JP5632063B1 - Copper alloy plate, high-current electronic component and heat dissipation electronic component including the same - Google Patents

Abstract

A copper alloy having high strength, high conductivity, and excellent workability, and a high-current electronic component and a heat dissipation electronic component including the copper alloy are provided. The copper alloy sheet of the present invention contains one or two of Zr and Ti in a total amount of 0.01 to 0.50% by mass, with the balance consisting of copper and inevitable impurities, and 70% IACS. It has the above conductivity, 0.2% proof stress of 350 MPa or more, and 0.2% proof stress σ (MPa) and elongation L (%) satisfy the relationship of σ / L≰150. . [Selection figure] None

Description

  The present invention relates to a copper alloy plate excellent in heat dissipation, electrical conductivity, bending workability, and drawing workability, and more specifically for use in electronic parts such as terminals, connectors, relays, switches, sockets, bus bars, lead frames, especially smartphones. The present invention relates to a copper alloy plate suitable for heat-dissipating parts used in personal computers and large current parts used in electric vehicles and hybrid vehicles.

For electrical and electronic devices such as smartphones, tablet PCs and personal computers, components for obtaining electrical connections such as terminals, connectors, switches, sockets, relays, bus bars, lead frames, and components for dissipating heat generated by the devices Is incorporated.
In recent years, with the miniaturization of smartphones, tablet PCs, and personal computers, heat storage tends to increase when power is supplied to liquid crystal components or IC chips in electric / electronic devices. When the heat storage is large, thermal damage to the IC chip and the substrate is large, and the heat dissipation of the heat dissipation component is a problem.

Conventionally, austenitic stainless steel (SUS304), pure aluminum, and the like have been mainly used for heat dissipation components in electric and electronic devices such as smartphones, tablet PCs, and personal computers. For example, the heat-dissipating parts (liquid crystal frame) attached to the liquid crystal of smartphones and tablet PCs are required to have not only high heat dissipation but also strength as a structure and bending workability or drawing workability necessary for fixing to the liquid crystal. Yes. Further, depending on the heat dissipating component used, only bending workability or drawing workability may be required.
Austenitic stainless steel (SUS304) has good bendability and drawability, but has low thermal conductivity, and an expensive thermal conductive sheet or the like is used in combination to compensate for it. Therefore, the unit price of the heat dissipating component is increased. On the other hand, pure aluminum and aluminum alloys have good bendability and drawability, but lack thermal conductivity and strength as a structure.

  Further, in current-carrying parts such as terminals and connectors, the cross-sectional area of the copper alloy in the current-carrying part tends to be small. When the cross-sectional area becomes small, heat generation from the copper alloy when energized increases. In particular, electronic components used in fast-growing electric vehicles and hybrid vehicles include components such as a battery connector that allow a very high current to flow, and heat generation of the copper alloy during energization is a problem. Therefore, the current-carrying material is required to have excellent conductivity so as to reduce the heat generation amount, and further, excellent bending workability and drawing workability are required so as to cope with downsizing and high functionality of parts.

  It is known that thermal conductivity and conductivity are in a proportional relationship, and as an alloy having relatively high conductivity and strength, a material in which Zr or Ti is added to Cu is known. Examples of materials having high electrical conductivity and relatively high strength include C15100 (0.1 mass% Zr-residual Cu), C15150 (0.02 mass% Zr-residual Cu), and C18140 (0.1 mass% Zr- 0.3 mass% Cr-0.02 mass% Si-residual Cu), C18145 (0.1 mass% Zr-0.2 mass% Cr-0.2 mass% Zn-residual Cu), C18070 (0.1 Mass% Ti-0.3 mass% Cr-0.02 mass% Si-residual Cu), C18080 (0.06 mass% Ti-0.5 mass% Cr-0.1 mass% Ag-0.08 mass%) An alloy such as Fe-0.06 mass% Si-residual Cu) is registered in CDA (Copper Development Association).

  However, a conventional copper alloy with Cu or Zr added to Cu (Cu-Zr-Ti alloy) has high strength and heat conduction characteristics, but the required bending workability or drawing workability, depending on circumstances. Both were not met.

  Therefore, it can be said that it is extremely significant industrially to improve the bending workability and the drawing workability while maintaining the required high strength and conductivity in the Cu—Zr—Ti alloy.

