WO2016035879A1 - 端子予備メッキ用鉛フリーはんだ合金及び電子部品 - Google Patents
端子予備メッキ用鉛フリーはんだ合金及び電子部品 Download PDFInfo
- Publication number
- WO2016035879A1 WO2016035879A1 PCT/JP2015/075179 JP2015075179W WO2016035879A1 WO 2016035879 A1 WO2016035879 A1 WO 2016035879A1 JP 2015075179 W JP2015075179 W JP 2015075179W WO 2016035879 A1 WO2016035879 A1 WO 2016035879A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- mass
- solder
- terminal
- lead
- solder alloy
- Prior art date
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Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/24—Selection of soldering or welding materials proper
- B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
- B23K35/262—Sn as the principal constituent
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/0004—Resistance soldering
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/24—Selection of soldering or welding materials proper
- B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C13/00—Alloys based on tin
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F27/00—Details of transformers or inductances, in general
- H01F27/28—Coils; Windings; Conductive connections
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
Definitions
- the present invention relates to a lead-free solder alloy, particularly a lead-free solder alloy for terminal pre-plating suitable for soldering or pre-plating of the end of a coil, and an electronic component.
- Electronic devices use coil parts with copper wires wound around the lead, like transformers, and motors such as computer disk drives and cooling fans use coils. Since these coils are conductive, the terminal portions are soldered to the terminals of electronic devices and motors.
- the coil terminal part and the terminal cannot be soldered as they are. Therefore, when soldering, enamel and polyurethane resin (hereinafter referred to as a coating material) in the coil terminal portion must be removed.
- the removal of the covering material may be mechanically peeled off with a blade, but the mechanical removal takes time and is inferior in productivity. Therefore, the method of removing the coating material from the coil terminal portion is performed by melting the coating material with heat. The method of removing the coating material with heat is to dissolve the coating material with the heat of the molten solder and remove it by immersing the coil terminal portion in the molten solder.
- pre-plating is performed on the coil end portion in advance in order to obtain a good soldered portion.
- the pre-plating of the coil terminal portion is performed by immersing the coil terminal portion in the molten solder.
- the coil terminal portion is immersed in the molten solder even when the coating material is removed, the coil terminal to the molten solder is used. The immersion of the part enables a rational operation of performing preliminary plating simultaneously with the removal of the covering material.
- a flux is applied to the coil terminal, and then the terminal is immersed in molten solder. Then, the coating material is melted by the heat of the molten solder, and the flux applied to the coil terminal portion floats around the immersed coil terminal portion. Accordingly, the coating material is removed, and the flux acts where the copper wire is exposed, so that the molten solder is metallically joined to the copper wire.
- Pb-Sn solder has been used as a pre-plating for coil terminals.
- lead containing no Pb has been used in recent years.
- Free solder has been used.
- the soldering temperature is around 400 ° C.
- the soldering temperature is increased in lead-free solder, oxidation of the molten solder surface proceeds and a large amount of oxide is generated. The generation of a large amount of the oxide also increases the amount attached to the soldered portion, thereby deteriorating the appearance characteristics of the product and lowering the wettability, so that a good soldered portion cannot be obtained.
- Patent Documents 1 to 6 describe a technique for adding P or Ga, or P and Ga for the purpose of improving the solder cutting performance when the soldering temperature is around 400 ° C. There is no description of the effect of suppressing the generation of bridges and icicles by addition of P or Ga, or addition of P and Ga.
- an object of the present invention is to provide a lead-free solder alloy for terminal pre-plating and an electronic component with improved cutting performance under use conditions where the soldering temperature is around 400 ° C.
- the inventor of the present invention uses a predetermined amount of Ga and P in a Sn—Cu—Ni-based lead-free solder alloy in which the additive amount of Cu and Ni is set so that Sn is a main component and the soldering temperature is around 400 ° C. As a result, it was found that the cutting performance was improved even when the soldering temperature was around 400 ° C., and the present invention was completed.
