JP2005350696A - Method for manufacturing copper alloy for terminal and connector - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a method for manufacturing a copper alloy which has high strength, high yield strength and a high springing property together with satisfactory bending formability, has a crystal structure with little anisotropy, and has high strength and high conductivity so as to be most amenable to a material for a terminal and a connector. <P>SOLUTION: The method for manufacturing the copper alloy for the terminal and the connector comprises the steps of: preparing an alloy material comprising 1.0-5.0 mass% Ni, 0.2-1.0 mass% Si, 1.0-5.0 mass% Zn, 0.003-0.3 mass% P, 0.05-1.0 mass% Sn and the balance Cu, so that the mass ratio of Ni to Si can satisfy Ni/Si=4.5 to 5.5; subjecting it to a first cold rolling of cold-rolling the alloy material into a thickness of 1.1 to 1.2 times thicker than the objective final sheet thickness; subsequently subjecting it to the first heat treatment of heating the cold-rolled alloy material to 700 to 850°C and cooling it to 300°C or lower at a rate of 25°C/minute; subsequently subjecting it to a second cold rolling of cold-rolling it into the objective final sheet thickness; and then subjecting it to the second heat treatment of heating it to 400 to 500°C and holding it at the temperature for 30 minutes to 3 hours. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

  The present invention provides a method for producing a copper alloy for terminals / connectors excellent in strength, proof stress, spring property, and electrical conductivity, in particular, achieving both excellent strength, proof stress, spring property and good bending workability, and The present invention relates to a method for producing a copper alloy for terminals and connectors that reduces the anisotropy of the crystal structure.

  In recent years, electronic devices such as mobile phones and notebook PCs have become smaller, thinner, and lighter, and the terminal / connector parts used are also smaller and have a narrow pitch between electrodes. Due to such miniaturization, the material used has become thinner, but a material having higher strength and higher springiness is required because of the need to maintain the connection reliability even with the thin wall. At the same time, since the connector part is subjected to complicated bending, it is also required to exhibit good workability with high elongation in order to prevent cracking during bending. Further, it is not preferable that there is a difference in characteristics between the rolling direction and the orthogonal direction of rolling in such spring property and bending workability, and it is important to show good properties in any direction.

  On the other hand, due to the increase in the number of electrodes and the increase in energization current due to the higher functionality of equipment, the generated Joule heat is becoming enormous, and there is an increasing demand for materials having higher conductivity than before. Such a high conductivity material is strongly demanded for a terminal / connector material for automobiles in which an increase in energization current is rapidly progressing.

  Conventionally, brass and phosphor bronze are generally used as materials for such terminals and connectors.

  However, brass and phosphor bronze that have been widely used conventionally have a problem in that they cannot sufficiently meet the requirements for the connector material described above. That is, brass lacks strength, springiness, and conductivity, and therefore cannot cope with downsizing of the connector and increase in energization current. Phosphor bronze has higher strength and higher springiness, but cannot handle the increase in energization current because the conductivity is as low as about 20% IACS. Furthermore, phosphor bronze has a drawback that it is inferior in migration resistance. Migration is a phenomenon in which Cu on the anode side ionizes and deposits on the cathode side when condensation occurs between the electrodes, eventually leading to a short circuit between the electrodes. This is a problem with a connector that requires attention, and even with a connector whose pitch between electrodes has become narrow due to miniaturization.

As a material for improving such problems of brass and phosphor bronze, for example, a copper alloy mainly composed of Cu—Ni—Si as shown in Patent Document 1 and Patent Document 2 has been proposed.
Japanese Patent No. 2572042 Japanese Patent No. 2977745

  However, according to the conventional method for producing a copper alloy containing Cu-Ni-Si as a main component, if an attempt is made to achieve good strength and springiness, the bending workability deteriorates and the crystal structure anisotropy increases. There is a problem.

  Therefore, the object of the present invention is to achieve both high strength, proof stress and spring property and good bending workability, and also has a small crystal structure anisotropy, which is optimal for materials for terminals and connectors. It is providing the manufacturing method of an electroconductive copper alloy.