  Accordingly, an object of the present invention is to provide a copper alloy plate having high strength and conductivity as well as excellent bending workability and drawing workability, a high-current electronic component and a heat dissipation electronic component including the copper alloy plate, Specifically, it is an object to improve the drawability of a Cu—Zr—Ti alloy that is inexpensive and excellent in conductivity and strength.

The present inventor improves bending workability and drawing workability in a Cu-Zr-Ti alloy by adjusting the metal structure using elongation as an index and controlling the orientation of crystal grains oriented on the rolling surface. I found out. And the following invention was completed against the background of the above knowledge.
The copper alloy sheet of the present invention contains one or two of Zr and Ti in a total amount of 0.01 to 0.50% by mass, preferably 0.015 to 0.3% by mass, with the balance being copper and inevitable And having an electrical conductivity of 70% IACS or more and a 0.2% proof stress of 350 MPa or more, and 0.2% proof stress σ (MPa) and elongation L (%) are σ / L ≦ 150 relationships are satisfied.

In the copper alloy sheet of the present invention, the X-ray diffraction integrated intensity of the {220} plane obtained in the thickness direction on the rolled surface using the X-ray diffraction method is I {220}, and _the pure copper powder standard sample from the {220} plane is used. When the X-ray diffraction integrated intensity is I ⁰ {220}, it is preferable that I {220} / I ⁰ {220} ≧ 4.0.

In the copper alloy sheet of the present invention, the ratio of the minimum bending radius (MBR) in the rolling parallel direction (GW direction) and the rolling perpendicular direction (BW direction) to the sheet thickness (t) in the W bending test is MBR / t. Preferably it is given by ≦ 2.0.
Moreover, in the copper alloy plate of the present invention, it is preferable that the Erichsen value / plate thickness in the Erichsen test is given as 0.5 or more.

An electronic component for large current of the present invention comprises any one of the above copper alloy plates. Moreover, the electronic component for heat dissipation of this invention is provided with one of said copper alloy plates.

  ADVANTAGE OF THE INVENTION According to this invention, it is possible to provide the copper alloy plate which has high intensity | strength, high electroconductivity, the outstanding bending workability, and drawing workability. This copper alloy plate can be suitably used as a material for electronic parts such as terminals, connectors, switches, sockets, relays, bus bars, lead frames, heat sinks, etc. The present invention relates to a copper alloy plate suitable for use in high-current parts used in automobiles, hybrid automobiles, and the like.

  Hereinafter, embodiments of the present invention will be described in detail.

(Characteristic)
The copper alloy plate according to an embodiment of the present invention has a conductivity of 70% IACS or higher, a 0.2% proof stress of 350 MPa or higher, and a 0.2% proof stress / elongation (σ / L). 150 or less. A copper alloy plate having such characteristics is suitable for use as an electronic component for heat dissipation.

(Alloy component concentration)
The Cu—Zr—Ti alloy plate according to the embodiment of the present invention contains 0.01 to 0.50 mass% of one or two of Zr and Ti in total. The total content of is preferably 0.015 to 0.3% by mass, more preferably 0.02 to 0.20% by mass. When the total of one or two of Zr and Ti is less than 0.01% by mass, it becomes difficult to obtain a tensile strength of 350 MPa or more. If the total of one or two of Zr and Ti exceeds 0.5% by mass, it becomes difficult to produce an alloy due to hot rolling cracks or the like. When adding Zr, it is preferable to adjust the addition amount to 0.01 to 0.45 mass%, and when adding Ti, the addition amount is adjusted to 0.01 to 0.20 mass%. It is preferable. If the addition amount is less than the lower limit value, the 0.2% proof stress is less than 350 MPa, and if the addition amount exceeds the upper limit value, conductivity and manufacturability may be deteriorated.

In order to improve strength and heat resistance, the Cu—Zr—Ti alloy plate contains at least one of Ag, Co, Ni, Cr, Mn, Zn, Mg, Si, Sn, and B in total 2. It can be contained at 0% by mass or less. However, if the amount added is too large, the electrical conductivity may be reduced to be less than 70% IACS or the manufacturability of the alloy may be deteriorated, so the amount added should be 1.0% by mass or less in total. Is preferable, and more preferably 0.5% by mass or less. Moreover, in order to acquire the effect by addition, it is preferable to make addition amount 0.001 mass% or more in total amount.