- the invention according to claim 1 is a lead-free solder alloy for terminal pre-plating for pre-plating a terminal by dipping, wherein Cu is 4% by mass or more and 6% by mass or less, and Ni is 0.1% by mass or more. 0.2 mass% or less, Ga is 0.01 mass% or more and 0.04 mass% or less, P is 0.004 mass% or more and 0.03 mass% or less, and the total of Ga and P is 0.05 mass% or less,
- the lead is a lead-free solder alloy for terminal pre-plating in which the balance is Sn and the tension in the molten state by heating at the soldering temperature is 200 dyn / cm or less.
- Ga is 0.01% by mass or more and 0.04% by mass or less
- P is 0.004% by mass or more and 0.03% by mass or less
- the total of Ga and P is 0.05% by mass or less
- soldering temperature When the tension in the molten state by heating at 200 is 200 dyn / cm or less, even when the soldering temperature is close to 400 ° C., the soldering object such as the coil terminal is pulled up from the molten solder. Cutting performance is improved.
- solder breakage during soldering In the case of an electronic component in which the terminal part is pre-plated by immersing it in a molten solder and pulling it up, solder breakage during soldering And the generation of bridges and icicles can be suppressed.
- the temperature when soldering the soldering object to be melted in molten solder depends on the heat capacity of the terminal part of the object to be processed and the coil having the terminal part, but the melting point of the solder +20 to It is common to carry out at 50 ° C.
- the solder alloy used for the preliminary plating of the terminal portion is preferably a solder alloy having a melting point of 420 ° C. or lower so that the soldering temperature is 470 ° C. or lower.
- the soldering temperature is 470 ° C. or higher, copper erosion becomes severe.
- the amount of Ga added is considered.
- the amount of Ga added is less than 0.01% by mass, the effect of improving the cutting performance is obtained. Is not enough.
- the Ga addition amount exceeds 0.04% by mass, the melting point of the solder becomes high, which makes it unsuitable for use in soldering at around 400 ° C.
- the amount of P added is considered.
- the amount of P added is less than 0.004% by mass, the effect of improving cutting performance Is not enough.
- the addition amount of P exceeds 0.03% by mass, the melting point of the solder becomes high, which makes it unsuitable for use in soldering at around 400 ° C.
- Ga is 0.01% by mass or more and 0.04% by mass or less
- P is 0.004% by mass or more and 0.03% by mass. Add below.
- Table 1 shows examples and comparative examples of the present invention.
- the amount of each element added is mass%.
- solder breakability in Table 1 evaluated the tension when pulling up the sample from the molten solder.
- a method for measuring the tension a ring method using a Dvol surface tension meter was adopted. After each solder material having the composition shown in the examples and comparative examples was melted at 400 ° C. using a solder bath, the melted solder surface was scraped off and allowed to stand for 5 minutes. A 4 cm platinum ring (sample) was immersed and the tension at the time of pulling up was measured (unit: dyn / cm). Each test was performed 10 times for each solder composition, and the average value was calculated as the tension.
- Evaluation of icicles and bridges was made by melting each solder material of Examples and Comparative Examples at 400 ° C., scraping the melted solder surface, and immersing the terminal portion of the coil in which flux was previously applied to the soldering portion.
- the number of occurrences of icicles and bridges when pulled up was evaluated.
- the terminal portion of the coil is a Cu wire coil with 4 terminals on one side and a pitch of 2 mm, and the flux is rosin-based post flux (manufactured by Senju Metal: SR-209).
- a total of 20 coils were used to measure the total number of icicles and bridges.
- the immersion conditions were an immersion speed of 10 mm / sec, an immersion depth of 4 mm, and a pulling speed of 10 mm / sec.
- the evaluation result is ⁇ . Moreover, the evaluation result was set to x about the thing in which tension
- Ga and Ga is added in an amount of 0.01% by mass or more and 0.04% by mass or less, and P is added in an amount of 0.004% by mass or more and 0.03% by mass or less in a range where the total amount of P is 0.05% by mass or less.
