WO2011102659A3 - 도전성 잉크 및 이를 이용한 전자소자 - Google Patents

도전성 잉크 및 이를 이용한 전자소자 Download PDF

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Publication number
WO2011102659A3
WO2011102659A3 PCT/KR2011/001067 KR2011001067W WO2011102659A3 WO 2011102659 A3 WO2011102659 A3 WO 2011102659A3 KR 2011001067 W KR2011001067 W KR 2011001067W WO 2011102659 A3 WO2011102659 A3 WO 2011102659A3
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WO
WIPO (PCT)
Prior art keywords
conductive ink
electronic device
same
resins
rosin
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PCT/KR2011/001067
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English (en)
French (fr)
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WO2011102659A9 (ko
WO2011102659A2 (ko
Inventor
장용운
장승준
정순호
손윤상
김광범
김태민
Original Assignee
(주)덕산테코피아
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Application filed by (주)덕산테코피아 filed Critical (주)덕산테코피아
Publication of WO2011102659A2 publication Critical patent/WO2011102659A2/ko
Publication of WO2011102659A9 publication Critical patent/WO2011102659A9/ko
Publication of WO2011102659A3 publication Critical patent/WO2011102659A3/ko

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092—Dispersed materials, e.g. conductive pastes or inks
    • H05K1/095—Dispersed materials, e.g. conductive pastes or inks for polymer thick films, i.e. having a permanent organic polymeric binder
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
    • B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering, brazing
    • B23K35/0244—Powders, particles or spheres; Preforms made therefrom
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
    • B23K35/262—Sn as the principal constituent
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
    • B23K35/264—Bi as the principal constituent
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
    • B23K35/3612—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest with organic compounds as principal constituents
    • B23K35/3613—Polymers, e.g. resins
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D11/00—Inks
    • C09D11/52—Electrically conductive inks
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
    • C09J9/02—Electrically-conducting adhesives
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C12/00—Alloys based on antimony or bismuth
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C13/00—Alloys based on tin
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/12—Structure, shape, material or disposition of the bump connectors prior to the connecting process
    • H01L2224/13—Structure, shape, material or disposition of the bump connectors prior to the connecting process of an individual bump connector
    • H01L2224/13001—Core members of the bump connector
    • H01L2224/13099—Material
    • H01L2224/13198—Material with a principal constituent of the material being a combination of two or more materials in the form of a matrix with a filler, i.e. being a hybrid material, e.g. segmented structures, foams
    • H01L2224/13298—Fillers
    • H01L2224/13299—Base material
    • H01L2224/13393—Base material with a principal constituent of the material being a solid not provided for in groups H01L2224/133 - H01L2224/13391, e.g. allotropes of carbon, fullerene, graphite, carbon-nanotubes, diamond
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/10—Bump connectors ; Manufacturing methods related thereto
    • H01L24/11—Manufacturing methods
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/10—Bump connectors ; Manufacturing methods related thereto
    • H01L24/12—Structure, shape, material or disposition of the bump connectors prior to the connecting process
    • H01L24/13—Structure, shape, material or disposition of the bump connectors prior to the connecting process of an individual bump connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01079—Gold [Au]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0206—Materials
    • H05K2201/0218—Composite particles, i.e. first metal coated with second metal

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Mechanical Engineering (AREA)
  • Organic Chemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Dispersion Chemistry (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Wood Science & Technology (AREA)
  • Inks, Pencil-Leads, Or Crayons (AREA)
  • Conductive Materials (AREA)

Abstract

본 발명은 도전성 잉크 및 이를 이용한 전자소자에 관한 것으로, 도전성 파우더; Sn과 Ag, Cu, Bi, Zn, In 및 Pb로 이루어진 그룹 중에서 선택된 하나 이상의 금속이 이루는 합금을 포함하는 저융점 합금 파우더; 로진수지 또는 로진변성 수지로 구성되는 제1수지, 및 열경화성 수지로 구성되는 제2수지를 포함하는 바인더; 활성화제; 및 용매를 포함하는 것을 특징으로 한다.
PCT/KR2011/001067 2010-02-18 2011-02-17 도전성 잉크 및 이를 이용한 전자소자 WO2011102659A2 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR10-2010-0014807 2010-02-18
KR1020100014807A KR101293914B1 (ko) 2010-02-18 2010-02-18 도전성 잉크 및 이를 이용한 전자소자

Publications (3)

Publication Number Publication Date
WO2011102659A2 WO2011102659A2 (ko) 2011-08-25
WO2011102659A9 WO2011102659A9 (ko) 2011-10-27
WO2011102659A3 true WO2011102659A3 (ko) 2012-02-02