According to the present invention, 1.0-5.0 mass% Ni, 0.2-1.0 mass% Si, 1.0-5.0 mass% Zn, 0.003-0.3 mass% A step of preparing an alloy material composed of P, 0.05 to 1.0 mass% of Sn, and the balance of Cu, and the mass ratio of Ni and Si being Ni / Si = 4.5 to 5.5,
A step of subjecting the alloy material to a first cold rolling to a thickness of 1.1 to 1.2 times the final final plate thickness;
Performing a first heat treatment for cooling the alloy material after the first cold rolling to 700 to 850 ° C. and then cooling it to 300 ° C. or less at a temperature lowering rate of 25 ° C. or more per minute; Including a step of subjecting the alloy material after the heat treatment to a second cold heat treatment to a final final plate thickness and then performing a second heat treatment of heating to 400 to 500 ° C. and holding for 30 minutes to 3 hours. The manufacturing method of the copper alloy for terminals and connectors characterized by these.

Further, according to the present invention, 1.0 to 5.0 mass% Ni, 0.2 to 1.0 mass% Si, 1.0 to 5.0 mass% Zn, 0.003 to 0.3 mass The process of preparing the alloy raw material which consists of mass% P, 0.05-1.0 mass% Sn, and the remainder Cu, and the mass ratio of Ni and Si is Ni / Si = 4.5-5.5. ,
A step of subjecting the alloy material to a first cold rolling to a thickness of 1.1 to 1.2 times the final final plate thickness;
The alloy material after the first cold rolling is heated to 700 to 850 ° C., then subjected to a first heat treatment for cooling to 300 ° C. or less at a temperature lowering rate of 25 ° C. or more per minute, and then continuously 400 to 500 A step of performing a second heat treatment that is heated to ℃ and held for 30 minutes to 3 hours, and after subjecting the alloy material after the second heat treatment to a second cold rolling to a desired final thickness, The manufacturing method of the copper alloy for terminals and connectors characterized by including the process of performing the 3rd heat processing heated to 300-500 degreeC is provided.

Furthermore, according to the present invention, 1.0-5.0 mass% Ni, 0.2-1.0 mass% Si, 1.0-5.0 mass% Zn, 0.003-0. Mg, Ti, 3% by mass of P, 0.05 to 1.0% by mass of Sn, 0.01 to 1.0% by mass per type, and a total amount of 0.01 to 4.0% by mass, A step of preparing an alloy material consisting of at least one additive component selected from Cr and Zr, and the balance Cu, wherein the mass ratio of Ni and Si is Ni / Si = 4.5 to 5.5;
A step of subjecting the alloy material to a first cold rolling to a thickness of 1.1 to 1.2 times the final final plate thickness;
Performing a first heat treatment for cooling the alloy material after the first cold rolling to 700 to 850 ° C. and then cooling it to 300 ° C. or less at a temperature lowering rate of 25 ° C. or more per minute; Including a step of subjecting the alloy material after the heat treatment to a second cold heat treatment to a final final plate thickness, followed by a second heat treatment that is heated to 400 to 500 ° C. and held for 30 minutes to 3 hours. The manufacturing method of the copper alloy for terminals and connectors characterized by these.

Furthermore, according to the present invention, 1.0-5.0 mass% Ni, 0.2-1.0 mass% Si, 1.0-5.0 mass% Zn, 0.003-0. Mg, Ti, 3% by mass of P, 0.05 to 1.0% by mass of Sn, 0.01 to 1.0% by mass per type, and a total amount of 0.01 to 4.0% by mass, A step of preparing an alloy material consisting of at least one additive component selected from Cr and Zr, and the balance Cu, wherein the mass ratio of Ni and Si is Ni / Si = 4.5 to 5.5;
A step of subjecting the alloy material to a first cold rolling to a thickness of 1.1 to 1.2 times the final final plate thickness;
The alloy material after the first cold rolling is heated to 700 to 850 ° C., then subjected to a first heat treatment for cooling to 300 ° C. or less at a temperature lowering rate of 25 ° C. or more per minute, and then continuously 400 to 500 A step of performing a second heat treatment that is heated to ℃ and held for 30 minutes to 3 hours, and after subjecting the alloy material after the second heat treatment to a second cold rolling to a desired final thickness, The manufacturing method of the copper alloy for terminals and connectors characterized by including the process of performing the 3rd heat processing heated to 300-500 degreeC is provided.