- Example 1 added at 0.015% by mass, which is the value of the above, it can be seen that the breakability of the solder when the terminal portion is pulled out of the molten solder is improved, and the occurrence of icicles and bridges is suppressed.
- the addition amount of P is 0.03% by mass of the upper limit value
- the addition amount of Ga is 0.02 mass% so that the total addition amount of Ga and P is 0.05 mass% or less.
- the additive amount of Ga is 0.04% by mass of the upper limit
- the additive amount of P is 0.004% by mass so that the total additive amount of Ga and P is 0.05% by mass or less. Even if it is 3, it turns out that the cutting property of a solder when pulling up a terminal part out of molten solder improves, and generation
- Example 4 in which the addition amount of P is 0.004% by mass, which is the lower limit value, if about 0.02% by mass of Ga, which is lower than the upper limit value, is added, It can be seen that the cutting performance is improved and the occurrence of icicles and bridges is suppressed.
- Example 5 in which the additive amount of Ga is 0.01% by mass, which is the lower limit, if P is added by approximately 0.015% by mass, which is lower than the upper limit, It can be seen that the cutting performance is improved and the occurrence of icicles and bridges is suppressed.
- Example 6 in which the addition amount of P is 0.004% by mass of the lower limit value and the addition amount of Ga is 0.01% by mass of the lower limit value, the solder breakage when the terminal portion is pulled up from the molten solder It can be seen that the performance is improved and the occurrence of icicles and bridges is suppressed.
- Example 7 in which the addition amount of Ga and P is the same value as in Example 1 and the addition amount of Cu is the upper limit value, and in Example 8 in which the addition amount of Cu is the lower limit value, Ga and P are added. It can be seen that there is no effect on cutting performance.
- Example 9 in which the addition amounts of Ga and P are the same as those in Example 1 and the addition amount of Ni is the upper limit, and in Example 10 in which the addition amount of Cu is the lower limit, the addition of Ga and P is also performed. It can be seen that there is no effect on cutting performance.
- the terminal portion 10 is immersed and pulled up in solder melted at around 400 ° C.
- the covering material can be melted and removed by the heat of the molten solder, and the solder cutting performance at the time of soldering near 400 ° C. is improved. It was found that the occurrence of
- the vicinity of 400 ° C. which is the temperature at the time of soldering, refers to a temperature range of 380 to 470 ° C.
- the molten solder temperature is 470 ° C. or lower. This is because soldering is necessary.
- a solder alloy having a melting point of 420 ° C. or lower is desirable so that the soldering temperature is 470 ° C. or lower.
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Power Engineering (AREA)
- Organic Chemistry (AREA)
- Metallurgy (AREA)