(Thickness)
The thickness of the product, that is, the plate thickness (t) is preferably 0.05 to 2.0 mm. If the thickness is too small, sufficient heat dissipation cannot be obtained, which is unsuitable as a material for heat dissipation electronic components. On the other hand, if the thickness is too large, bending and drawing are difficult. From such a viewpoint, a more preferable thickness is 0.08 to 1.5 mm. When the thickness is in the above range, it is possible to improve bending workability and drawing workability while suppressing heat storage.

(conductivity)
In the present invention, the conductivity measured in accordance with JIS H0505 is 70% IACS or higher. If the electrical conductivity is 70% IACS or higher, the thermal conductivity is good and good heat dissipation can be ensured. More preferably, it is 75% IACS or more.

(0.2% yield strength)
In the present invention, the 0.2% proof stress of the copper alloy plate is set to 350 MPa or more. According to this, it can be said that the copper alloy plate has a strength necessary as a material for the structural material.

(Elongation)
More preferably, σ / L ≦ 150 so that the relationship of σ / L ≦ 150 is satisfied, where L (%) is the product elongation (El) and σ (MPa) is 0.2% proof stress (YS). By adjusting so as to satisfy the relationship of 100, drawing workability and bendability are improved. If the 0.2% proof stress / elongation is 150 or less, it can be said that the required drawability is obtained. When σ / L> 150, drawability and bendability deteriorate. On the other hand, the lower limit of σ / L is preferably 30. If σ / L is small, there is a concern that the 0.2% proof stress will not satisfy 350 MPa. The upper limit value of the elongation L is not particularly limited, but usually when the value exceeds 15%, the strength decreases, and in some cases, the 0.2% proof stress may be less than 350 MPa. Therefore, in a preferred embodiment, the elongation L is 15% or less.
“Elongation” here refers to “breaking elongation” as defined in JIS Z2241, and “elongation” and “0.2% proof stress” refer to the rolling direction of the test piece in accordance with JIS Z2241. It shall be measured by a tensile test parallel to the direction.

(Bending workability)
Evaluation of the bending workability of this invention is performed by the W bending test (JIS H3130) using the strip-shaped test piece of width 10mm x length 30mm. The specimen collection direction is a rolling parallel direction (GW) and a rolling perpendicular direction (BW), and evaluation is performed by a ratio MBR / t of a minimum bending radius MBR (Minimum Bend Radius) and a thickness t where no crack is generated. The ratio (MBR / t) of the minimum bending radius (MBR) is preferably 2.0 or less from the viewpoint of ensuring good bendability. A more preferable range of MBR / t is 1.8 or less.

(Drawing workability)
In the copper alloy plate of the present invention, the ratio of the Erichsen value measured by the Erichsen test based on JIS Z2247 to the plate thickness is preferably 0.5 or more. If the Erichsen value / thickness is 0.5 or more, there is no practical problem as drawing workability. On the other hand, the Erichsen value / plate thickness is preferably 1.5 or less. This is because if it exceeds 1.5, the 0.2% proof stress may be less than 350 MPa. More preferably, the Erichsen value / plate thickness is in the range of 0.5 to 1.2.

(Crystal orientation)
The X-ray diffraction integrated intensity of the {220} plane obtained in the thickness direction on the rolled surface using the X-ray diffraction method is I {220}, and the X-ray diffraction integrated intensity from the {220} plane of _the pure copper powder standard sample is I ^0. When {220} is set and I {220} / I ⁰ {220} is 4.0 or more, drawing workability is improved. When I {220} / I ⁰ {220} is less than 4.0, since the texture development is small, the drawability is inferior. Although there is no particular upper limit, I {220} / I ⁰ {220} is more preferably 4.0 to 7.0. The pure copper powder standard sample is defined as a copper powder of 99.5% purity of 325 mesh (JIS Z8801).

  Hereinafter, an example of the suitable manufacturing method of the copper alloy plate which concerns on this invention is demonstrated.

  As a pure copper raw material, electrolytic copper or the like is melted, Zr, Ti and other alloy elements are added as necessary, and cast into an ingot having a thickness of about 30 to 300 mm. After this ingot is made into a plate having a thickness of about 3 to 30 mm by hot rolling at 800 to 1000 ° C., for example, cold rolling and recrystallization annealing are repeated, and finally finished to a predetermined product thickness by cold rolling. Apply strain relief annealing. The elongation after the final cold rolling is so low that it is less than 2%, but increases by subsequent strain relief annealing.

