09-20 2017-11-15 株式会社タムラ製作所 鉛フリーはんだ合金、電子回路基板および電子制御装置
JP6874763B2 (ja) * 2016-05-09 2021-05-19 株式会社豊田自動織機 電極組立体の製造方法
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CN109500510A (zh) * 2017-09-14 2019-03-22 株式会社田村制作所 无铅软钎料合金、电子电路基板和电子控制装置
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JP6275318B1 (ja) * 2017-10-13 2018-02-07 株式会社タムラ製作所 鉛フリーはんだ合金、電子回路基板および電子制御装置
JP6467484B2 (ja) * 2017-10-13 2019-02-13 株式会社タムラ製作所 鉛フリーはんだ合金、電子回路基板および電子制御装置
JP6467485B2 (ja) * 2017-10-17 2019-02-13 株式会社タムラ製作所 鉛フリーはんだ合金、電子回路基板および電子制御装置
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JP6540869B1 (ja) * 2018-03-30 2019-07-10 千住金属工業株式会社 はんだペースト
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JP6731034B2 (ja) 2018-12-25 2020-07-29 株式会社タムラ製作所 鉛フリーはんだ合金、はんだ接合用材料、電子回路実装基板及び電子制御装置
JP6731037B2 (ja) * 2018-12-28 2020-07-29 株式会社タムラ製作所 鉛フリーはんだ合金、はんだ接合用材料、電子回路実装基板及び電子制御装置
JP6795630B2 (ja) * 2019-01-10 2020-12-02 株式会社タムラ製作所 鉛フリーはんだ合金、ソルダペースト組成物、電子回路基板および電子制御装置
US11752579B2 (en) 2019-02-26 2023-09-12 Indium Corporation High reliability leadfree solder alloys for harsh service conditions
JP6624322B1 (ja) * 2019-03-27 2019-12-25 千住金属工業株式会社 はんだ合金、はんだボール、はんだプリフォーム、はんだペースト及びはんだ継手
US11819955B2 (en) 2019-05-27 2023-11-21 Senju Metal Industry Co., Ltd. Solder alloy, solder paste, solder ball, solder preform, solder joint, on-board electronic circuit, ECU electronic circuit, on-board electronic circuit device, and ECU electronic circuit device
JP6889387B1 (ja) * 2020-06-23 2021-06-18 千住金属工業株式会社 はんだ合金、ソルダペースト、はんだボール、ソルダプリフォーム、はんだ継手、車載電子回路、ｅｃｕ電子回路、車載電子回路装置、及びｅｃｕ電子回路装置
JP6836040B1 (ja) * 2020-07-31 2021-02-24 千住金属工業株式会社 はんだ合金
EP4199018B1 (de) * 2021-01-08 2024-02-21 Kistler Holding AG Verbindung, elektrische durchführung, und sensor
JP7323853B1 (ja) * 2023-01-12 2023-08-09 千住金属工業株式会社 はんだ合金、はんだペースト、はんだボール、はんだプリフォーム、はんだ継手、車載電子回路、ｅｃｕ電子回路、車載電子回路装置、およびｅｃｕ電子回路装置
JP7323855B1 (ja) * 2023-01-12 2023-08-09 千住金属工業株式会社 はんだ合金、はんだペースト、はんだボール、はんだプリフォーム、はんだ継手、車載電子回路、ｅｃｕ電子回路、車載電子回路装置、およびｅｃｕ電子回路装置
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Also Published As

Publication number Publication date
BR112015025125B1 (pt) 2020-03-24
KR20150126385A (ko) 2015-11-11
CN108581266A (zh) 2018-09-28
PH12015502283A1 (en) 2016-02-01
PH12015502283B1 (en) 2016-02-01
MX357114B (es) 2018-06-27
KR20160148036A (ko) 2016-12-23
EP2982469B1 (en) 2019-01-09
EP2982469A4 (en) 2016-06-29
BR112015025125A2 (pt) 2017-07-18
CN105142856A (zh) 2015-12-09
MX2015013942A (es) 2017-07-28
WO2014163167A1 (ja) 2014-10-09
KR102038189B1 (ko) 2019-10-29
JPWO2014163167A1 (ja) 2017-02-16
MY158373A (en) 2016-09-26
ES2718523T3 (es) 2019-07-02
US20160056570A1 (en) 2016-02-25
PT2982469T (pt) 2019-04-23
US9837757B2 (en) 2017-12-05
JP2015077601A (ja) 2015-04-23
EP2982469A1 (en) 2016-02-10
JP5811304B2 (ja) 2015-11-11

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