CN105525135B - The Cu Ni Si system's alloys and its preparation technology of a kind of high-strength less anisotropy index - Google Patents
The Cu Ni Si system's alloys and its preparation technology of a kind of high-strength less anisotropy index Download PDFInfo
- Publication number
- CN105525135B CN105525135B CN201510944624.3A CN201510944624A CN105525135B CN 105525135 B CN105525135 B CN 105525135B CN 201510944624 A CN201510944624 A CN 201510944624A CN 105525135 B CN105525135 B CN 105525135B
- Authority
- CN
- China
- Prior art keywords
- alloy
- rolling
- annealing
- strength
- preparation technology
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C9/00—Alloys based on copper
- C22C9/06—Alloys based on copper with nickel or cobalt as the next major constituent
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22F—CHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS AND NON-FERROUS ALLOYS
- C22F1/00—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
- C22F1/08—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working of copper or alloys based thereon
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Crystallography & Structural Chemistry (AREA)
- Conductive Materials (AREA)
Abstract
The invention discloses a kind of high-strength Cu Ni Si systems alloy of less anisotropy index and its preparation technology, suitable for the copper-based light sheet of cold rolling used for lead frame.The alloy each component chemical quality percentage is：Ni:2%~3%, Si:0.5%~1.0%, Sn:0.1%~0.5%, Fe:0.05%~0.1%, Mg:0.1%~0.3%, Zn:0.05%~0.08%, RE:0.2%~0.5%, remaining as Cu；Present invention addition yttrium-base heavy rare earth purification copper liquid, improves Ni2Si is separated out, while proposes that process annealing combination grade and stage technique effectively inhibits unfavorable texture before being dissolved, and by controlling cold rolling reduction ratio, product is obtained lateral shear band, is greatly improved anisotropy.The performance advantage of the alloy is embodied in 650 750MPa tensile strength, 13 18% elongation, the anisotropic index of intensity and elongation（IPA）6% and 8% are respectively smaller than, can effectively reduce warpage, deformation and cracking defect of the Cu Ni Si systems alloy in blanking process.
Description
Technical field
It is particularly suitable the present invention relates to a kind of high-strength Cu-Ni-Si alloy of less anisotropy index and its preparation technology
In flat cold-rolled sheet material used for lead frame, belong to high property copper alloy exploitation and processing technique field.
Background technology
Cu-Ni-Si systems (C7025) alloy belongs to typical ageing strengthening type high strength and medium conductivity alloy, due to good
Solderability, corrosion resistance, inoxidizability and plasticity and be widely used in the electronic devices such as lead frame, terminal and connector.Closely
Over a little years, in order to meet market and research and development needs, the C7025 alloys of different-alloy system are researched and developed successfully in laboratory in succession, state
It is inside and outside to have made numerous studies in terms of its microalloying mechanism, preparation technology and microstructure, obtain intensity and electric conductivity
Excellent cooperation, however, C7025 lumber recoverys in actual production process are relatively low, unstable product quality, downstream client's objection production
Product are frequent, and the performance of product is poor, are in particular in that hot rolled plate is cracked, and product flash and bending easily occurs when being punched
The problems such as.The anisotropy of product is to influence product deep processing matter after the heat treatment of the anisotropy of C7025 alloys, especially cold rolling
The key factor of amount.
It is well known that Cu-Ni-Si alloy process and heat treatment process in, the otherness of institutional framework, and
The formation of deformation texture and heat treatment texture can produce certain influence to its anisotropy behavior.How Cu- is further reduced
The anisotropic index of Ni-Si systems alloy, the combination property of product is improved, be that restriction copper alloy for lead-wire frame strip is further
Industrialization key issue.Numerous studies have been done in the anisotropy behavior to aluminium, copper alloy such as SNGH R K, and it is each to propose plane
Anisotropy index concept IPA (%) (IPA, in-plane anisotropy ,=(2Xmax-Xmid-Xmin)/2Xmax,
Xmax represents the maximum of three direction mechanical properties, and Xmid represents median, and Xmin represents minimum value), pass through anisotropy
Index can characterize the different sexual behaviour of sheet alloy with quantification.
