WO2009008383A1 - 導電性微粒子、異方性導電材料及び接続構造体 - Google Patents
導電性微粒子、異方性導電材料及び接続構造体 Download PDFInfo
- Publication number
- WO2009008383A1 WO2009008383A1 PCT/JP2008/062221 JP2008062221W WO2009008383A1 WO 2009008383 A1 WO2009008383 A1 WO 2009008383A1 JP 2008062221 W JP2008062221 W JP 2008062221W WO 2009008383 A1 WO2009008383 A1 WO 2009008383A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- electroconductive
- fine particles
- connection structure
- melting point
- group
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
- H05K3/323—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives by applying an anisotropic conductive adhesive layer over an array of pads
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B5/00—Non-insulated conductors or conductive bodies characterised by their form
- H01B5/16—Non-insulated conductors or conductive bodies characterised by their form comprising conductive material in insulating or poorly conductive material, e.g. conductive rubber
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/24—Selection of soldering or welding materials proper
- B23K35/30—Selection of soldering or welding materials proper with the principal constituent melting at less than 1550 degrees C
- B23K35/3033—Ni as the principal constituent
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/24—Selection of soldering or welding materials proper
- B23K35/32—Selection of soldering or welding materials proper with the principal constituent melting at more than 1550 degrees C
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/20—Conductive material dispersed in non-conductive organic material
- H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B17/00—Insulators or insulating bodies characterised by their form
- H01B17/56—Insulating bodies
- H01B17/64—Insulating bodies with conductive admixtures, inserts or layers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R11/00—Individual connecting elements providing two or more spaced connecting locations for conductive members which are, or may be, thereby interconnected, e.g. end pieces for wires or cables supported by the wire or cable and having means for facilitating electrical connection to some other wire, terminal, or conductive member, blocks of binding posts
- H01R11/01—Individual connecting elements providing two or more spaced connecting locations for conductive members which are, or may be, thereby interconnected, e.g. end pieces for wires or cables supported by the wire or cable and having means for facilitating electrical connection to some other wire, terminal, or conductive member, blocks of binding posts characterised by the form or arrangement of the conductive interconnection between the connecting locations
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/02—Contact members
- H01R13/03—Contact members characterised by the material, e.g. plating, or coating materials
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
- H01R4/04—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation using electrically conductive adhesives
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
- H05K2201/0203—Fillers and particles
- H05K2201/0206—Materials
- H05K2201/0218—Composite particles, i.e. first metal coated with second metal
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
- H05K2201/0203—Fillers and particles
- H05K2201/0206—Materials
- H05K2201/0221—Insulating particles having an electrically conductive coating
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/04—Soldering or other types of metallurgic bonding
- H05K2203/0425—Solder powder or solder coated metal powder
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Physics & Mathematics (AREA)
- Chemical & Material Sciences (AREA)
- Dispersion Chemistry (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Conductive Materials (AREA)
- Non-Insulated Conductors (AREA)
- Wire Bonding (AREA)
Abstract
