TW200510552A - Cu-Ni-Si based alloy having excellent fatigue property - Google Patents

Cu-Ni-Si based alloy having excellent fatigue property

Info

Publication number
TW200510552A
TW200510552A TW093123072A TW93123072A TW200510552A TW 200510552 A TW200510552 A TW 200510552A TW 093123072 A TW093123072 A TW 093123072A TW 93123072 A TW93123072 A TW 93123072A TW 200510552 A TW200510552 A TW 200510552A
Authority
TW
Taiwan
Prior art keywords
based alloy
excellent fatigue
fatigue property
present
fatigue properties
Prior art date
Application number
TW093123072A
Other languages
Chinese (zh)
Other versions
TWI287584B (en
Inventor
Shinken Nagahiro
Original Assignee
Nippon Mining & Metels Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=34268394&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=TW200510552(A) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by Nippon Mining & Metels Co Ltd filed Critical Nippon Mining & Metels Co Ltd
Publication of TW200510552A publication Critical patent/TW200510552A/en
Application granted granted Critical
Publication of TWI287584B publication Critical patent/TWI287584B/en

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C22METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22FCHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS AND NON-FERROUS ALLOYS
    • C22F1/00Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
    • C22F1/08Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working of copper or alloys based thereon
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B21MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
    • B21BROLLING OF METAL
    • B21B3/00Rolling materials of special alloys so far as the composition of the alloy requires or permits special rolling methods or sequences ; Rolling of aluminium, copper, zinc or other non-ferrous metals
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B1/00Processes of grinding or polishing; Use of auxiliary equipment in connection with such processes
    • CCHEMISTRY; METALLURGY
    • C22METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22CALLOYS
    • C22C9/00Alloys based on copper
    • C22C9/06Alloys based on copper with nickel or cobalt as the next major constituent
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23FNON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
    • C23F1/00Etching metallic material by chemical means
    • C23F1/10Etching compositions
    • C23F1/14Aqueous compositions
    • C23F1/32Alkaline compositions
    • C23F1/34Alkaline compositions for etching copper or alloys thereof

Abstract

The objective of the present invention is to improve the fatigue properties of a high strength copper alloy utilized for the electronic material of a connector or the like. The Cu-Ni-Si based alloy comprises, by mass, 1.0 to 4.5% Ni and 0.2 to 1.2% Si, and the balance Cu with inevitable impurities. The alloy has a surface in which a compressive residual stress of 20 to 200 MPa is present, and is excellent in fatigue properties.
TW093123072A 2003-07-31 2004-08-02 Cu-Ni-Si based alloy having excellent fatigue property TWI287584B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2003283522A JP4255330B2 (en) 2003-07-31 2003-07-31 Cu-Ni-Si alloy member with excellent fatigue characteristics

Publications (2)

Publication Number Publication Date
TW200510552A true TW200510552A (en) 2005-03-16
TWI287584B TWI287584B (en) 2007-10-01

Family

ID=34268394

Family Applications (1)

Application Number Title Priority Date Filing Date
TW093123072A TWI287584B (en) 2003-07-31 2004-08-02 Cu-Ni-Si based alloy having excellent fatigue property

Country Status (4)

Country Link
JP (1) JP4255330B2 (en)
KR (1) KR100642571B1 (en)
CN (1) CN100408708C (en)
TW (1) TWI287584B (en)

Cited By (1)

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TWI461549B (en) * 2012-02-14 2014-11-21 Jx Nippon Mining & Metals Corp Carbene alloy and its manufacturing method