The first heat treatment sufficiently dissolves the alloy material in copper to prevent coarse precipitates from being re-formed during cooling,
The second heat treatment preferably includes generating a Ni and Si compound and precipitating it in copper in a fine shape.

  Since the copper alloy material according to the manufacturing method of the present invention has both high conductivity, high strength, proof stress, spring property, and excellent bending workability, and also has a feature of low crystal structure anisotropy, the present invention is a terminal. -Supporting the improvement of manufacturing technology for connector parts from the aspect of supplying low-cost and high-performance materials, can greatly contribute to the development.

FIG. 1 is a flowchart showing an example of a manufacturing process of a copper alloy for terminals and connectors according to the present invention.
(Step 1)

  The manufacturing method of the copper alloy for terminals and connectors according to the present invention is 1.0 to 5.0 mass% Ni, 0.2 to 1.0 mass% Si, 1.0 to 5.0 mass% Zn, It consists of 0.003-0.3 mass% P, 0.05-1.0 mass% Sn, and the balance Cu, and the mass ratio of Ni and Si is Ni / Si = 4.5-5.5. A copper alloy is used as a material. Furthermore, when one or more kinds of components selected from Mg, Ti, Cr, and Zr, which are set to 0.01 to 4.0% by mass and 0.01 to 4.0% by mass per type, are included. Better properties can be expected.

  Here, Ni is added together with Si to form a Si compound and is dispersed and precipitated in the material. By regulating the composition ratio of Ni and Si to a specific range Ni / Si = 4.5 to 5.5, the effect of strengthening the dispersion of precipitates while suppressing the amount of solid solution elements in copper that lowers the conductivity The strength and springiness can be improved. Furthermore, if the addition amount of Si is less than 0.2% by mass, an effective Si compound is not formed. If the addition amount exceeds 1.0% by mass, the adverse effect on conductivity increases. Therefore, the composition range of Si is defined as 0.2 to 1.0 mass%. In order to effectively form a compound with respect to the composition range of Si and to achieve both high strength and high conductivity, the composition range of Ni is set to 1.0 to 5.0% by mass, and the Ni and Si It is necessary to define the mass ratio of Ni / Si = 4.5 to 5.5. When the Ni content is below the lower limit of the composition range, the amount of compound formation becomes insufficient, and the strength and springiness are insufficient. Moreover, when content of Ni exceeds the upper limit of a composition range, excess Ni will dissolve in copper and will reduce electrical conductivity. Furthermore, when the Ni amount is less than 4.5 times the Si amount, Si becomes excessive during compound formation, and when it exceeds 5.5 times, Ni becomes excessive. Such an excess component is present in a solid solution state in copper, resulting in an adverse effect on conductivity.

  On the other hand, if the amount of P added is less than 0.003% by mass, a sufficient amount of P compound cannot be formed, and satisfactory strength cannot be obtained. If added in excess of 0.3% by mass, ingot cracking due to segregation of the P compound tends to occur during casting. Therefore, the composition range of P is specified to be 0.003 to 0.3 mass%.

Further, Sn has a great effect on improving strength and springiness, and also has a function of improving heat resistance and improving stress relaxation resistance at high temperatures. Further, Zn has an effect of improving strength and springiness and has a function of greatly improving migration resistance. Furthermore, Zn has a great effect in improving the solder wettability and Sn plating adhesion required as an electronic component material. Mg, Ti, Cr, and Zr are effective as additive components that further improve each of strength, springiness, migration resistance, and heat resistance and that have little adverse effect on conductivity. However, Sn, Zn, and Mg, Ti, Cr, and Zr have a small effect of addition if the content is less than the specified range, and if the content exceeds the specified range, adverse effects such as a decrease in conductivity and a decrease in castability occur.
(Step 2)