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN2008800226481A CN101689413B (zh) | 2007-07-06 | 2008-07-04 | 导电性微粒、各向异性导电材料及连接结构体 |
JP2008532517A JP4413267B2 (ja) | 2007-07-06 | 2008-07-04 | 導電性微粒子、異方性導電材料及び接続構造体 |
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2007178876 | 2007-07-06 | ||
JP2007-178876 | 2007-07-06 | ||
JP2008-044460 | 2008-02-26 | ||
JP2008044460 | 2008-02-26 |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2009008383A1 true WO2009008383A1 (ja) | 2009-01-15 |
Family
ID=40228554
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/JP2008/062221 WO2009008383A1 (ja) | 2007-07-06 | 2008-07-04 | 導電性微粒子、異方性導電材料及び接続構造体 |
Country Status (4)
Country | Link |
---|---|
JP (2) | JP4413267B2 (ja) |
KR (1) | KR101475100B1 (ja) |
CN (1) | CN101689413B (ja) |
WO (1) | WO2009008383A1 (ja) |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2011040301A (ja) * | 2009-08-12 | 2011-02-24 | Sekisui Chem Co Ltd | 導電性微粒子、異方性導電材料、及び、接続構造体 |
JP2011070943A (ja) * | 2009-09-25 | 2011-04-07 | Sekisui Chem Co Ltd | 導電性微粒子、異方性導電材料、及び、接続構造体 |
KR101138519B1 (ko) * | 2009-09-30 | 2012-04-25 | 삼성전기주식회사 | 도전성 페이스트 및 이를 이용한 인쇄회로기판의 제조방법 |
JP2015118932A (ja) * | 2013-11-18 | 2015-06-25 | 積水化学工業株式会社 | 導電性粒子、導電材料及び接続構造体 |
WO2017138521A1 (ja) * | 2016-02-08 | 2017-08-17 | 積水化学工業株式会社 | 導電性粒子、導電材料及び接続構造体 |
Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5536634B2 (ja) * | 2010-12-28 | 2014-07-02 | 株式会社日本触媒 | 導電性微粒子 |
JP5583572B2 (ja) * | 2010-12-28 | 2014-09-03 | 株式会社日本触媒 | 導電性微粒子 |
JP2012142247A (ja) * | 2011-01-06 | 2012-07-26 | Sekisui Chem Co Ltd | 異方性導電材料及び接続構造体 |
CN103946929A (zh) * | 2011-12-08 | 2014-07-23 | 株式会社日本触媒 | 导电性微粒及含有该导电性微粒的各向异性导电材料 |
CN103066475B (zh) * | 2013-01-07 | 2014-09-10 | 郭瑞 | 基于低熔点金属及其氧化物降低接触电阻的方法 |
JP6777380B2 (ja) * | 2014-05-27 | 2020-10-28 | 積水化学工業株式会社 | 導電性粒子、導電材料及び接続構造体 |
JP6641118B2 (ja) * | 2014-08-18 | 2020-02-05 | 積水化学工業株式会社 | 導電性粒子、導電材料及び接続構造体 |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS62188184A (ja) * | 1986-02-14 | 1987-08-17 | 日立化成工業株式会社 | 異方導電性を有する回路接続用接着剤組成物および接着フイルム並びにこれらを用いた回路の接続方法 |
JPH0536306A (ja) * | 1991-07-26 | 1993-02-12 | Sekisui Fine Chem Kk | 導電性微粒子、電極接続構造体及びその製造方法 |
WO2006025485A1 (ja) * | 2004-09-02 | 2006-03-09 | Sekisui Chemical Co., Ltd. | 導電性微粒子及び異方性導電材料 |
WO2006129713A1 (ja) * | 2005-06-03 | 2006-12-07 | Senju Metal Industry Co., Ltd. | 鉛フリーはんだ合金 |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4740657A (en) * | 1986-02-14 | 1988-04-26 | Hitachi, Chemical Company, Ltd | Anisotropic-electroconductive adhesive composition, method for connecting circuits using the same, and connected circuit structure thus obtained |
US4902857A (en) * | 1988-12-27 | 1990-02-20 | American Telephone And Telegraph Company, At&T Bell Laboratories | Polymer interconnect structure |
JPH07157720A (ja) * | 1993-12-03 | 1995-06-20 | Sumitomo Bakelite Co Ltd | 異方導電フィルム |
JP4347974B2 (ja) * | 2000-01-05 | 2009-10-21 | 積水化学工業株式会社 | 導電性微粒子の製造方法、異方性導電接着剤及び導電接続構造体 |
JP2002076606A (ja) * | 2000-06-12 | 2002-03-15 | Hitachi Ltd | 電子機器および半導体装置 |
JP2004103935A (ja) * | 2002-09-11 | 2004-04-02 | Matsushita Electric Ind Co Ltd | 半導体装置およびその製造方法 |
JP2004095561A (ja) * | 2003-11-17 | 2004-03-25 | Sekisui Chem Co Ltd | 導電性微粒子、電極接続構造体及びその製造方法 |
JP2006049246A (ja) * | 2004-08-09 | 2006-02-16 | Sekisui Chem Co Ltd | 導電性微粒子及び異方性導電材料 |
-
2008
- 2008-07-04 JP JP2008532517A patent/JP4413267B2/ja active Active
- 2008-07-04 KR KR1020097026447A patent/KR101475100B1/ko active IP Right Grant
- 2008-07-04 WO PCT/JP2008/062221 patent/WO2009008383A1/ja active Application Filing
- 2008-07-04 CN CN2008800226481A patent/CN101689413B/zh active Active
- 2008-12-15 JP JP2008318054A patent/JP2009231266A/ja active Pending
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS62188184A (ja) * | 1986-02-14 | 1987-08-17 | 日立化成工業株式会社 | 異方導電性を有する回路接続用接着剤組成物および接着フイルム並びにこれらを用いた回路の接続方法 |
JPH0536306A (ja) * | 1991-07-26 | 1993-02-12 | Sekisui Fine Chem Kk | 導電性微粒子、電極接続構造体及びその製造方法 |