- Materials Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Coils Of Transformers For General Uses (AREA)
- Connection Of Batteries Or Terminals (AREA)
- Connections Effected By Soldering, Adhesion, Or Permanent Deformation (AREA)
Abstract
Description
Claims (3)
- 浸漬によって予備メッキを端子に施すための端子予備メッキ用鉛フリーはんだ合金であって、
Cuが4質量%以上6質量%以下、Niが0.1質量%以上0.2質量%以下、Gaが0.01質量%以上0.04質量%以下、Pが0.004質量%以上0.03質量%以下、GaとPの合計が0.05質量%以下、残部がSnからなり、
はんだ付け温度での加熱による溶融状態での張力が200dyn/cm以下である
ことを特徴とする端子予備メッキ用鉛フリーはんだ合金。 - はんだ付け温度が380℃以上の端子予備メッキ用に使用される
ことを特徴とする請求項1に記載の端子予備メッキ用鉛フリーはんだ合金。 - 請求項1または請求項2に記載の端子予備メッキ用鉛フリーはんだ合金を使用して端子が予備メッキされた
ことを特徴とする電子部品。
Priority Applications (6)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP15837355.5A EP3189929B1 (en) | 2014-09-04 | 2015-09-04 | Lead-free solder alloy for use in terminal preplating, and electronic component |
ES15837355T ES2748701T3 (es) | 2014-09-04 | 2015-09-04 | Aleación de soldadura libre de plomo para uso en el prechapeado o del terminal, y componente electrónico |
CN201580047646.8A CN106687250B (zh) | 2014-09-04 | 2015-09-04 | 端子预镀覆用无铅软钎料合金及电子部件 |
US15/508,613 US20170274481A1 (en) | 2014-09-04 | 2015-09-04 | Lead-Free Solder Alloy for Terminal Preliminary Plating, and Electronic Component |
PH12017500404A PH12017500404A1 (en) | 2014-09-04 | 2017-03-03 | Lead-free solder alloy for use in terminal preplating, and electronic component |
US16/198,960 US20190118310A1 (en) | 2014-09-04 | 2018-11-23 | Lead-Free Solder Alloy for Terminal Preliminary Plating, and Electronic Component |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2014-180369 | 2014-09-04 | ||
JP2014180369A JP5842973B1 (ja) | 2014-09-04 | 2014-09-04 | 端子予備メッキ用鉛フリーはんだ合金及び電子部品 |
Related Child Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US15/508,613 A-371-Of-International US20170274481A1 (en) | 2014-09-04 | 2015-09-04 | Lead-Free Solder Alloy for Terminal Preliminary Plating, and Electronic Component |
US16/198,960 Continuation US20190118310A1 (en) | 2014-09-04 | 2018-11-23 | Lead-Free Solder Alloy for Terminal Preliminary Plating, and Electronic Component |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2016035879A1 true WO2016035879A1 (ja) | 2016-03-10 |
Family
ID=55073296
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/JP2015/075179 WO2016035879A1 (ja) | 2014-09-04 | 2015-09-04 | 端子予備メッキ用鉛フリーはんだ合金及び電子部品 |
Country Status (9)
Country | Link |
---|---|
US (2) | US20170274481A1 (ja) |
EP (1) | EP3189929B1 (ja) |
JP (1) | JP5842973B1 (ja) |
CN (1) | CN106687250B (ja) |
ES (1) | ES2748701T3 (ja) |
MY (1) | MY165589A (ja) |
PH (1) | PH12017500404A1 (ja) |
PT (1) | PT3189929T (ja) |
WO (1) | WO2016035879A1 (ja) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP3208028B1 (en) * | 2016-02-19 | 2021-04-07 | Max-Planck-Gesellschaft zur Förderung der Wissenschaften e.V. | A method and device for reversibly attaching a phase changing metal to an object |
NL2020406B1 (nl) * | 2018-02-09 | 2019-08-19 | Inteco B V | Werkwijze en inrichting voor het vervaardigen van warmtewisselende elementen, en elemten als zodanig |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