From the point of view of reinforcing means, patent [ZL200410036828.9] focuses on to protect Ni and Si ratio to alloy property
Influence, patent [CN 102703754B] refer to increase V carry out crystal grain thinning, high-strength highly-conductive Cu-Ni-Si alloy can be obtained,
Patent [CN 102021359B] mentions classification rolling technique, can obtain the strong Cu-Ni-Si alloy of superelevation.Patent documents above is equal
It is the precipitation thermodynamics and dynamics condition that second phase particles are controlled by composition design and process innovation, further plays thin
Crystalline substance strengthens and the effect of precipitation strength.However, intensity and the performance indications that deep shaping property is often conflict.Although second
Phase amount of precipitation is higher, and intensity and electric conductivity are better, but excessive second, which is met, causes sheet material anisotropy behavior exacerbation, curved
Bent processing characteristics declines.
The bending from Grain Boundary Character, grain morphology and texture angle to Cu-Ni-Si alloy respectively of following patent document
The optimization method of performance is protected：
Patent document [1] CN 101503770A
Patent document [2] CN 103781925A
Patent document [3] CN 102985572A
Patent document [4] CN 103429771A
Patent document [1] is by controlling { 420 } and { 420 } of { 220 } crystal plane and pure copper powder of alloy copper alloy plate
X-ray intensity with { 220 } crystal plane is than the grain size with sheet material, to improve the bending machining performance of alloy and proof stress pine
Relaxation performance.And meeting the crystal grain orientation relationship of following formula (1) and formula (2) in the copper alloy plate X-ray intensity ratio, alloy is put down
When between 10-60 μm, copper alloy plate obtains with good bending machining performance and proof stress slackness equal crystal grain diameter
Energy.
I{420}/I0{ 420 } ＞ 1.0 (1)
I{220}/I0{220}≤3.0 (2)
Wherein I is that the X-ray diffraction of the copper alloy plate crystal plane is strong, I0It is that the X ray of standard pure copper powder crystal plane spreads out
Penetrate intensity.
In patent document [2], by controlling the content of different texture in copper alloy plate, improve copper alloy intensity and
Bending machining performance.And find when Cube orientations { 001 }<100>Area occupation ratio more than 5%, Brass orientation { 110 }<112>
Area occupation ratio below 20%, Copper orientation { 112 }<111>Area occupation ratio below 20%, work hardening index 0.2 with
When lower, copper alloy plate has excellent intensity, bendability.
In patent document [3], inventor is by by the aspect ratio (length of minor axis/crystal grain of crystal grain of crystal grain in alloy structure
Footpath) average value control between 0.4-0.6, average value in all crystal grains of Goss texture is controlled between 1.2-1.5, special
Different crystal boundary ∑6All grain boundaries length and LбWith all special grain boundary length and L ratio (Lб/ L) control between 60-70%,
It is 450-600N/mm to obtain elastic limit value2, the solder heat resistance fissility of 1000 hours is good at 150 DEG C, and deep draw adds
Work is excellent.
In patent document [4], by controlling top layer and central part in { 200 } positive pole figure { 001 }<100>The X of orientation
The maximum of transmitted intensity, the bendability of sheet alloy is improved, particularly improve the bending machining after notch processing
Property.
Above patent, the emphasis of concern are concentrated mainly on the intensity of copper alloy plate, bending machining performance, proof stress relaxation
Property and fissility.It is main from technique using micro alloying elements such as Al, Fe, Sn and Mg from the point of view of composition design angle
Control deformation temperature and cold rolling system and reduction ratio in course of hot rolling, finally to the texture characteristic of product, grain morphology and
Grain Boundary Character implements accurate control.
