WO2008123433A1 - Cu-ni-si-based alloy for electronic material - Google Patents
Cu-ni-si-based alloy for electronic material Download PDFInfo
- Publication number
- WO2008123433A1 WO2008123433A1 PCT/JP2008/056138 JP2008056138W WO2008123433A1 WO 2008123433 A1 WO2008123433 A1 WO 2008123433A1 JP 2008056138 W JP2008056138 W JP 2008056138W WO 2008123433 A1 WO2008123433 A1 WO 2008123433A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- mass
- alloy
- ratio
- electronic material
- based alloy
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C9/00—Alloys based on copper
- C22C9/06—Alloys based on copper with nickel or cobalt as the next major constituent
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22F—CHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS AND NON-FERROUS ALLOYS
- C22F1/00—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22F—CHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS AND NON-FERROUS ALLOYS
- C22F1/00—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
- C22F1/02—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working in inert or controlled atmosphere or vacuum
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22F—CHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS AND NON-FERROUS ALLOYS
- C22F1/00—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
- C22F1/08—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working of copper or alloys based thereon
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/02—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of metals or alloys
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/02—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of metals or alloys
- H01B1/026—Alloys based on copper
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B5/00—Non-insulated conductors or conductive bodies characterised by their form
- H01B5/02—Single bars, rods, wires, or strips
Abstract
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP08739256.9A EP2154257B1 (en) | 2007-03-30 | 2008-03-28 | Cu-ni-si-based alloy for electronic material |
US12/532,929 US20100086435A1 (en) | 2007-03-30 | 2008-03-28 | Cu-Ni-Si SYSTEM ALLOY FOR ELECTRONIC MATERIALS |
CN2008800101895A CN101646792B (en) | 2007-03-30 | 2008-03-28 | Cu-Ni-Si-based alloy for electronic material |
JP2009509224A JP4418028B2 (en) | 2007-03-30 | 2008-03-28 | Cu-Ni-Si alloy for electronic materials |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2007094441 | 2007-03-30 | ||
JP2007-094441 | 2007-03-30 |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2008123433A1 true WO2008123433A1 (en) | 2008-10-16 |
Family
ID=39830918
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/JP2008/056138 WO2008123433A1 (en) | 2007-03-30 | 2008-03-28 | Cu-ni-si-based alloy for electronic material |
Country Status (7)
Country | Link |
---|---|
US (1) | US20100086435A1 (en) |
EP (1) | EP2154257B1 (en) |
JP (1) | JP4418028B2 (en) |
KR (1) | KR101211984B1 (en) |
CN (1) | CN101646792B (en) |
TW (1) | TWI395824B (en) |
WO (1) | WO2008123433A1 (en) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20110017357A1 (en) * | 2008-03-31 | 2011-01-27 | Koji Sato | Copper alloy material for electrical/electronic equipments, and electrical/electronic part |
US20110017358A1 (en) * | 2008-03-31 | 2011-01-27 | Koji Sato | Copper alloy material for electrical/electronic equipments, and electrical/electronic part |
JP2012201958A (en) * | 2011-03-28 | 2012-10-22 | Mitsubishi Shindoh Co Ltd | Cu-Ni-Si BASED COPPER ALLOY SHEET HAVING EXCELLENT STRESS RELAXATION RESISTANCE, AND FATIGUE RESISTANCE AND SPRING PROPERTY AFTER BENDING, AND METHOD FOR PRODUCING THE SAME |
JP2015158009A (en) * | 2014-01-27 | 2015-09-03 | 古河電気工業株式会社 | Copper alloy material and production method thereof |
Families Citing this family (15)
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---|---|---|---|---|
WO2011068134A1 (en) * | 2009-12-02 | 2011-06-09 | 古河電気工業株式会社 | Copper alloy sheet material having low young's modulus and method for producing same |
WO2011125153A1 (en) * | 2010-04-02 | 2011-10-13 | Jx日鉱日石金属株式会社 | Cu-ni-si alloy for electronic material |
JP5045784B2 (en) * | 2010-05-14 | 2012-10-10 | 三菱マテリアル株式会社 | Copper alloy for electronic equipment, method for producing copper alloy for electronic equipment, and rolled copper alloy material for electronic equipment |
JP5714863B2 (en) | 2010-10-14 | 2015-05-07 | 矢崎総業株式会社 | Female terminal and method for manufacturing female terminal |
JP5712585B2 (en) * | 2010-12-03 | 2015-05-07 | 三菱マテリアル株式会社 | Copper alloy for electronic equipment, method for producing copper alloy for electronic equipment, and rolled copper alloy material for electronic equipment |
US9159985B2 (en) * | 2011-05-27 | 2015-10-13 | Ostuka Techno Corporation | Circuit breaker and battery pack including the same |
JP5903842B2 (en) | 2011-11-14 | 2016-04-13 | 三菱マテリアル株式会社 | Copper alloy, copper alloy plastic working material, and method for producing copper alloy plastic working material |
