MX2013009113A - Aleacion de soldadura para audio. - Google Patents

Aleacion de soldadura para audio.

Info

Publication number
MX2013009113A
MX2013009113A MX2013009113A MX2013009113A MX2013009113A MX 2013009113 A MX2013009113 A MX 2013009113A MX 2013009113 A MX2013009113 A MX 2013009113A MX 2013009113 A MX2013009113 A MX 2013009113A MX 2013009113 A MX2013009113 A MX 2013009113A
Authority
MX
Mexico
Prior art keywords
mass
acoustic device
solder alloy
solder
disclosed
Prior art date
Application number
MX2013009113A
Other languages
English (en)
Inventor
Ippei Akagi
Hideki Tokimoto
Seiki Suzuki
Masahumi SEINO
Isamu Osawa
Minoru Ueshima
Original Assignee
Senju Metal Industry Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Senju Metal Industry Co filed Critical Senju Metal Industry Co
Publication of MX2013009113A publication Critical patent/MX2013009113A/es

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
    • B23K35/262—Sn as the principal constituent
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/06—Soldering, e.g. brazing, or unsoldering making use of vibrations, e.g. supersonic vibrations
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
    • B23K3/04—Heating appliances
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C13/00—Alloys based on tin

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Pinball Game Machines (AREA)
  • Medicines That Contain Protein Lipid Enzymes And Other Medicines (AREA)

Abstract

Proveer la aleación de soldadura para audio la cual es aleación de soldadura senaria (de Sn•Ag•Cu•Sb•In•Ni•Pb) y tiene sus correspondientes cantidades contenidas para obtener excelente calidad de sonido y alta evaluación auditiva, como la soldadura de unión para conectar varios tipos de partes electrónicas utilizadas para el circuito electrónico tal como un circuito de filtro NW para sistema de audio. Un ejemplo preferible de las cantidades contenidas es como sigue: Ag de (1.0 a 1.01% en masa), Cu de (0.71 a 0.72% en masa), In de (0.003 a 0.0037% en masa), Ni de (0.016 a 0.017% en masa), Pb de (0.0025 a 0.0035% en masa), y el resto de Sn.
MX2013009113A 2012-05-10 2012-05-10 Aleacion de soldadura para audio. MX2013009113A (es)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2012/062009 WO2013108421A1 (ja) 2012-05-10 2012-05-10 音響用はんだ合金

Publications (1)

Publication Number Publication Date
MX2013009113A true MX2013009113A (es) 2013-11-01

Family

ID=48481421

Family Applications (1)

Application Number Title Priority Date Filing Date
MX2013009113A MX2013009113A (es) 2012-05-10 2012-05-10 Aleacion de soldadura para audio.

Country Status (9)

Country Link
US (1) US20140186208A1 (es)
EP (1) EP2644313B1 (es)
JP (1) JP5186063B1 (es)
KR (1) KR101305801B1 (es)
CN (1) CN103402694B (es)
AU (1) AU2012363597B2 (es)
MX (1) MX2013009113A (es)
TW (1) TWI441926B (es)
WO (1) WO2013108421A1 (es)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6397079B1 (ja) * 2017-04-07 2018-09-26 株式会社ケーヒン はんだ材料
JP6945896B2 (ja) * 2018-07-20 2021-10-06 株式会社ＫａＭＳ 音質改変素子、オーディオシステム、音質改変素子付きオーディオアンプ装置、音質改変素子付きスピーカシステム
JP6649596B1 (ja) * 2019-05-27 2020-02-19 千住金属工業株式会社 はんだ合金、はんだ粉末、およびはんだ継手
TWI817013B (zh) * 2019-05-27 2023-10-01 日商千住金屬工業股份有限公司 焊料膏及焊料膏用助焊劑
JP6649597B1 (ja) * 2019-05-27 2020-02-19 千住金属工業株式会社 はんだ合金、はんだ粉末、およびはんだ継手