  In recrystallization annealing, part or all of the rolling structure is recrystallized. Further, by annealing under appropriate conditions, Zr, Ti, etc. are precipitated, and the conductivity of the alloy is increased. In the recrystallization annealing before the final cold rolling, the average crystal grain size of the copper alloy sheet is adjusted to 50 μm or less. If the average crystal grain size is too large, it is difficult to adjust the 0.2% proof stress to 350 MPa or more.

  The conditions for recrystallization annealing before the final cold rolling are determined based on the target crystal grain size after annealing and the target product conductivity. Specifically, annealing may be performed by using a batch furnace or a continuous annealing furnace and setting the furnace temperature to 350 to 800 ° C. In a batch furnace, the heating time may be appropriately adjusted at a temperature in the furnace of 350 to 600 ° C. in the range of 30 minutes to 30 hours. In a continuous annealing furnace, the heating time may be appropriately adjusted within a range of 5 seconds to 10 minutes at a furnace temperature of 450 to 800 ° C. Generally, when annealing is performed at a lower temperature for a longer time, higher conductivity can be obtained with the same crystal grain size.

In the final cold rolling, the material is repeatedly passed between a pair of rolling rolls to finish the target plate thickness. Here, the total workability of final cold rolling and the workability per pass are controlled.
The total workability R (%) is given by R = (t ₀ −t) / t ₀ × 100 (t ₀ : plate thickness before final cold rolling, t: plate thickness after final cold rolling). Further, the processing degree r (%) per pass is a sheet thickness reduction rate when the rolling roll passes once, and r = (T ₀ −T) / T ₀ × 100 (T ₀ : rolling roll) Thickness before passing, T: Thickness after passing the rolling roll).

The total processing degree R is 40 to 99%, preferably 45 to 98.5%, more preferably 50 to 98%. If the total workability R is too small, it is difficult to adjust the 0.2% proof stress to 350 MPa or more, and it is difficult to adjust I {220} / I ⁰ {220} to 4.0 or more. If the total workability R is too large, the edge of the rolled material may be broken.
The degree of processing r per pass is 15% or more. If the degree of processing r is too small, I {220} / I ⁰ {220} decreases, and if any path with a degree of processing r of less than 15% is included in all the paths, I {220} / I ⁰ { 220} becomes difficult to adjust to 4.0 or more. There is no particular upper limit on the working degree r, but it is preferably less than 40% in consideration of control of sheet thickness accuracy by rolling.

  The strain relief annealing of the present invention is performed using a continuous annealing furnace capable of holding a copper alloy plate in a flat plate shape in the furnace. In the case of a batch furnace, the material is heated in a coiled state, so that the material undergoes plastic deformation during the heating, and the material is warped. Therefore, the batch furnace is not suitable for the strain relief annealing of the present invention.

In a continuous annealing furnace, the furnace temperature is set to 300 to 700 ° C., preferably 350 to 650 ° C., the heating time is appropriately adjusted in the range of 5 seconds to 10 minutes, and 0.2% yield strength (σ) after strain relief annealing. Is adjusted to a value 10 to 50 MPa lower, preferably 15 to 45 MPa lower than the 0.2% proof stress (σ ₀ ) before strain relief annealing. As a result, the elongation which was low after the final cold rolling is increased, and the bending workability is improved.

  Further, in the continuous annealing furnace, tension is applied to the material, for example, in a direction parallel to the rolling direction, and the tension applied here is adjusted to 5 MPa or less, preferably 1 to 5 MPa, more preferably 2 to 4 MPa. If the tension is too large, it is difficult to adjust σ / L to 150 or less. Further, the increase in elongation tends to be insufficient. On the other hand, if the tension is too small, the material in the passing plate of the annealing furnace may come into contact with the furnace wall, and the surface or edge of the material may be damaged.

One embodiment of the present invention provides a drawability by imparting a feature of σ / L ≦ 150 and a feature of I {220} / I ⁰ {220} ≧ 4.0 to a Cu—Zr—Ti alloy. One of the features is to improve the bending workability.
(1) For σ / L ≦ 150,
a. In the strain relief annealing, (σ ₀ −σ) = 10 to 50 MPa is adjusted.
b. The furnace tension in the strain relief annealing is adjusted to 5 MPa or less.
(2) For I {220} / I ⁰ {220} ≧ 4.0,
a. In the final cold rolling, the processing degree per pass is adjusted to 15% or more.
b. The total working degree of the final cold rolling is set to 40 to 99%.