WO2006025485A1 (ja) * | 2004-09-02 | 2006-03-09 | Sekisui Chemical Co., Ltd. | 導電性微粒子及び異方性導電材料 |
WO2006129713A1 (ja) * | 2005-06-03 | 2006-12-07 | Senju Metal Industry Co., Ltd. | 鉛フリーはんだ合金 |
Cited By (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2011040301A (ja) * | 2009-08-12 | 2011-02-24 | Sekisui Chem Co Ltd | 導電性微粒子、異方性導電材料、及び、接続構造体 |
JP2011070943A (ja) * | 2009-09-25 | 2011-04-07 | Sekisui Chem Co Ltd | 導電性微粒子、異方性導電材料、及び、接続構造体 |
KR101138519B1 (ko) * | 2009-09-30 | 2012-04-25 | 삼성전기주식회사 | 도전성 페이스트 및 이를 이용한 인쇄회로기판의 제조방법 |
JP2015118932A (ja) * | 2013-11-18 | 2015-06-25 | 積水化学工業株式会社 | 導電性粒子、導電材料及び接続構造体 |
WO2017138521A1 (ja) * | 2016-02-08 | 2017-08-17 | 積水化学工業株式会社 | 導電性粒子、導電材料及び接続構造体 |
JPWO2017138521A1 (ja) * | 2016-02-08 | 2018-02-15 | 積水化学工業株式会社 | 導電性粒子、導電材料及び接続構造体 |
JP2019012692A (ja) * | 2016-02-08 | 2019-01-24 | 積水化学工業株式会社 | 導電性粒子、導電材料及び接続構造体 |
TWI703584B (zh) * | 2016-02-08 | 2020-09-01 | 日商積水化學工業股份有限公司 | 導電性粒子、導電材料及連接構造體 |
Also Published As
Publication number | Publication date |
---|---|
JP2009231266A (ja) | 2009-10-08 |
KR101475100B1 (ko) | 2014-12-22 |
KR20100031103A (ko) | 2010-03-19 |
JP4413267B2 (ja) | 2010-02-10 |
CN101689413A (zh) | 2010-03-31 |
JPWO2009008383A1 (ja) | 2010-09-09 |
CN101689413B (zh) | 2012-01-04 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
WO2009008383A1 (ja) | 導電性微粒子、異方性導電材料及び接続構造体 | |
EP2278032A3 (en) | Electrically conductive bonding material, method of bonding with the same, and semiconductor device bonded with the same | |
WO2008136355A1 (ja) | 銅合金系摺動材料および銅合金系摺動部材 | |
TW200725646A (en) | Conductive particles for anisotropic conductive interconnection | |
WO2010150123A3 (en) | Method for treatment of a well using high solid content fluid delivery | |
EP2754445A3 (en) | Electricity-generating particulates for use in excessive sweating | |
EP1717325A4 (en) | SLIDE MATERIAL OF PB-FREE COPPER ALLOY | |
EP2368857A8 (en) | Heat ray-shielding material | |
EP1876604A4 (en) | INK COMPOSITION AND METALLIC MATERIAL | |
WO2009037964A1 (ja) | 異方性導電膜及びその製造方法、並びに、該異方性導電膜を用いた接合体 | |
WO2011102659A3 (ko) | 도전성 잉크 및 이를 이용한 전자소자 | |
JP2006228475A5 (ja) | ||
WO2010117875A3 (en) | Composite thermoelectric material and method for producing the same | |
WO2009094537A3 (en) | Nanoscale metal paste for interconnect and method of use | |
TW200728344A (en) | Resin composition and the circuit board of hybride integrated circuit of the same | |
WO2007072479A3 (en) | Piezoelectric composite material | |
WO2009041170A1 (ja) | 導電性フィルムおよびその製造方法 | |
WO2009040939A1 (ja) | 磁気抵抗効果を用いた負性抵抗素子 | |
TW200734429A (en) | Isotropically conductive adhesive sheet and circuit board | |
WO2007124408A3 (en) | Hydrogen sensor | |
WO2008008413A3 (en) | Ultra fine nepheline syenite powder and products for using same | |
WO2009141231A3 (en) | Systems having components coupled with electrostatic dissipative adhesive | |
WO2012131289A3 (en) | Pressure sensitive polymer composite material adapted for touch screen | |
TW200700573A (en) | Sputtering target and manufacturing method thereof | |
WO2010035258A3 (en) | Discrete metallic copper nanoparticles |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
WWE | Wipo information: entry into national phase |
Ref document number: 200880022648.1 Country of ref document: CN |
|
WWE | Wipo information: entry into national phase |
Ref document number: 2008532517 Country of ref document: JP |
|
121 | Ep: the epo has been informed by wipo that ep was designated in this application |
Ref document number: 08790901 Country of ref document: EP Kind code of ref document: A1 |
|
ENP | Entry into the national phase |
Ref document number: 20097026447 Country of ref document: KR Kind code of ref document: A |
|
NENP | Non-entry into the national phase |
Ref country code: DE |
|
122 | Ep: pct application non-entry in european phase |
Ref document number: 08790901 Country of ref document: EP Kind code of ref document: A1 |