WO2010035258A3 - Discrete metallic copper nanoparticles - Google Patents

Discrete metallic copper nanoparticles Download PDF

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Publication number
WO2010035258A3
WO2010035258A3 PCT/IL2009/000918 IL2009000918W WO2010035258A3 WO 2010035258 A3 WO2010035258 A3 WO 2010035258A3 IL 2009000918 W IL2009000918 W IL 2009000918W WO 2010035258 A3 WO2010035258 A3 WO 2010035258A3
Authority
WO
WIPO (PCT)
Prior art keywords
copper nanoparticles
metallic copper
discrete metallic
discrete
suspendible
Prior art date
Application number
PCT/IL2009/000918
Other languages
French (fr)
Other versions
WO2010035258A2 (en
Inventor
Adi Cohen
Miron Hazani
Original Assignee
Nanoready Ltd.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nanoready Ltd. filed Critical Nanoready Ltd.
Publication of WO2010035258A2 publication Critical patent/WO2010035258A2/en
Publication of WO2010035258A3 publication Critical patent/WO2010035258A3/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/02—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of metals or alloys
    • H01B1/026—Alloys based on copper
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
    • B22F1/05—Metallic powder characterised by the size or surface area of the particles
    • B22F1/054—Nanosized particles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
    • B22F1/05—Metallic powder characterised by the size or surface area of the particles
    • B22F1/054—Nanosized particles
    • B22F1/0545—Dispersions or suspensions of nanosized particles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
    • B22F1/05—Metallic powder characterised by the size or surface area of the particles
    • B22F1/054—Nanosized particles
    • B22F1/0553—Complex form nanoparticles, e.g. prism, pyramid, octahedron
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
    • B22F1/05—Metallic powder characterised by the size or surface area of the particles
    • B22F1/054—Nanosized particles
    • B22F1/056—Submicron particles having a size above 100 nm up to 300 nm
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
    • B22F1/06—Metallic powder characterised by the shape of the particles
    • B22F1/065—Spherical particles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
    • B22F1/14—Treatment of metallic powder
    • B22F1/148—Agglomerating
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F9/00—Making metallic powder or suspensions thereof
    • B22F9/16—Making metallic powder or suspensions thereof using chemical processes
    • B22F9/18—Making metallic powder or suspensions thereof using chemical processes with reduction of metal compounds
    • B22F9/24—Making metallic powder or suspensions thereof using chemical processes with reduction of metal compounds starting from liquid metal compounds, e.g. solutions
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B82—NANOTECHNOLOGY
    • B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y30/00—Nanotechnology for materials or surface science, e.g. nanocomposites
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/14—Conductive material dispersed in non-conductive inorganic material
    • H01B1/16—Conductive material dispersed in non-conductive inorganic material the conductive material comprising metals or alloys
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092—Dispersed materials, e.g. conductive pastes or inks
    • H05K1/097—Inks comprising nanoparticles and specially adapted for being sintered at low temperature
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F2998/00—Supplementary information concerning processes or compositions relating to powder metallurgy
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0779—Treatments involving liquids, e.g. plating, rinsing characterised by the specific liquids involved
    • H05K2203/0786—Using an aqueous solution, e.g. for cleaning or during drilling of holes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H05K3/1241—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by ink-jet printing or drawing by dispensing
    • H05K3/125—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by ink-jet printing or drawing by dispensing by ink-jet printing

Abstract

Discrete copper nanoparticles, which are reversibly re-suspendible and/or re-dispersible, and which have a narrow size distribution with sigma value of less than 30 percent of their most frequent average diameter, and novel methods for preparing same are provided. Further provided are uses of the copper nanoparticles in applications such as for electronic printing.
PCT/IL2009/000918 2008-09-25 2009-09-23 Discrete metallic copper nanoparticles WO2010035258A2 (en)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
US10008408P 2008-09-25 2008-09-25
US61/100,084 2008-09-25
US22303909P 2009-07-05 2009-07-05
US61/223,039 2009-07-05