  The copper alloy plate manufactured as described above is processed into a copper product having various plate thicknesses, and is used as, for example, an electronic component for heat dissipation in an electric / electronic device such as a smartphone, a tablet PC, and a personal computer. Can do.

Examples of the present invention are shown below, but these examples are provided for better understanding of the present invention and its advantages, and are not intended to limit the invention.
After adding the alloy element to the molten copper, it was cast into an ingot having a thickness of 200 mm. The ingot was heated at 950 ° C. for 3 hours and hot-rolled at 950 ° C. to obtain a plate having a thickness of 15 mm. After grinding and removing the oxide scale on the surface of the hot rolled plate with a grinder, annealing and cold rolling were repeated, and the product was finished to a predetermined product thickness by final cold rolling. Finally, strain relief annealing was performed using a continuous annealing furnace.

  Annealing before final cold rolling (final recrystallization annealing) uses a batch furnace, adjusts the furnace temperature in the range of 300 to 700 ° C. with a heating time of 5 hours, and sets the crystal grain size and conductivity after annealing. Changed. In the measurement of the crystal grain size after annealing, a cross section perpendicular to the rolling direction was subjected to chemical corrosion after mirror polishing, and the average crystal grain size was determined by a cutting method (JIS H0501 (1999)).

In the final cold rolling, the total workability and the workability per pass were controlled. Moreover, the 0.2% yield strength of the material after final cold rolling was calculated | required.
In strain relief annealing using a continuous annealing furnace, the furnace temperature was 500 ° C., the heating time was adjusted between 1 second and 15 minutes, and the 0.2% proof stress after annealing was variously changed. In addition, various tensions were added to the material in the furnace. For some materials, strain relief annealing was omitted.

The production conditions of the examples are shown in Tables 1 and 2 for each invention example and comparative example. Here, a plurality of passes were carried out in the final cold rolling, but the minimum value in the degree of processing of each of these passes is shown. In Table 1, the notation “<5 μm” in the crystal grain size after the final recrystallization annealing indicates a case where only a part of the rolled structure is recrystallized.
The following measurement was performed on the material in the process of manufacturing and the material after strain relief annealing.

(component)
The alloy element concentration of the material after strain relief annealing was analyzed by ICP-mass spectrometry.

(0.2% yield strength)
For the material after the final cold rolling and strain relief annealing, sample No. 13B specified in JIS Z2241 was taken so that the tensile direction was parallel to the rolling direction, and pulled in parallel with the rolling direction in accordance with JIS Z2241. Tests were performed to determine 0.2% yield strength.

(Elongation)
From the material after strain relief annealing, No. 13B test piece defined in JIS Z2241 was sampled so that the tensile direction was parallel to the rolling direction, and the elongation was measured at a distance between gauge points of 50 mm.

(conductivity)
A test piece was taken from the material after strain relief annealing so that the longitudinal direction of the test piece was parallel to the rolling direction, and the conductivity at 20 ° C. was measured by a four-terminal method in accordance with JIS H0505.

(Crystal orientation)
The X-ray diffraction integrated intensity of the {220} plane was measured in the thickness direction with respect to the surface of the material after strain relief annealing. Similarly, the X-ray diffraction integrated intensity of the {220} plane was measured for a pure copper powder standard sample. RINT 2500 manufactured by Rigaku Corporation was used as the X-ray diffractometer, and measurement was performed with a Cu tube bulb at a tube voltage of 25 kV and a tube current of 20 mA.

(Erichsen value)
The material after strain relief annealing was tested using an Erichsen testing machine under the conditions of sample shape Φ90 mm, lubricant: grease, punch pushing speed 5 mm / min, and the Erichsen value was determined. Table 2 shows the evaluation results.

(MBR / t)
In accordance with JIS H3130, a W-shaped test is performed in each of the GW (Goodway) direction in which the bending axis is perpendicular to the rolling direction and the BW (Badway) direction in which the bending axis is the same as the rolling direction. The bending radius was changed using the mold of the mold, and the ratio (MBR / t) of the minimum bending radius (MBR) and thickness (t) at which no crack occurred was obtained.