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5838693A (ja) * 1981-08-31 1983-03-07 Pioneer Electronic Corp プリント基板の半田付方法
TW369451B (en) * 1996-05-10 1999-09-11 Ford Motor Co Solder composition and method of using to interconnect electronic components to circuits on thermoplastic substrates
JP3575311B2 (ja) * 1998-01-28 2004-10-13 株式会社村田製作所 Ｐｂフリー半田および半田付け物品
JP2000173253A (ja) * 1998-09-30 2000-06-23 Matsushita Electric Ind Co Ltd 携帯所持可能なミニディスクプレイヤ―
JP2001001180A (ja) * 1999-06-21 2001-01-09 Tanaka Electronics Ind Co Ltd 半田材料及びそれを用いた電子部品
JP2002096191A (ja) * 2000-09-18 2002-04-02 Matsushita Electric Ind Co Ltd はんだ材料およびこれを利用する電気・電子機器
JP4152596B2 (ja) 2001-02-09 2008-09-17 新日鉄マテリアルズ株式会社 ハンダ合金、ハンダボール及びハンダバンプを有する電子部材
JP3796181B2 (ja) 2002-02-14 2006-07-12 新日本製鐵株式会社 無鉛ハンダ合金、ハンダボール及びハンダバンプを有する電子部材
JP2005103645A (ja) * 2004-10-29 2005-04-21 Hitachi Metals Ltd はんだボールおよびその製造方法
WO2006129713A1 (ja) * 2005-06-03 2006-12-07 Senju Metal Industry Co., Ltd. 鉛フリーはんだ合金
CN1788918A (zh) * 2005-12-20 2006-06-21 徐振五 无铅环保焊料
US20100189594A1 (en) * 2006-01-16 2010-07-29 Hitachi Metals, Ltd. Solder alloy, solder ball and solder joint using same
KR101397271B1 (ko) * 2006-03-09 2014-05-20 닛데쓰스미킹 마이크로 메탈 가부시키가이샤 무연 솔더 합금, 솔더 볼 및 전자 부재와, 자동차 탑재전자 부재용 무연 솔더 합금, 솔더 볼 및 전자 부재

Also Published As

Publication number Publication date
US20140186208A1 (en) 2014-07-03
CN103402694A (zh) 2013-11-20
AU2012363597A1 (en) 2013-11-28
KR101305801B1 (ko) 2013-09-06
JP5186063B1 (ja) 2013-04-17
AU2012363597B2 (en) 2016-07-21
JPWO2013108421A1 (ja) 2015-05-11
CN103402694B (zh) 2015-03-25
EP2644313A1 (en) 2013-10-02
EP2644313B1 (en) 2016-03-09
WO2013108421A1 (ja) 2013-07-25
TWI441926B (zh) 2014-06-21
EP2644313A4 (en) 2014-07-23
TW201402831A (zh) 2014-01-16

Similar Documents

Publication Publication Date Title
MY154604A (en) Solder alloy, solder paste, and electronic circuit board
MY154361A (en) Solder alloy, solder paste, and electronic circuit board
MY154044A (en) Solder alloy, solder paste, and electronic circuit board
MX2021012411A (es) Aleaciones de soldadura libres de plata, libres de plomo.
MY164343A (en) Solder alloy, solder paste, and electronic circuit board
MX2013009113A (es) Aleacion de soldadura para audio.
PH12018500431A1 (en) Lead-free solder alloy, flux composition, solder paste composition, electronic circuit board and electronic control device
PH12015502283A1 (en) Lead-free solder alloy and in-vehicle electronic circuit
MY188659A (en) Solder alloy, solder paste, and electronic circuit board
MY162879A (en) Solder alloy, solder paste, and electronic circuit board
MY178741A (en) Copper alloy for electronic and electrical equipment, plastically worked copper alloy material for electronic and electrical equipment, and component and terminal for electronic and electrical equipment
MY158123A (en) Mixed alloy solder paste
PH12015502404B1 (en) Lead-free solder alloy
PH12019502148A1 (en) Solder alloy, solder paste, and solder joint
JP2011147982A5 (es)
MX2016015710A (es) Aleacion de soldadura.
JP2013193092A5 (ja) はんだ材料
RU2017144086A (ru) Припойная соединительная структура и способ пленкообразования
MX2021007954A (es) Aleacion de soldadura, pasta de soldadura, soldadura de preforma, bola de soldadura, soldadura de alambre, soldadura con nucleo de flujo de resina, junta de soldadura, tarjeta de circuito electronico y tarjeta de circuito electronico multi-capa.
JP2017024074A5 (es)
MY156398A (en) Audio solder alloy
PH12020550954A1 (en) Solder alloy and solder joint
EP3189929A4 (en) Lead-free solder alloy for use in terminal preplating, and electronic component
SG11202004069QA (en) High reliability lead-free solder alloy for electronic applications in extreme environments
TH77210B (th) โลหะผสมบัดกรีสำหรับเครื่องเสียง

Legal Events

Date Code Title Description
FG Grant or registration