The content of the invention
The invention provides high-strength the deep-draw Cu-Ni-Si alloy and its preparation technology of a kind of less anisotropy index, leads to
Cross and add micro Y base mixing RE, coordinate rational cold-rolling process and Technology for Heating Processing, can effectively reduce high-strength Cu-Ni-Si systems
The anisotropy of alloy, it is particularly suitable for the punching process of materials of lead frame, the defects of substantially reducing warpage, cracking and bend.
To reach above-mentioned purpose, the technical scheme is that：
A kind of high-strength Cu-Ni-Si alloy of less anisotropy index of the present invention, each component chemical quality percentage
It is as follows：Ni:2~3%, Si:0.5~1.0%, Sn:0.1~0.5%, Fe:0.05%~0.1%, Mg:0.1%~0.3%,
Zn:0.05%~0.08%, RE:0.2%~0.5%, the mass ratio remaining as Cu and inevitable impurity, and Ni and Si is
4~5；The preferred yttrium base ion type rareearth intermediate alloy of composition of the RE mischmetals, wherein Y contents account for 50%, La contents and accounted for
30%, Ce content account for 20%；The alloy structure is characterized as that using α-Cu as matrix phase average crystal grain diameter is 40-60 μm, matrix
Dispersed precipitate nanoscale δ-Ni2Si precipitated phases, and transversely (perpendicular to roll to) equally distributed shear band, matrix texture be present
Component meets：
0.6<V(A+G+B)/V(C+S)<1.0
Wherein V (A+G+B) is sheet alloy A：{012}<100>、G(Goss)：{011}<100>、B(Brass)：
{011}<211>Volume fraction sum shared by texture component, V (C+S) are sheet alloy C (Copper)：{112}<111>And S：
{123}<634>Volume fraction sum shared by texture component.
A kind of preparation technology of the above-mentioned high-strength Cu-Ni-Si alloy of less anisotropy index, comprises the following steps：
(1) hot rolling technology：Melting is carried out according to designed each component chemical quality percentage, horizontal casting, then to casting
Part carries out hot rolling and obtains hot rolled plate, and hot rolling start rolling temperature is 850~950 DEG C, and finishing temperature is 750~850 DEG C, is carried out after hot rolling
Soft annealing；
(2) once cold rolling technique：Hot-roll annealing plate in step (1) is subjected to once cold rolling；
(3) process annealing：Process annealing is carried out in step (2) after cold rolling, the process annealing condition is that annealing temperature exists
100~300 DEG C, soaking time is 3~6 hours, and furnace cooling, the process annealing is in the gas shield stove of nitrogen or argon gas
Carry out；
(4) grade and stage is handled：Rapid classification solid solution is carried out to process annealing plate in step (3), the solid solubility temperature is set
Meter is at 850~900 DEG C, 60~80s of solution time, and first quick and back slow, fast heating rate is 30~50 for solution heat system design
DEG C/s, slow heat speed is 1~5 DEG C/s, between critical point temperature is 750 DEG C to 800 DEG C；
(5) secondary cold-rolling technique：Sheet material after being dissolved to step (4) carries out secondary cold-rolling；
(6) low temperature aging is handled：Ageing Treatment, aging temp design are finally carried out to secondary cold-rolling plate obtained by step (5)
At 400~500 DEG C, aging time is 4~6h.
Preferably, in the processing of step (6) low temperature aging, aging temp is designed as 430 DEG C~460 DEG C.
Preferably, the once cold rolling reduction ratio of hot-roll annealing plate is greater than 60% in step (2), applies two in step (5)
Secondary cold rolling reduction ratio is between 25~35%, and total reduction is more than 85% twice.
Preferably, it is 30% to apply secondary cold-rolling reduction ratio in step (5).
Preferably, in step (3) process annealing condition be annealing temperature at 100~300 DEG C, soaking time is 3~6 small
When, furnace cooling, the process annealing is carried out in the gas shield stove of nitrogen or argon gas.
