WO2010110626A3 - Composition for conductive paste containing nanometer-thick metal microplates with surface-modifying metal nano particles - Google Patents

Composition for conductive paste containing nanometer-thick metal microplates with surface-modifying metal nano particles Download PDF

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Publication number
WO2010110626A3
WO2010110626A3 PCT/KR2010/001876 KR2010001876W WO2010110626A3 WO 2010110626 A3 WO2010110626 A3 WO 2010110626A3 KR 2010001876 W KR2010001876 W KR 2010001876W WO 2010110626 A3 WO2010110626 A3 WO 2010110626A3
Authority
WO
WIPO (PCT)
Prior art keywords
composition
silver
nano particles
microplates
conductive paste
Prior art date
Application number
PCT/KR2010/001876
Other languages
French (fr)
Other versions
WO2010110626A2 (en
Inventor
Yoon-Jin Kim
Chang-Mo Ko
Ho-Souk Cho
Original Assignee
Ls Cable Ltd.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ls Cable Ltd. filed Critical Ls Cable Ltd.
Publication of WO2010110626A2 publication Critical patent/WO2010110626A2/en
Publication of WO2010110626A3 publication Critical patent/WO2010110626A3/en

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092—Dispersed materials, e.g. conductive pastes or inks
    • H05K1/097—Inks comprising nanoparticles and specially adapted for being sintered at low temperature
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B82—NANOTECHNOLOGY
    • B82B—NANOSTRUCTURES FORMED BY MANIPULATION OF INDIVIDUAL ATOMS, MOLECULES, OR LIMITED COLLECTIONS OF ATOMS OR MOLECULES AS DISCRETE UNITS; MANUFACTURE OR TREATMENT THEREOF
    • B82B3/00—Manufacture or treatment of nanostructures by manipulation of individual atoms or molecules, or limited collections of atoms or molecules as discrete units
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/02—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of metals or alloys
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/24—Conductive material dispersed in non-conductive organic material the conductive material comprising carbon-silicon compounds, carbon or silicon
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J11/00—Gas-filled discharge tubes with alternating current induction of the discharge, e.g. alternating current plasma display panels [AC-PDP]; Gas-filled discharge tubes without any main electrode inside the vessel; Gas-filled discharge tubes with at least one main electrode outside the vessel
    • H01J11/20—Constructional details
    • H01J11/34—Vessels, containers or parts thereof, e.g. substrates
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B82—NANOTECHNOLOGY
    • B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y30/00—Nanotechnology for materials or surface science, e.g. nanocomposites
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0206—Materials
    • H05K2201/0218—Composite particles, i.e. first metal coated with second metal
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0242—Shape of an individual particle
    • H05K2201/0245—Flakes, flat particles or lamellar particles

Abstract

Disclosed is a composition for a conductive paste containing micrometer-thick silver microplates (or plate-shaped silver micro particles) surface-modified with metal nano particles. The composition can be sintered at a relatively low temperature between 150 to 300 °C. For this purpose, it needs not more than 65 % silver nano particles per the weight of the composition. The plate-shaped silver micro particles may be replaced with plate-shaped copper micro particles coated with silver. The composition for a conductive paste may comprise solely the metal- modified silver microplates as a conductive material, and further comprise metal nano particles. According to another aspect, the composition may further comprise carbon nanotubes in addition to the metal nano particles. As additional conductive materials, micrometer-size flake-shaped copper and/or silver particles may be further included.
PCT/KR2010/001876 2009-03-27 2010-03-26 Composition for conductive paste containing nanometer-thick metal microplates with surface-modifying metal nano particles WO2010110626A2 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR1020090026577A KR101246750B1 (en) 2009-03-27 2009-03-27 Composition for Conductive Paste Containing Nanometer-Thick Metal Microplates with Surface-Modifying Metal Nanoparticles
KR10-2009-0026577 2009-03-27

Publications (2)

Publication Number Publication Date
WO2010110626A2 WO2010110626A2 (en) 2010-09-30
WO2010110626A3 true WO2010110626A3 (en) 2010-12-09

Family

ID=42781693

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/KR2010/001876 WO2010110626A2 (en) 2009-03-27 2010-03-26 Composition for conductive paste containing nanometer-thick metal microplates with surface-modifying metal nano particles

Country Status (2)

Country Link
KR (1) KR101246750B1 (en)
WO (1) WO2010110626A2 (en)