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JP4068626B2 (en) 2005-03-31 2008-03-26 日鉱金属株式会社 Cu-Ni-Si-Co-Cr-based copper alloy for electronic materials and method for producing the same
JP5002767B2 (en) * 2005-06-10 2012-08-15 Dowaメタルテック株式会社 Copper alloy sheet and manufacturing method thereof
TW200704789A (en) * 2005-06-30 2007-02-01 Nippon Mining Co Sn-plated copper alloy bar having excellent fatigue characteristics
JP4501818B2 (en) 2005-09-02 2010-07-14 日立電線株式会社 Copper alloy material and method for producing the same
JP4655834B2 (en) * 2005-09-02 2011-03-23 日立電線株式会社 Copper alloy material for electrical parts and manufacturing method thereof
JP5011586B2 (en) * 2005-09-30 2012-08-29 Dowaメタルテック株式会社 Copper alloy sheet with improved bending workability and fatigue characteristics and its manufacturing method
JP4556841B2 (en) * 2005-10-27 2010-10-06 日立電線株式会社 High strength copper alloy material excellent in bending workability and manufacturing method thereof
JP4556842B2 (en) * 2005-10-27 2010-10-06 日立電線株式会社 High strength copper alloy material excellent in shear workability and method for producing the same
JP5002766B2 (en) * 2006-03-01 2012-08-15 Dowaメタルテック株式会社 High strength copper alloy sheet with excellent bending workability and manufacturing method
JP5002768B2 (en) * 2006-03-30 2012-08-15 Dowaメタルテック株式会社 Highly conductive copper-based alloy with excellent bending workability and manufacturing method thereof
JP5040140B2 (en) * 2006-03-31 2012-10-03 Dowaメタルテック株式会社 Cu-Ni-Si-Zn-based copper alloy
JP4986499B2 (en) * 2006-04-26 2012-07-25 Jx日鉱日石金属株式会社 Method for producing Cu-Ni-Si alloy tin plating strip
JP4006460B1 (en) * 2006-05-26 2007-11-14 株式会社神戸製鋼所 Copper alloy excellent in high strength, high conductivity and bending workability, and method for producing the same
EP2048251B1 (en) 2006-05-26 2012-01-25 Kabushiki Kaisha Kobe Seiko Sho Copper alloy having high strength, high electric conductivity and excellent bending workability
JP4247922B2 (en) * 2006-09-12 2009-04-02 古河電気工業株式会社 Copper alloy sheet for electrical and electronic equipment and method for producing the same
JP4143662B2 (en) * 2006-09-25 2008-09-03 日鉱金属株式会社 Cu-Ni-Si alloy
JP4926856B2 (en) * 2007-06-29 2012-05-09 三菱伸銅株式会社 Copper alloy strip for terminal and manufacturing method thereof
CN101946014A (en) 2008-02-18 2011-01-12 古河电气工业株式会社 Copper alloy material
JP4837697B2 (en) * 2008-03-31 2011-12-14 Jx日鉱日石金属株式会社 Cu-Ni-Si-Co-based copper alloy for electronic materials and method for producing the same
JP5225787B2 (en) * 2008-05-29 2013-07-03 Jx日鉱日石金属株式会社 Cu-Ni-Si alloy plate or strip for electronic materials
JP2010106332A (en) * 2008-10-31 2010-05-13 Furukawa Electric Co Ltd:The Copper alloy material for structural member of resistance welding machine
KR101208578B1 (en) * 2009-02-12 2012-12-06 주식회사 풍산 copper alloy with high strength and moderate conductivity, and method of manufacturing thereof
WO2011068134A1 (en) * 2009-12-02 2011-06-09 古河電気工業株式会社 Copper alloy sheet material having low young's modulus and method for producing same
CN103014409B (en) * 2011-09-21 2016-04-06 三菱伸铜株式会社 The Cu-Ni-Si series copper alloy of projection welding excellent and manufacture method thereof
JP6126791B2 (en) 2012-04-24 2017-05-10 Jx金属株式会社 Cu-Ni-Si copper alloy
CN102925746B (en) * 2012-11-29 2014-09-17 宁波兴业鑫泰新型电子材料有限公司 High-performance Cu-Ni-Si system copper alloy, and preparation method and processing method thereof
JP6696720B2 (en) * 2013-07-11 2020-05-20 古河電気工業株式会社 Copper alloy sheet and method for producing the same
JP5822895B2 (en) 2013-11-08 2015-11-25 Jx日鉱日石金属株式会社 Copper alloy plate and heat dissipating electronic component including the same
JP5847787B2 (en) * 2013-11-26 2016-01-27 Jx日鉱日石金属株式会社 Copper alloy sheet with excellent conductivity and stress relaxation properties
CN106103756B (en) 2014-03-25 2018-10-23 古河电气工业株式会社 The manufacturing method of copper alloy plate, connector and copper alloy plate
KR20160117210A (en) 2015-03-30 2016-10-10 제이엑스금속주식회사 Cu-Ni-Si BASED ROLLED COPPER ALLOY AND METHOD FOR MANUFACTURING THE SAME
CN105525135B (en) * 2015-12-16 2018-01-19 江西理工大学 The Cu Ni Si system's alloys and its preparation technology of a kind of high-strength less anisotropy index
CN106399748B (en) * 2016-10-05 2018-01-23 宁波兴业盛泰集团有限公司 A kind of cupro-nickel Si system alloy material used for lead frame and preparation method thereof
CN106756202A (en) * 2016-11-23 2017-05-31 宁波兴业盛泰集团有限公司 A kind of blaster fuse frame material complicated pluralism Cu alloy material and preparation method thereof
CN108193080B (en) * 2016-12-08 2019-12-17 北京有色金属研究总院 High-strength high-conductivity stress relaxation-resistant copper-nickel-silicon alloy material and preparation method thereof
CN107326214A (en) * 2017-07-03 2017-11-07 广东省材料与加工研究所 A kind of method that continuous casting rolling efficiently shapes corson alloy band
CN107326215A (en) * 2017-08-15 2017-11-07 徐高杰 A kind of processing method of slot wedge copper alloy
CN112251629B (en) * 2020-10-21 2022-05-27 有研工程技术研究院有限公司 Copper alloy material for 6G communication connector and preparation method thereof
CN115044801B (en) * 2022-08-16 2022-12-23 凯美龙精密铜板带(河南)有限公司 Copper-nickel-silicon alloy strip and preparation method thereof

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI461549B (en) * 2012-02-14 2014-11-21 Jx Nippon Mining & Metals Corp Carbene alloy and its manufacturing method

Also Published As

Publication number Publication date
JP4255330B2 (en) 2009-04-15
TWI287584B (en) 2007-10-01
KR100642571B1 (en) 2006-11-10
CN100408708C (en) 2008-08-06
JP2005048262A (en) 2005-02-24
CN1600881A (en) 2005-03-30
KR20050014758A (en) 2005-02-07

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