Preferably, in step (3) process annealing condition be annealing temperature at 200 DEG C, soaking time is 4 hours.
Preferably, process annealing condition is that annealing temperature is 200 DEG C in step (3), and soaking time is 4 hours.
The beneficial effects of the present invention are：
1. the present invention makes full use of yttrium base ionic by carrying out composition design and process optimization to Cu-Ni-Si alloy
Purifications and Grain refinement of the RE to melt, coordinate rational cold rolling and Technology for Heating Processing, promote the timeliness analysis of the second phase
Go out the Volume fraction with crucial texture, institutional framework can be obtained using α-Cu as matrix, average grain size at 40 μm~60 μm,
Sheet material after timeliness has laterally uniform shear band, its tensile strength between 650~750MPa, elongation 13~
Between 18%, the anisotropic index (IPA) of intensity and elongation is respectively smaller than 6% and 8% performance.
2. the present invention, by quick heat refining matrix grain size, is reduced using solution heat system first quick and back slow
Recrystallization temperature, be advantageous to a small amount of A { 012 }<100>The formation of texture, Copper texture, while during slow heat,
Now crystal grain recrystallizes substantially, and recrystallization texture basically forms, Ni2Si precipitated phases can back dissolving into matrix, be slowly
Follow-up timeliness lays the foundation.
3. in order to reduce the anisotropy of Cu-Ni-Si alloy strip, this patent is by controlling once cold rolling and secondary cold
The reduction ratio rolled so that final copper alloy plate obtains transversely equally distributed shear band.The formation of shear band can not only pass through
Dislocation strengthening improve transverse strength, while also promote Copper orientation and S orientation crystal grain by it is improper sliding and it is noncrystal
Learn shear and turn to Goss orientations, then be orientated by Goss orientation transitions into Brass, although the presence of Brass orientations and Goss orientations
Anisotropy can be reduced, but if lateral shear ratio increases, Brass components and Goss components accordingly increase, can be serious
The elongation of Cu-Ni-Si alloy is influenceed, therefore, by the volume ratio control of final texture component within the specific limits.
4. the volume fraction ratio of the crucial orientation of the final crystal grain of Cu-Ni-Si alloy sheet material prepared by the technique meets formula
(1)0.6<V(A+G+B)/V(C+S)<1.0 (1)
Wherein V (A+G+B) is sheet alloy A：{012}<100>、G(Goss)：{011}<100>、B(Brass)：
{011}<211>Volume fraction sum shared by texture component, V (C+S) are sheet alloy C (Copper)：{112}<111>And S：
{123}<634>Volume fraction sum shared by texture component.
5. present invention process is simple, equipment requirement is not high, and most copper strip processing enterprise can be achieved, and be applicable to make
Make the copper sheet electronic device such as materials of lead frame.
Brief description of the drawings
Fig. 1 is the preparation technology schematic diagram of the embodiment of the present invention 1；
Fig. 2 is the tissue OM figures of the solid solution state of Cu-Ni-Si alloy sheet material in the embodiment of the present invention 1；
Fig. 3 is the tissue OM figures after Cu-Ni-Si alloy sheet material timeliness in the embodiment of the present invention 1；
Fig. 4 is the spatial orientation distribution function figure of Cu-Ni-Si alloy sheet material in the embodiment 1 measured using XRD；
Fig. 5 is the crystal grain distribution of orientations figure of Cu-Ni-Si alloy sheet material aging state in embodiment 1.
Embodiment
The present invention is described in further details with reference to accompanying drawing and specific implementation example.
