MX2015013942A - Aleacion de soldadura sin plomo y circuito electronico en vehiculo. - Google Patents

Aleacion de soldadura sin plomo y circuito electronico en vehiculo.

Info

Publication number
MX2015013942A
MX2015013942A MX2015013942A MX2015013942A MX2015013942A MX 2015013942 A MX2015013942 A MX 2015013942A MX 2015013942 A MX2015013942 A MX 2015013942A MX 2015013942 A MX2015013942 A MX 2015013942A MX 2015013942 A MX2015013942 A MX 2015013942A
Authority
MX
Mexico
Prior art keywords
mass
solder alloy
vehicle electronic
solder
lead
Prior art date
Application number
MX2015013942A
Other languages
English (en)
Other versions
MX357114B (es
Inventor
Yoshikawa Shunsaku
Hirai Naoko
Tachibana Ken
Tachibana Yoshie
Original Assignee
Senju Metal Industry Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Senju Metal Industry Co filed Critical Senju Metal Industry Co
Publication of MX2015013942A publication Critical patent/MX2015013942A/es
Publication of MX357114B publication Critical patent/MX357114B/es

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/58—Means for relieving strain on wire connection, e.g. cord grip, for avoiding loosening of connections between wires and terminals within a coupling device terminating a cable
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457—Solder materials or compositions; Methods of application thereof
    • H05K3/3463—Solder compositions in relation to features of the printed circuit board or the mounting process
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
    • B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering, brazing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
    • B23K35/262—Sn as the principal constituent
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C13/00—Alloys based on tin
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C13/00—Alloys based on tin
    • C22C13/02—Alloys based on tin with antimony or bismuth as the next major constituent
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/70—Coupling devices
    • H01R12/71—Coupling devices for rigid printing circuits or like structures
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
    • H01R4/02—Soldered or welded connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457—Solder materials or compositions; Methods of application thereof
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • B23K2101/42—Printed circuits

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)

Abstract

Con el aumento de la densidad de los circuitos electrónicos en el vehículo, no sólo las grietas convencionales en las interfaces de la junta tales como entre el sustrato y el sitio de conexión soldada o un componente y el sitio de conexión soldada, sino también han surgido nuevos problemas de craqueo de grietas que se producen en la matriz Sn en el interior de la soldadura adherida. Para resolver el problema anterior, una aleación de soldadura libre de plomo con 1-4% en masa de Ag, 0.6- 0.8% en masa de Cu, 1-5% en masa de Sb, 0.01-0.2% en masa de Ni y el resto siendo Sn se utiliza. Una aleación de soldadura, que no sólo puede soportar duras características de ciclo de temperatura de bajas temperaturas de -40°C a altas temperaturas de 125°C sino también puede soportar las fuerzas externas que se producen cuando se monta sobre un bordillo o cuando choca con un vehículo en el frente durante largos períodos de tiempo, y un dispositivo de circuito electrónico en el vehículo utilizando dicha aleación de soldadura se pueden obtener por la misma.
MX2015013942A 2013-04-02 2014-04-03 Aleacion de soldadura sin plomo y circuito electronico en vehiculo. MX357114B (es)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2013077289A JP2015077601A (ja) 2013-04-02 2013-04-02 鉛フリーはんだ合金
PCT/JP2014/059902 WO2014163167A1 (ja) 2013-04-02 2014-04-03 鉛フリーはんだ合金と車載電子回路

Publications (2)

Publication Number Publication Date
MX2015013942A true MX2015013942A (es) 2017-07-28
MX357114B MX357114B (es) 2018-06-27

Family

ID=51658458

Family Applications (1)

Application Number Title Priority Date Filing Date
MX2015013942A MX357114B (es) 2013-04-02 2014-04-03 Aleacion de soldadura sin plomo y circuito electronico en vehiculo.

Country Status (13)

Country Link
US (1) US9837757B2 (es)
EP (1) EP2982469B1 (es)
JP (2) JP2015077601A (es)
KR (2) KR102038189B1 (es)
CN (2) CN108581266A (es)
BR (1) BR112015025125B1 (es)
ES (1) ES2718523T3 (es)
HU (1) HUE042401T2 (es)
MX (1) MX357114B (es)
MY (1) MY158373A (es)
PH (1) PH12015502283A1 (es)
PT (1) PT2982469T (es)
WO (1) WO2014163167A1 (es)

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JP6731034B2 (ja) 2018-12-25 2020-07-29 株式会社タムラ製作所 鉛フリーはんだ合金、はんだ接合用材料、電子回路実装基板及び電子制御装置
JP6731037B2 (ja) * 2018-12-28 2020-07-29 株式会社タムラ製作所 鉛フリーはんだ合金、はんだ接合用材料、電子回路実装基板及び電子制御装置
JP6795630B2 (ja) * 2019-01-10 2020-12-02 株式会社タムラ製作所 鉛フリーはんだ合金、ソルダペースト組成物、電子回路基板および電子制御装置
KR20210138614A (ko) 2019-02-26 2021-11-19 인듐 코포레이션 가혹한 서비스 조건을 위한 고 신뢰성의 무연 땜납 합금
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KR20220012904A (ko) 2019-05-27 2022-02-04 센주긴조쿠고교 가부시키가이샤 납땜 합금, 솔더 페이스트, 납땜 볼, 솔더 프리폼, 납땜 조인트, 차재 전자 회로, ecu 전자 회로, 차재 전자 회로 장치, 및 ecu 전자 회로 장치
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Also Published As

Publication number Publication date
KR102038189B1 (ko) 2019-10-29
EP2982469B1 (en) 2019-01-09
KR20150126385A (ko) 2015-11-11
ES2718523T3 (es) 2019-07-02
CN108581266A (zh) 2018-09-28
PH12015502283B1 (en) 2016-02-01
CN105142856A (zh) 2015-12-09
BR112015025125B1 (pt) 2020-03-24
US9837757B2 (en) 2017-12-05
HUE042401T2 (hu) 2019-06-28
JP5811304B2 (ja) 2015-11-11
WO2014163167A1 (ja) 2014-10-09
JPWO2014163167A1 (ja) 2017-02-16
MY158373A (en) 2016-09-26
JP2015077601A (ja) 2015-04-23
PH12015502283A1 (en) 2016-02-01
EP2982469A4 (en) 2016-06-29
MX357114B (es) 2018-06-27
PT2982469T (pt) 2019-04-23
BR112015025125A2 (pt) 2017-07-18
KR20160148036A (ko) 2016-12-23
US20160056570A1 (en) 2016-02-25
EP2982469A1 (en) 2016-02-10

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