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JPH1192997A (ja) * | 1997-09-16 | 1999-04-06 | Ebara Corp | 微細穴内部への液充填方法、及びストレート低融点半田バンプメッキ方法及び装置 |
JP2004154864A (ja) * | 2002-10-15 | 2004-06-03 | Senju Metal Ind Co Ltd | 鉛フリーはんだ合金 |
JP2004181485A (ja) * | 2002-12-03 | 2004-07-02 | Senju Metal Ind Co Ltd | 鉛フリーはんだ合金 |
CN103406687A (zh) * | 2013-08-20 | 2013-11-27 | 四川朗峰电子材料有限公司 | Sn-Cu-Ni系合金焊锡材料及其应用 |
Family Cites Families (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20030091463A1 (en) * | 2001-02-27 | 2003-05-15 | Koichi Izumida | Unleaded solder alloy and electronic components using it |
JP2003001482A (ja) * | 2001-06-19 | 2003-01-08 | Tokyo Daiichi Shoko:Kk | 無鉛半田合金 |
TW592872B (en) * | 2001-06-28 | 2004-06-21 | Senju Metal Industry Co | Lead-free solder alloy |
KR100621387B1 (ko) * | 2001-08-30 | 2006-09-13 | 스미다 코포레이션 | 무납 땜납 합금 및 이를 사용한 전자부품 |
US7172726B2 (en) * | 2002-10-15 | 2007-02-06 | Senju Metal Industry Co., Ltd. | Lead-free solder |
KR100445350B1 (ko) * | 2003-04-17 | 2004-08-26 | 희성금속 주식회사 | 납땜용 무연합금 |
JP2007075836A (ja) * | 2005-09-12 | 2007-03-29 | Heesung Material Ltd | 半田付け用無鉛合金 |
CN1803380A (zh) * | 2006-01-11 | 2006-07-19 | 黄守友 | 一种无铅焊料及其制备方法 |
CN100547518C (zh) * | 2006-12-30 | 2009-10-07 | 联想(北京)有限公司 | 便携式电子设备减振阻尼结构部件及笔记本电脑 |
CN101848787B (zh) * | 2007-08-14 | 2013-10-23 | 株式会社爱科草英 | 无铅焊料组合物及使用它的印刷电路板与电子器件 |
JP2008221341A (ja) * | 2008-05-27 | 2008-09-25 | Senju Metal Ind Co Ltd | 鉛フリーはんだ合金 |
-
2014
- 2014-09-04 JP JP2014180369A patent/JP5842973B1/ja active Active
-
2015
- 2015-09-04 PT PT158373555T patent/PT3189929T/pt unknown
- 2015-09-04 WO PCT/JP2015/075179 patent/WO2016035879A1/ja active Application Filing
- 2015-09-04 MY MYPI2017000330A patent/MY165589A/en unknown
- 2015-09-04 US US15/508,613 patent/US20170274481A1/en not_active Abandoned
- 2015-09-04 CN CN201580047646.8A patent/CN106687250B/zh active Active
- 2015-09-04 ES ES15837355T patent/ES2748701T3/es active Active
- 2015-09-04 EP EP15837355.5A patent/EP3189929B1/en active Active
-
2017
- 2017-03-03 PH PH12017500404A patent/PH12017500404A1/en unknown
-
2018
- 2018-11-23 US US16/198,960 patent/US20190118310A1/en not_active Abandoned
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
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JPH1192997A (ja) * | 1997-09-16 | 1999-04-06 | Ebara Corp | 微細穴内部への液充填方法、及びストレート低融点半田バンプメッキ方法及び装置 |
JP2004154864A (ja) * | 2002-10-15 | 2004-06-03 | Senju Metal Ind Co Ltd | 鉛フリーはんだ合金 |
JP2004181485A (ja) * | 2002-12-03 | 2004-07-02 | Senju Metal Ind Co Ltd | 鉛フリーはんだ合金 |
CN103406687A (zh) * | 2013-08-20 | 2013-11-27 | 四川朗峰电子材料有限公司 | Sn-Cu-Ni系合金焊锡材料及其应用 |
Also Published As
Publication number | Publication date |
---|---|
EP3189929A4 (en) | 2017-12-06 |
CN106687250A (zh) | 2017-05-17 |
EP3189929B1 (en) | 2019-08-14 |
EP3189929A1 (en) | 2017-07-12 |
CN106687250B (zh) | 2020-05-22 |
PH12017500404A1 (en) | 2017-07-17 |
JP2016052676A (ja) | 2016-04-14 |
JP5842973B1 (ja) | 2016-01-13 |
PT3189929T (pt) | 2019-10-24 |
US20170274481A1 (en) | 2017-09-28 |
US20190118310A1 (en) | 2019-04-25 |
MY165589A (en) | 2018-04-06 |
ES2748701T3 (es) | 2020-03-17 |
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