As can be seen from Tables 1 and 2, in Invention Examples 1 to 5 , 8, 9 , 12, 15 , 16 , and 21 , a total of one or two of Zr and Ti is 0.01 to 0. In the recrystallization annealing prior to the final cold rolling, the crystal grain size is adjusted to 50 μm or less, and in the final cold rolling, the total workability is adjusted to 40 to 99%. The material was passed through a continuous annealing furnace with a tension of 1 to 5 MPa to reduce the 0.2% proof stress by 10 to 50 MPa. As a result, the copper alloy sheets of Invention Examples 1 to 5, 8 , 9 , 12 , 15 , 16 , and 21 have a relationship of σ / L ≦ 150, a conductivity of 70% IACS or more, a value of 0.7 MPa of 350 MPa or more. 2% proof stress and MB bendability of MBR / t ≦ 2.0 could be achieved. In Invention Examples 5 and 9, since the degree of processing per pass in the final cold rolling was less than 15%, I {220} / I ⁰ {220} was less than 4.0, and the Erichsen value Although the sheet thickness was less than 0.5, Invention Examples 1-4 , 8 , 12 , 15, 16, and 21 in which the degree of processing per pass was 15% or more were I {220} / I ⁰ The relationship of {220} ≧ 4.0 and the relationship of Erichsen value / plate thickness ≧ 0.5 were satisfied.

On the other hand, Comparative Examples 1 and 2 were not subjected to strain relief annealing, σ / L exceeded 200, and the bendability and drawability were poor.
In Comparative Examples 3 to 6, although strain relief annealing was performed, the material tension in the furnace exceeded 5 MPa, so σ / L was 150 or more. In Comparative Example 5 in which the tension was particularly high, σ / L was 200 It became larger and the bendability and drawing workability of Comparative Examples 3 to 6 were poor.
In Comparative Examples 7 and 8, the amount of decrease in 0.2% proof stress during strain relief annealing was excessive, and (σ ₀ −σ) was out of the range of 10 to 50 MPa. For this reason, σ / L exceeded 150, and drawability and bendability were poor.
In Comparative Example 9, since the strength decrease during strain relief annealing was large, the 0.2% proof stress after strain relief annealing was less than 350 MPa.

In Comparative Example 10, since the total of one or two of Zr and Ti was less than 0.01% by mass, the 0.2% proof stress after strain relief annealing was less than 350 MPa.
In Comparative Example 11, the total of one or two of Zr and Ti exceeded 0.5% by mass, so the conductivity was less than 70% IACS.

  In Comparative Example 12, the crystal grain size after recrystallization annealing before the final cold rolling exceeded 50 μm, and in Comparative Example 13, the total workability in the final cold rolling was less than 40%. The 2% proof stress was less than 350 MPa.

  From the above results, according to the present invention, a copper alloy plate having high strength and conductivity, and excellent drawing workability and bending workability, and a high-current electronic component and a heat dissipation electronic component provided with the copper alloy plate are provided. It is clear that it can be provided.

Claims (7)

  One or two of Zr and Ti are contained in a total of 0.01 to 0.50 mass%, the balance is made of copper and inevitable impurities, the conductivity is 70% IACS or more, and 0.2 or more is 350 MPa or more. A copper alloy sheet having% proof stress and 0.2% proof stress σ (MPa) and elongation L (%) satisfy the relationship σ / L ≦ 150.   The copper alloy plate according to claim 1, comprising 0.015 to 0.3 mass% in total of one or two of Zr and Ti. The X-ray diffraction integrated intensity of the {220} plane obtained in the thickness direction on the rolled surface using the X-ray diffraction method is I {220}, and the X-ray diffraction integrated intensity from the {220} plane of _the pure copper powder standard sample is I ^0. The copper alloy sheet according to claim 1 or 2, wherein {220} is I {220} / I ⁰ {220} ≥4.0.   The minimum bending radius / sheet thickness (MBR / t) in the rolling parallel direction (GW direction) and the rolling perpendicular direction (BW direction) in the W bending test is given by MBR / t ≦ 2.0. The copper alloy plate according to claim 1.   The copper alloy sheet according to any one of claims 1 to 4, wherein an Erichsen value / plate thickness in the Eriksen test is 0.5 or more. A high-current electronic component comprising the copper alloy plate according to any one of claims 1 to 5 . A heat dissipating electronic component comprising the copper alloy plate according to any one of claims 1 to 5 .