Embodiment 1：
A kind of high-strength Cu-Ni-Si alloy of less anisotropy index, its each component composition such as table 1：
The chemical composition (wt%) of Cu-Ni-Si alloy in the embodiment 1 of table 1
| Ni | Si | Mg | Zn | Sn | Fe | RE | Cu |
| 3.12 | 0.72 | 0.226 | 0.06 | 0.51 | 0.076 | 0.3 | Surplus |
A kind of preparation technology of the high-strength Cu-Ni-Si alloy of less anisotropy index, comprises the following steps：
(1) melting and casting is carried out by the composition of table 1, melting is carried out in intermediate frequency furnace, and cast ingot dimension is 120 × 100
×25mm.Heating strand carries out hot rolling, the start rolling temperature of hot rolling is 920 DEG C, is rolled to 930 DEG C of insulation 2h on two roller hot-rolling mills
10 passages are made, final sheet metal thickness be 5mm, and finishing temperature is 780 DEG C, water cooling immediately after the completion of hot rolling, the hot rolling after water cooling
Plate is heated to 600 DEG C of insulation 12h soft annealing, and the milling face process of 0.5mm up and down is carried out after soft annealing；
(2) once cold rolling technique：Carry out cold rolling on 4-roller cold rolling mill, the sheet metal thickness after once cold rolling is 0.6mm.
(3) process annealing：Sheet material carries out process annealing after the completion of cold rolling, and annealing temperature is 200 DEG C, annealing time 4h,
And annealing atmosphere is protected using nitrogen.
(4) grade and stage is handled：The sheet material of process annealing carries out solution treatment, and solid solution craft is using two sections first quick and back slow
Formula heating cycle.First in a manner of 45 DEG C/s is quickly heated be heated to 780 DEG C, after be heated in a manner of 5 DEG C/s slow heat
860 DEG C, solid solution soaking time is 70s, and solution treatment uses continuous annealing furnace, argon gas protection.
(5) secondary cold-rolling technique：Sheet material after solid solution carries out secondary cold-rolling, and the sheet metal thickness after cold rolling is 0.4mm.
(6) low temperature aging is handled：Sheet material after secondary cold-rolling carries out Ageing Treatment, and Ageing Treatment is with N2Atmosphere is moved back
Carried out in stove.Aging temp is 450 DEG C, aging time 5h.
Comparative example 1：
It is with the difference of embodiment 1, its each component composition such as table 2 below of alloy：
The chemical composition (wt%) of Cu-Ni-Si alloy in the comparative example 1 of table 2
| Ni | Si | Mg | Zn | Sn | Fe | RE | Cu |
| 3.16 | 0.75 | 0.232 | 0.06 | 0.54 | 0.08 | - | Surplus |
Comparative example 2：
It is with the difference of embodiment 1, does not carry out the low temperature annealing process as described in step (3).
Comparative example 3：
It is with the difference of comparative example 1, does not carry out the low temperature annealing process as described in step (3).
Based on above-mentioned, mechanical property, anisotropic index are carried out to embodiment 1 and the result of above-mentioned comparative example, key is knitted
The test of the average grain size of structure Volume fraction and final timeliness plate, it is as a result as shown in table 3 below：
The embodiment 1 of table 3 and the mechanical property, IPA values and crucial texture volume ratio and average grain size of above-mentioned comparative example
Test result
Note：According to the in-plane anisotropy index of the mechanical experimental results in 3 directions of alloy, as the following formula progress alloy
The calculating of IPA values：
IPA=(2Xmax-Xmid-Xmin)/2Xmax × 100%
Wherein：Xmax, Xmin are respectively 0 °, 45 °, 90 ° direction Rm, Rp0.2, A maxima and minima, during Xmid is
Between be worth.