Publications (2)

Publication Number Publication Date
WO2010035258A2 WO2010035258A2 (en) 2010-04-01
WO2010035258A3 true WO2010035258A3 (en) 2010-10-07

Family

ID=42060193

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/IL2009/000918 WO2010035258A2 (en) 2008-09-25 2009-09-23 Discrete metallic copper nanoparticles

Country Status (1)

Country Link
WO (1) WO2010035258A2 (en)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2011004363A2 (en) 2009-07-05 2011-01-13 Nanoready Ltd. Method and system for online user feedback on websites and software
ES2819077T3 (en) 2013-08-09 2021-04-14 Leibniz Institut Fuer Neue Mat Gemeinnuetzige Gmbh Formation of surface modified metal colloids
GB201403731D0 (en) 2014-03-03 2014-04-16 P V Nano Cell Ltd Nanometric copper formulations
CN106715009A (en) * 2014-08-28 2017-05-24 石原产业株式会社 Metallic copper particles, and production method therefor
US10357943B2 (en) * 2015-01-14 2019-07-23 Lockheed Martin Corporation Articles having an exposed surface coating formed from copper nanoparticles
KR20200042454A (en) * 2017-06-05 2020-04-23 나노-디멘션 테크놀로지스, 엘티디. Agglomerates of metallic geometrically distinct nanoparticle compositions and methods for their formation
US10308598B1 (en) * 2017-11-13 2019-06-04 Shenzhen China Star Optoelectronics Technology Co., Ltd. Copper protective agent
CN109776366B (en) * 2017-11-13 2020-12-25 深圳市华星光电技术有限公司 Copper protective agent
CN109467984B (en) * 2018-10-17 2021-08-31 深圳先进技术研究院 Self-assembled copper ball, conductive ink and preparation method and application thereof
KR102423669B1 (en) * 2021-11-10 2022-07-21 황차환 Method for manufacturing copper particles capable of shape control and conductive ink composition comprising copper particles prepared thereby

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20050137334A1 (en) * 1999-11-05 2005-06-23 Bio Merieux Composite nanospheres and their conjugates with biomolecules
WO2008013198A1 (en) * 2006-07-28 2008-01-31 The Furukawa Electric Co., Ltd. Method for producing fine particle dispersion and fine particle dispersion
WO2008021604A2 (en) * 2006-05-19 2008-02-21 Purdue Research Foundation Rapid synthesis of ternary, binary and multinary chalcogenide nanoparticles
WO2008058958A2 (en) * 2006-11-14 2008-05-22 Basf Se Method for production of a mini suspoemulsion or suspension of sub-micron core/shell particles
US20080190325A1 (en) * 2005-06-04 2008-08-14 Solvay Infra Bad Hoeningen Gmbh Modified Nanoparticles

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20050137334A1 (en) * 1999-11-05 2005-06-23 Bio Merieux Composite nanospheres and their conjugates with biomolecules
US20080190325A1 (en) * 2005-06-04 2008-08-14 Solvay Infra Bad Hoeningen Gmbh Modified Nanoparticles
WO2008021604A2 (en) * 2006-05-19 2008-02-21 Purdue Research Foundation Rapid synthesis of ternary, binary and multinary chalcogenide nanoparticles
WO2008013198A1 (en) * 2006-07-28 2008-01-31 The Furukawa Electric Co., Ltd. Method for producing fine particle dispersion and fine particle dispersion
WO2008058958A2 (en) * 2006-11-14 2008-05-22 Basf Se Method for production of a mini suspoemulsion or suspension of sub-micron core/shell particles

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
LI ET AL.: "Evaluation on dispersion behavior of the aqueous copper nano-suspensions.", JOURNAL OF COLLOID AND INTERFACE SCIENCE, vol. 310, 1 March 2007 (2007-03-01), pages 456 - 463 *

Also Published As

Publication number Publication date
WO2010035258A2 (en) 2010-04-01

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