PT3189929T - Liga de soldadura sem chumbo para utilização em pré- chapeamento de terminal, e componente eletrónico. - Google Patents

Liga de soldadura sem chumbo para utilização em pré- chapeamento de terminal, e componente eletrónico.

Info

Publication number
PT3189929T
PT3189929T PT158373555T PT15837355T PT3189929T PT 3189929 T PT3189929 T PT 3189929T PT 158373555 T PT158373555 T PT 158373555T PT 15837355 T PT15837355 T PT 15837355T PT 3189929 T PT3189929 T PT 3189929T
Authority
PT
Portugal
Prior art keywords
preplating
lead
terminal
electronic component
free solder
Prior art date
Application number
PT158373555T
Other languages
English (en)
Inventor
Yoshikawa Shunsaku
Original Assignee
Senju Metal Industry Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Senju Metal Industry Co filed Critical Senju Metal Industry Co
Publication of PT3189929T publication Critical patent/PT3189929T/pt

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
    • B23K35/262—Sn as the principal constituent
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/0004—Resistance soldering
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C13/00—Alloys based on tin
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F27/00—Details of transformers or inductances, in general
    • H01F27/28—Coils; Windings; Conductive connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Power Engineering (AREA)
  • Organic Chemistry (AREA)
  • Metallurgy (AREA)
  • Materials Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Coils Of Transformers For General Uses (AREA)
  • Connection Of Batteries Or Terminals (AREA)
  • Connections Effected By Soldering, Adhesion, Or Permanent Deformation (AREA)
PT158373555T 2014-09-04 2015-09-04 Liga de soldadura sem chumbo para utilização em pré- chapeamento de terminal, e componente eletrónico. PT3189929T (pt)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2014180369A JP5842973B1 (ja) 2014-09-04 2014-09-04 端子予備メッキ用鉛フリーはんだ合金及び電子部品

Publications (1)

Publication Number Publication Date
PT3189929T true PT3189929T (pt) 2019-10-24

Family

ID=55073296

Family Applications (1)

Application Number Title Priority Date Filing Date
PT158373555T PT3189929T (pt) 2014-09-04 2015-09-04 Liga de soldadura sem chumbo para utilização em pré- chapeamento de terminal, e componente eletrónico.

Country Status (9)

Country Link
US (2) US20170274481A1 (pt)
EP (1) EP3189929B1 (pt)
JP (1) JP5842973B1 (pt)
CN (1) CN106687250B (pt)
ES (1) ES2748701T3 (pt)
MY (1) MY165589A (pt)
PH (1) PH12017500404A1 (pt)
PT (1) PT3189929T (pt)
WO (1) WO2016035879A1 (pt)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP3208028B1 (en) * 2016-02-19 2021-04-07 Max-Planck-Gesellschaft zur Förderung der Wissenschaften e.V. A method and device for reversibly attaching a phase changing metal to an object
NL2020406B1 (nl) * 2018-02-09 2019-08-19 Inteco B V Werkwijze en inrichting voor het vervaardigen van warmtewisselende elementen, en elemten als zodanig

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH1192997A (ja) * 1997-09-16 1999-04-06 Ebara Corp 微細穴内部への液充填方法、及びストレート低融点半田バンプメッキ方法及び装置
CN1240515C (zh) * 2001-02-27 2006-02-08 日商·胜美达股份有限公司 无铅焊锡合金及使用该合金的电子部件
JP2003001482A (ja) * 2001-06-19 2003-01-08 Tokyo Daiichi Shoko:Kk 無鉛半田合金
US20030021718A1 (en) * 2001-06-28 2003-01-30 Osamu Munekata Lead-free solder alloy
EP1439024B1 (en) * 2001-08-30 2005-03-30 Sumida Corporation Nonleaded solder alloy and electronic parts using it
JP2004154864A (ja) * 2002-10-15 2004-06-03 Senju Metal Ind Co Ltd 鉛フリーはんだ合金
US7172726B2 (en) * 2002-10-15 2007-02-06 Senju Metal Industry Co., Ltd. Lead-free solder
JP4318449B2 (ja) * 2002-12-03 2009-08-26 千住金属工業株式会社 鉛フリーはんだ合金
KR100445350B1 (ko) * 2003-04-17 2004-08-26 희성금속 주식회사 납땜용 무연합금
JP2007075836A (ja) * 2005-09-12 2007-03-29 Heesung Material Ltd 半田付け用無鉛合金
CN1803380A (zh) * 2006-01-11 2006-07-19 黄守友 一种无铅焊料及其制备方法
CN100547518C (zh) * 2006-12-30 2009-10-07 联想(北京)有限公司 便携式电子设备减振阻尼结构部件及笔记本电脑
CN101848787B (zh) * 2007-08-14 2013-10-23 株式会社爱科草英 无铅焊料组合物及使用它的印刷电路板与电子器件
JP2008221341A (ja) * 2008-05-27 2008-09-25 Senju Metal Ind Co Ltd 鉛フリーはんだ合金
CN103406687A (zh) * 2013-08-20 2013-11-27 四川朗峰电子材料有限公司 Sn-Cu-Ni系合金焊锡材料及其应用

Also Published As

Publication number Publication date
US20190118310A1 (en) 2019-04-25
EP3189929A4 (en) 2017-12-06
JP5842973B1 (ja) 2016-01-13
MY165589A (en) 2018-04-06
EP3189929B1 (en) 2019-08-14
ES2748701T3 (es) 2020-03-17
CN106687250A (zh) 2017-05-17
PH12017500404A1 (en) 2017-07-17
US20170274481A1 (en) 2017-09-28
WO2016035879A1 (ja) 2016-03-10
CN106687250B (zh) 2020-05-22
JP2016052676A (ja) 2016-04-14
EP3189929A1 (en) 2017-07-12

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