As shown in Fig. 2 sheet material is dissolved the tissue of state in embodiment 1, its average grain size is 48 μm；It is as shown in figure 3, real
The intra-die for applying sheet material alloy in example 1 is present largely along the uniform shear band (Shear band) of horizontal distribution, the shear band
It is one of key factor for controlling crucial texture Volume fraction；As shown in Figure 4, it can be seen that the height of less anisotropy index
Its texture of strong Cu-Ni-Si alloy is mainly A { 012 }<100>, Brass { 011 }<211>、Goss{011}<100>、Copper
{112}<111>With S { 123 }<634>Texture；As shown in figure 5, the Copper texture and S texture after solid solution are to be easier to form shearing
The texture of band, and particularly Copper texture, under certain secondary cold-rolling reduction ratio, Copper texture is knitted by shear band to Goss
Allosteric transformation, S texture easily change to Brass texture.By grade and stage and secondary cold-rolling technique, smoothly collocation can control very well
The Volume fraction of final texture component.
In summary, comparative example 1 and comparative example 1, comparative example 2 and comparative example 3 understand that Cu-Ni-Si alloy is added
After mischmetal, crystal grain is refined, and tensile strength, the yield strength of alloy have different degrees of raising, elongation percentage change
It is smaller, and intensity and the IPA values of elongation are also obviously reduced.It can also be seen that invention example 3,4 is satisfied by key from table 3
The Volume fraction (equation 1 above) of texture, preferably control the content of Brass texture and Goss texture, and average grain size
Between 40 μm~60 μm.Comparative examples 2 and embodiment 1 understand that before solid solution plus after process annealing, the intensity of alloy is further
Improve, and intensity I PA values are respectively less than 6 in embodiment 1, the IPA values of elongation percentage are less than 8.
As known by the technical knowledge, the present invention can pass through the embodiment party of other essence without departing from its spirit or essential feature
Case is realized.Therefore, embodiment disclosed above, for each side, all it is merely illustrative, is not only.Institute
Have within the scope of the present invention or the change in equal to the scope of the present invention is included by the present invention.
Claims (6)
1. a kind of high-strength Cu-Ni-Si alloy of less anisotropy index, it is characterised in that each component chemical quality percentage is such as
Under：Ni:2~3%, Si:0.5~1.0%, Sn:0.1~0.5%, Fe:0.05%~0.1%, Mg:0.1%~0.3%, Zn:
0.05%~0.08%, RE:0.2%~0.5%, remaining as Cu and inevitable impurity, and Ni and Si mass ratio be 4~
5；The composition of the RE is yttrium base ion type rareearth intermediate alloy, and wherein Y contents, which account for 50%, La contents and account for 30%, Ce contents, accounts for
20%；Alloy structure is characterized as that using α-Cu as matrix phase average crystal grain diameter is 40-60 μm, matrix Dispersed precipitate nanoscale δ-
Ni2Si precipitated phases, and equally distributed shear band transversely be present, matrix texture component meets：
0.6<V(A+G+B)/V(C+S)<1.0
Wherein V (A+G+B) is sheet alloy A：{012}<100>、G(Goss)：{011}<100>、B(Brass)：{011}<
211>Volume fraction sum shared by texture component, V (C+S) are sheet alloy C (Copper)：{112}<111>And S：{123}<
634>Volume fraction sum shared by texture component.
2. a kind of preparation technology of the high-strength Cu-Ni-Si alloy of less anisotropy index as claimed in claim 1, its feature
It is, comprises the following steps：
(1) hot rolling technology：Melting, horizontal casting are carried out according to designed each component chemical quality percentage, then casting is entered
Row hot rolling obtains hot rolled plate, and hot rolling start rolling temperature is 850~950 DEG C, and finishing temperature is 750~850 DEG C, is softened after hot rolling
Annealing；
(2) once cold rolling technique：Hot-roll annealing plate in step (1) is subjected to once cold rolling；
(3) process annealing：Carrying out process annealing in step (2) after cold rolling, the process annealing condition is annealing temperature 100~
300 DEG C, soaking time is 3~6 hours, and furnace cooling, the process annealing is carried out in the gas shield stove of nitrogen or argon gas；
(4) grade and stage is handled：Rapid classification solid solution is carried out to process annealing plate in step (3)；The solid solubility temperature design exists
850~900 DEG C, 60~80s of solution time, first quick and back slow, fast heating rate is 30~50 DEG C/s for solution heat system design,
Slow heat speed is 1~5 DEG C/s, between critical point temperature is 750 DEG C to 800 DEG C；
(5) secondary cold-rolling technique：Sheet material after being dissolved to step (4) carries out secondary cold-rolling；
(6) low temperature aging is handled：Ageing Treatment finally is carried out to secondary cold-rolling plate obtained by step (5), aging temp is designed 400
~500 DEG C, aging time is 4~6h.