Family

ID=44483474

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/KR2011/001067 WO2011102659A2 (ko) 2010-02-18 2011-02-17 도전성 잉크 및 이를 이용한 전자소자

Country Status (2)

Country Link
KR (1) KR101293914B1 (ko)
WO (1) WO2011102659A2 (ko)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9837572B2 (en) * 2011-01-27 2017-12-05 Hitachi Chemical Company, Ltd. Solar cell module and method of manufacturing thereof
KR101525652B1 (ko) * 2012-05-04 2015-06-03 삼성전기주식회사 도전성 수지 조성물, 이를 포함하는 적층 세라믹 커패시터 및 그 제조방법
CN102723145B (zh) * 2012-06-26 2013-10-23 刘一尘 一种低电阻导电印刷浆料的生产方法
US10056505B2 (en) 2013-03-15 2018-08-21 Inkron Ltd Multi shell metal particles and uses thereof
FI20135253L (fi) * 2013-03-15 2014-09-16 Inkron Ltd Monikerrosmetallipartikkelit ja niiden käyttö
KR101617717B1 (ko) 2014-01-24 2016-05-03 덕산하이메탈(주) 발열용 전도성 페이스트 조성물과 이를 포함하는 전기장치
KR20160144540A (ko) 2015-06-08 2016-12-19 한국기계연구원 전도성 고분자를 포함하는 솔더 조성물 및 이를 이용한 전도성 패턴 결합 방법
KR102225825B1 (ko) * 2017-11-10 2021-03-10 주식회사 엘지화학 광경화성 조성물 및 이의 경화물을 포함하는 코팅층
US10843262B2 (en) * 2018-08-02 2020-11-24 Xerox Corporation Compositions comprising eutectic metal alloy nanoparticles
CN108857143A (zh) * 2018-08-16 2018-11-23 铜山县恒丰机械有限公司 一种机械焊接材料粉料
CN111136402A (zh) * 2019-12-20 2020-05-12 深圳市朝日电子材料有限公司 一种增强型复合焊锡膏及其制备方法
KR102217021B1 (ko) 2021-01-04 2021-02-18 한국재료연구원 전도성 고분자를 포함하는 솔더 조성물 및 이를 이용한 전도성 패턴 결합 방법
KR102670489B1 (ko) * 2021-08-19 2024-05-29 대성금속 주식회사 은-그래핀 복합체 및 은 그래핀 복합체 잉크

Citations (5)

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Publication number Priority date Publication date Assignee Title
US20030151028A1 (en) * 2002-02-14 2003-08-14 Lawrence Daniel P. Conductive flexographic and gravure ink
KR20060012545A (ko) * 2002-07-03 2006-02-08 나노파우더스 인더스트리어스 리미티드. 저온 소결처리한 전도성 나노 잉크 및 이것의 제조 방법
KR20060112025A (ko) * 2005-04-26 2006-10-31 주식회사 잉크테크 금속 잉크 조성물
JP2009062525A (ja) * 2007-08-09 2009-03-26 Mitsubishi Materials Corp 導電性インキ及び該導電性インキを用いたプラズマディスプレイパネル用電極基板の製造方法
KR100929136B1 (ko) * 2009-02-16 2009-12-01 (주)덕산테코피아 도전성 접착제와 그 제조 방법 및 이를 포함하는 전자 장치

Family Cites Families (1)

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Publication number Priority date Publication date Assignee Title
US6117225A (en) 1998-06-22 2000-09-12 Tonejet Corporation Pty Ltd. Method of preparation of inks

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20030151028A1 (en) * 2002-02-14 2003-08-14 Lawrence Daniel P. Conductive flexographic and gravure ink
KR20060012545A (ko) * 2002-07-03 2006-02-08 나노파우더스 인더스트리어스 리미티드. 저온 소결처리한 전도성 나노 잉크 및 이것의 제조 방법
KR20060112025A (ko) * 2005-04-26 2006-10-31 주식회사 잉크테크 금속 잉크 조성물
JP2009062525A (ja) * 2007-08-09 2009-03-26 Mitsubishi Materials Corp 導電性インキ及び該導電性インキを用いたプラズマディスプレイパネル用電極基板の製造方法
KR100929136B1 (ko) * 2009-02-16 2009-12-01 (주)덕산테코피아 도전성 접착제와 그 제조 방법 및 이를 포함하는 전자 장치

Also Published As

Publication number Publication date
WO2011102659A9 (ko) 2011-10-27
WO2011102659A2 (ko) 2011-08-25
KR101293914B1 (ko) 2013-08-07
KR20110095021A (ko) 2011-08-24

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