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102013281A (en) * 2010-12-11 2011-04-13 广东风华高新科技股份有限公司 Conductive silver adhesive for high-power LED
KR101273694B1 (en) * 2011-02-25 2013-06-12 삼성전기주식회사 Copper nano paste and method for forming the copper nano paste, and method for forming electrode using the copper nano paste
WO2013036519A1 (en) 2011-09-06 2013-03-14 Henkel Corporation Conductive material and process
KR101331112B1 (en) 2011-09-28 2013-11-19 (주)바이오니아 Nanocomposites consisting of carbon nanotube and metal oxide and a process for preparing the same
US9888568B2 (en) 2012-02-08 2018-02-06 Crane Electronics, Inc. Multilayer electronics assembly and method for embedding electrical circuit components within a three dimensional module
EP2813132B1 (en) * 2012-02-08 2018-04-11 Crane Electronics, Inc. Multilayer electronics assembly and method for embedding electrical circuit components within a three dimensional module
US9441117B2 (en) 2012-03-20 2016-09-13 Basf Se Mixtures, methods and compositions pertaining to conductive materials
TWI518708B (en) * 2012-09-13 2016-01-21 達泰科技股份有限公司 Silver paste including nano-sized silver particles and use thereof in production of photovoltaic device
KR101483733B1 (en) * 2012-09-26 2015-01-16 김상호 Conductive powder and menufacturing method of thereof
KR20140085732A (en) * 2012-12-27 2014-07-08 코오롱글로텍주식회사 Paste composition for forming electrode containing ag flake, method of preparing the same and electrode using the same
WO2014113937A1 (en) * 2013-01-23 2014-07-31 Henkel IP & Holding GmbH Flexible conductive ink
CN105579533B (en) 2013-08-16 2020-04-14 汉高知识产权控股有限责任公司 Submicron silver particle ink compositions, methods and uses
KR101499141B1 (en) * 2013-09-06 2015-03-11 동아대학교 산학협력단 Conductive Powder, Method for Manufacturing the Same, and Conductive Paste Using the Conductive Powder
CN109994373B (en) * 2019-04-12 2021-06-22 中国电子科技集团公司第三十八研究所 Micro-assembly bare chip connecting and repairing method

Citations (7)

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Publication number Priority date Publication date Assignee Title
JPH08148035A (en) * 1994-11-24 1996-06-07 Hitachi Chem Co Ltd Conductive material and conductive paste using this conductive material
JP2003272442A (en) * 2002-03-19 2003-09-26 Toyobo Co Ltd Conductive paste and printed circuit using it
JP2005078967A (en) * 2003-09-01 2005-03-24 Toyobo Co Ltd Conductive paste
JP2006120665A (en) * 2004-10-19 2006-05-11 Sumitomo Metal Mining Co Ltd Conductive resin paste composition containing silver and carbon nano tube, and semiconductor device using the same
KR100668548B1 (en) * 2001-04-09 2007-01-16 이 아이 듀폰 디 네모아 앤드 캄파니 Conductor compositions and the use thereof
JP2007149522A (en) * 2005-11-29 2007-06-14 Sumitomo Metal Mining Co Ltd Conductive resin paste composition containing silver and carbon nanotube, and semiconductor device using this
JP2007294451A (en) * 2006-04-21 2007-11-08 Advanced Touch Optics Technology Corp Conductive paste applicable to electric conductive substrate and electric conductive thin film

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20050116594A (en) * 2004-06-08 2005-12-13 (주)나노클러스터 Metal nano particles colored by using ceramic powder added conductive powder and manufacturing method thereof

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH08148035A (en) * 1994-11-24 1996-06-07 Hitachi Chem Co Ltd Conductive material and conductive paste using this conductive material
KR100668548B1 (en) * 2001-04-09 2007-01-16 이 아이 듀폰 디 네모아 앤드 캄파니 Conductor compositions and the use thereof
JP2003272442A (en) * 2002-03-19 2003-09-26 Toyobo Co Ltd Conductive paste and printed circuit using it
JP2005078967A (en) * 2003-09-01 2005-03-24 Toyobo Co Ltd Conductive paste
JP2006120665A (en) * 2004-10-19 2006-05-11 Sumitomo Metal Mining Co Ltd Conductive resin paste composition containing silver and carbon nano tube, and semiconductor device using the same
JP2007149522A (en) * 2005-11-29 2007-06-14 Sumitomo Metal Mining Co Ltd Conductive resin paste composition containing silver and carbon nanotube, and semiconductor device using this
JP2007294451A (en) * 2006-04-21 2007-11-08 Advanced Touch Optics Technology Corp Conductive paste applicable to electric conductive substrate and electric conductive thin film

Also Published As

Publication number Publication date
WO2010110626A2 (en) 2010-09-30
KR101246750B1 (en) 2013-03-26
KR20100108098A (en) 2010-10-06

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