3. a kind of preparation technology of high-strength Cu-Ni-Si alloy of less anisotropy index according to claim 2, it is special
Sign is that in the processing of step (6) low temperature aging, aging temp is designed as 430 DEG C~460 DEG C.
4. a kind of preparation technology of high-strength Cu-Ni-Si alloy of less anisotropy index according to claim 2, it is special
Sign is that the once cold rolling reduction ratio of hot-roll annealing plate is greater than 60% in step (2), applies secondary cold-rolling pressure in step (5)
Lower rate is between 25~35%, and total reduction is more than 85% twice.
5. a kind of preparation technology of high-strength Cu-Ni-Si alloy of less anisotropy index according to claim 4, it is special
Sign is that it is 30% to apply secondary cold-rolling reduction ratio in step (5).
6. a kind of preparation technology of high-strength Cu-Ni-Si alloy of less anisotropy index according to claim 2, it is special
Sign is that process annealing condition is that annealing temperature is 200 DEG C in step (3), and soaking time is 4 hours.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510944624.3A CN105525135B (en) | 2015-12-16 | 2015-12-16 | The Cu Ni Si system's alloys and its preparation technology of a kind of high-strength less anisotropy index |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510944624.3A CN105525135B (en) | 2015-12-16 | 2015-12-16 | The Cu Ni Si system's alloys and its preparation technology of a kind of high-strength less anisotropy index |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN105525135A CN105525135A (en) | 2016-04-27 |
| CN105525135B true CN105525135B (en) | 2018-01-19 |
Family
ID=55767655
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510944624.3A Active CN105525135B (en) | 2015-12-16 | 2015-12-16 | The Cu Ni Si system's alloys and its preparation technology of a kind of high-strength less anisotropy index |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN105525135B (en) |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6310538B1 (en) * | 2016-12-14 | 2018-04-11 | 古河電気工業株式会社 | Copper alloy wire rod and method for producing the same |
| JP7202121B2 (en) * | 2018-09-27 | 2023-01-11 | Ｄｏｗａメタルテック株式会社 | Cu-Ni-Al-based copper alloy plate material, manufacturing method thereof, and conductive spring member |
| CN112813368B (en) * | 2020-12-25 | 2022-05-13 | 大连交通大学 | High-performance Cu-Ni-Si alloy plate strip and production process thereof |
| CN114752810B (en) * | 2022-03-24 | 2023-04-11 | 江苏恒盈电子科技有限公司 | High-strength semiconductor lead frame for circuit board and preparation method thereof |
| CN115094258B (en) * | 2022-07-13 | 2023-02-17 | 浙江惟精新材料股份有限公司 | High-strength high-plasticity high-bending Cu-Ni-Si-Co alloy and preparation method and application thereof |
| CN117403096B (en) * | 2023-12-13 | 2024-03-12 | 宁波兴业盛泰集团有限公司 | High-strength high-conductivity high-temperature-resistant copper-zirconium alloy material and preparation method thereof |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4255330B2 (en) * | 2003-07-31 | 2009-04-15 | 日鉱金属株式会社 | Cu-Ni-Si alloy member with excellent fatigue characteristics |
| JP4615628B2 (en) * | 2008-10-22 | 2011-01-19 | 古河電気工業株式会社 | Copper alloy material, electrical and electronic component, and method for producing copper alloy material |
| CN102851536A (en) * | 2012-09-10 | 2013-01-02 | 任静儿 | Copper alloy used in conductor wire |
| JP5647703B2 (en) * | 2013-02-14 | 2015-01-07 | Ｄｏｗａメタルテック株式会社 | High-strength Cu-Ni-Co-Si-based copper alloy sheet, its manufacturing method, and current-carrying parts |