KR101274063B1 (en) * | 2013-01-22 | 2013-06-12 | 한국기계연구원 | A metal matrix composite with two-way shape precipitation and method for manufacturing thereof |
KR101709560B1 (en) * | 2013-09-27 | 2017-02-23 | 주식회사 엘지화학 | Secondary Battery with Electrode Tab Having Low Resistance |
CN105385890A (en) * | 2015-11-27 | 2016-03-09 | 宁波博威合金材料股份有限公司 | Nickel and silicon contained bronze alloy and application thereof |
CN105821238B (en) * | 2016-05-31 | 2018-01-02 | 黄河科技学院 | A kind of Cu alloy material and preparation method thereof |
CN106191725B (en) * | 2016-06-24 | 2018-01-26 | 河南江河机械有限责任公司 | High-intensity high-conductivity copper alloy nanometer phase precipitation technique method |
CN108193080B (en) * | 2016-12-08 | 2019-12-17 | 北京有色金属研究总院 | High-strength high-conductivity stress relaxation-resistant copper-nickel-silicon alloy material and preparation method thereof |
CN109609801A (en) * | 2018-12-06 | 2019-04-12 | 宁波博威合金材料股份有限公司 | High property copper alloy and preparation method thereof |
CN115386766A (en) * | 2022-08-11 | 2022-11-25 | 中国科学院金属研究所 | Cu-Ni-Si-Cr-Mg quinary copper alloy and preparation method thereof |
Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0349137B2 (en) | 1984-11-09 | 1991-07-26 | Sanyo Electric Co | |
JPH0718356A (en) * | 1993-07-01 | 1995-01-20 | Mitsubishi Electric Corp | Copper alloy for electronic equipment, its production and ic lead frame |
JP2862942B2 (en) | 1990-03-20 | 1999-03-03 | 古河電気工業株式会社 | Heat treatment method of Corson alloy |
JP2001207229A (en) | 2000-01-27 | 2001-07-31 | Nippon Mining & Metals Co Ltd | Copper alloy for electronic material |
JP2005113180A (en) | 2003-10-06 | 2005-04-28 | Furukawa Electric Co Ltd:The | Copper alloy for electronic equipment, and its production method |
JP2005350696A (en) * | 2004-06-08 | 2005-12-22 | Hitachi Cable Ltd | Method for manufacturing copper alloy for terminal and connector |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3049137B2 (en) * | 1991-12-27 | 2000-06-05 | 株式会社神戸製鋼所 | High strength copper alloy excellent in bending workability and method for producing the same |
CN101166840B (en) * | 2005-02-28 | 2012-07-18 | 古河电气工业株式会社 | Copper alloy |
CN1776997B (en) * | 2005-12-13 | 2010-05-05 | 江苏科技大学 | Large-capacity steam turbine generator rotor copper alloy slot wedge and its preparing method |
-
2008
- 2008-03-28 KR KR1020097022449A patent/KR101211984B1/en active IP Right Grant
- 2008-03-28 US US12/532,929 patent/US20100086435A1/en not_active Abandoned
- 2008-03-28 TW TW097111276A patent/TWI395824B/en active
- 2008-03-28 WO PCT/JP2008/056138 patent/WO2008123433A1/en active Application Filing
- 2008-03-28 CN CN2008800101895A patent/CN101646792B/en active Active
- 2008-03-28 JP JP2009509224A patent/JP4418028B2/en active Active
- 2008-03-28 EP EP08739256.9A patent/EP2154257B1/en active Active
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0349137B2 (en) | 1984-11-09 | 1991-07-26 | Sanyo Electric Co | |
JP2862942B2 (en) | 1990-03-20 | 1999-03-03 | 古河電気工業株式会社 | Heat treatment method of Corson alloy |
JPH0718356A (en) * | 1993-07-01 | 1995-01-20 | Mitsubishi Electric Corp | Copper alloy for electronic equipment, its production and ic lead frame |
JP2001207229A (en) | 2000-01-27 | 2001-07-31 | Nippon Mining & Metals Co Ltd | Copper alloy for electronic material |
JP2005113180A (en) | 2003-10-06 | 2005-04-28 | Furukawa Electric Co Ltd:The | Copper alloy for electronic equipment, and its production method |
JP2005350696A (en) * | 2004-06-08 | 2005-12-22 | Hitachi Cable Ltd | Method for manufacturing copper alloy for terminal and connector |
Non-Patent Citations (1)
Title |
---|
See also references of EP2154257A4 * |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20110017357A1 (en) * | 2008-03-31 | 2011-01-27 | Koji Sato | Copper alloy material for electrical/electronic equipments, and electrical/electronic part |
US20110017358A1 (en) * | 2008-03-31 | 2011-01-27 | Koji Sato | Copper alloy material for electrical/electronic equipments, and electrical/electronic part |
JP2012201958A (en) * | 2011-03-28 | 2012-10-22 | Mitsubishi Shindoh Co Ltd | Cu-Ni-Si BASED COPPER ALLOY SHEET HAVING EXCELLENT STRESS RELAXATION RESISTANCE, AND FATIGUE RESISTANCE AND SPRING PROPERTY AFTER BENDING, AND METHOD FOR PRODUCING THE SAME |
JP2015158009A (en) * | 2014-01-27 | 2015-09-03 | 古河電気工業株式会社 | Copper alloy material and production method thereof |
Also Published As
Publication number | Publication date |
---|---|
TWI395824B (en) | 2013-05-11 |
EP2154257A1 (en) | 2010-02-17 |
KR101211984B1 (en) | 2012-12-13 |
TW200902732A (en) | 2009-01-16 |
EP2154257B1 (en) | 2016-10-05 |
US20100086435A1 (en) | 2010-04-08 |
JPWO2008123433A1 (en) | 2010-07-15 |
CN101646792B (en) | 2012-02-22 |
JP4418028B2 (en) | 2010-02-17 |
EP2154257A4 (en) | 2012-01-11 |
KR20090123017A (en) | 2009-12-01 |
CN101646792A (en) | 2010-02-10 |
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