| JP6317967B2 (en) * | 2014-03-25 | 2018-04-25 | Ｄｏｗａメタルテック株式会社 | Cu-Ni-Co-Si-based copper alloy sheet, method for producing the same, and current-carrying component |
-
2015
- 2015-12-16 CN CN201510944624.3A patent/CN105525135B/en active Active
Also Published As
| Publication number | Publication date |
|---|---|
| CN105525135A (en) | 2016-04-27 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN105525135B (en) | The Cu Ni Si system's alloys and its preparation technology of a kind of high-strength less anisotropy index | |
| CN101265536A (en) | High-strength high-conductivity copper alloy and preparation method thereof | |
| JP6366298B2 (en) | High-strength copper alloy sheet material and manufacturing method thereof | |
| CN109609801A (en) | High property copper alloy and preparation method thereof | |
| WO2021077241A1 (en) | Copper alloy with excellent anti-bending performance, preparation method therefor and use thereof | |
| CN107406916B (en) | Heat dissipation element copper alloy plate and heat dissipation element | |
| CN103382535B (en) | A kind of high-strength, high connductivity, deep drawing quality copper alloy and preparation method thereof | |
| EP2915891B1 (en) | Cu-be alloy and method for producing same | |
| CN104011236B (en) | Mould wear resistance and the good Cu-Ni-Si series copper alloy plate of shearing and manufacture method thereof | |
| WO2021128969A1 (en) | Titanium bronze alloy strip material containing ce and b and method for preparation thereof | |
| JP5610643B2 (en) | Cu-Ni-Si-based copper alloy strip and method for producing the same | |
| CN105506416B (en) | The manufacture method of plate high-strength aluminum alloy band in a kind of support available for mobile phone | |
| CN108300879A (en) | Electric vehicle bus-bars conductor Al-Mg-Si alloy thin plate preparation process | |
| JP5632063B1 (en) | Copper alloy plate, high-current electronic component and heat dissipation electronic component including the same | |
| CN102912178A (en) | High-strength and high-conductivity rare-earth copper alloy and preparation method thereof | |
| CN104718302B (en) | Electric conductivity and the excellent copper alloy plate of stress relaxation properties | |
| CN106148785A (en) | A kind of room temperature high ductibility wrought magnesium alloy and preparation method thereof | |
| JP5467163B1 (en) | Copper alloy plate, heat dissipating electronic component comprising the same, and method for producing copper alloy plate | |
| CN109182795A (en) | A kind of preparation method of high-strength highly-conductive Cu-RE nisiloy evanohm | |
| CN106011523A (en) | Copper alloy sheet and press-molded product with same | |
| CN104451241B (en) | Copper alloy plate and possess its high current electronic unit and heat transmission electronic unit | |
| JP6718276B2 (en) | Method for manufacturing Al-Mg-Si alloy plate | |
| CN105838915B (en) | Copper alloy bar, the high current electronic component and heat transmission electronic component for possessing the copper alloy bar | |
| CN101838756B (en) | Rare-earth-containing titanium alloy | |
| CN105705666A (en) | Copper alloy plate, and electronic part for heat dissipation use which is equipped with same |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20220112 Address after: 341706 Fukang Industrial Park, Longnan economic and Technological Development Zone, Longnan City, Ganzhou City, Jiangxi Province Patentee after: LONGNAN LONGYI HEAVY RARE-EARTH TECHNOLOGY Co.,Ltd. Address before: 341000 No. 86 Hongqi Avenue, Jiangxi, Ganzhou Patentee before: Jiangxi University of Science and Technology |
|
| TR01 | Transfer of patent right |