Next, in the step of processing the copper alloy material, first cold rolling is first performed to a thickness of 1.1 to 1.2 times the final final plate thickness prior to the heat treatment. This facilitates recrystallization in the next first heat treatment, and a crystal grain structure having a uniform size after recrystallization can be obtained. Here, the plate thickness after rolling is regulated to 1.1 to 1.2 times the final plate thickness in order to introduce an appropriate amount of lattice defects in the cold rolling after the subsequent heat treatment. When the plate thickness is thicker than the specified range, the reduction in elongation becomes large by cold rolling after heat treatment, and good bending workability cannot be ensured. Further, when the plate thickness is thinner than the specified range, lattice defects introduced by cold rolling after heat treatment are reduced, so that only low proof stress can be obtained.
(Step 3)

Next, following the first cold rolling step, a first heat treatment is performed in which the temperature is raised to 700 to 850 ° C. and then cooled to 300 ° C. or less at a rate of 25 ° C./min or more. This first heat treatment is intended to re-dissolve the non-uniform precipitate once in the copper matrix phase in order to disperse and precipitate the alloy components uniformly and finely. Another important objective is to recrystallize the crystal structure that has been distorted by strong cold rolling into a crystal structure with low anisotropy and to achieve good bending workability by improving elongation. is there. In the first heat treatment for the purpose of solution treatment, it is necessary to first sufficiently dissolve the alloy element in copper. Therefore, in the present invention, by setting the heating temperature to 700 ° C. or higher, solid solution is sufficiently advanced, and by setting the cooling rate to 25 ° C./min or more, coarse precipitates are re-formed during cooling. prevent. In the first heat treatment, it is also necessary to secure good bending workability by changing the crystal structure to a crystal structure with small anisotropy by recrystallization and simultaneously improving the elongation. Here, when the heating temperature exceeds 850 ° C., there is a risk that the crystal grains become coarse and bending workability is lowered, so the upper limit of the heating temperature is defined as 850 ° C.
(Step 4)

Next, following the first heat treatment (solution treatment) step, second cold rolling is performed to the final final thickness. As a result, lattice defects are appropriately introduced into the material, and good proof stress can be secured, and the effect of promoting the formation of fine precipitates in the next second heat treatment can be obtained.
(Step 5)

  Next, following the second cold rolling step, a second heat treatment is performed for the purpose of aging by heating to 400 to 500 ° C. and holding for 30 minutes to 3 hours. As a result, Ni and Si form a compound and precipitate in a fine shape in the copper, so that both high strength and excellent electrical conductivity can be achieved. When the second heat treatment condition is maintained at a temperature higher than the specified range of 400 to 500 ° C. and 30 minutes to 3 hours for a long time, the precipitate becomes coarse and sufficient strength cannot be obtained. When held for a short time, precipitation does not proceed sufficiently, and sufficient values of conductivity and strength cannot be obtained.

  As shown in FIG. 2, good characteristics can be obtained even if the second cold rolling step and the second heat treatment step are performed in the reverse order. That is, after the first heat treatment (step 3), the second heat treatment (step 4) is performed, and then the second cold rolling (step 5) up to the final plate thickness is performed. In this case, since cold rolling is accompanied by a decrease in elongation, it is necessary to perform a third heat treatment (step 6) for heating to 300 to 500 ° C. for the purpose of recovering the elongation after rolling. Here, if the heating temperature is too low, the elongation is not recovered, and if it is too high, the strength and the yield strength are lowered.

  Examples of the present invention will be described below.

  A copper alloy having a composition of Ni: 2.5 wt%, Si: 0.5 wt%, Zn: 1.7 wt%, P: 0.15 wt%, Sn: 0.1 wt% is used as a base material with oxygen-free high frequency. It was melted in a melting furnace and cast into an ingot having a diameter of 30 mm and a length of 250 mm. This was heated to 850 ° C. and extruded to form a plate having a width of 20 mm and a thickness of 8 mm, and then cold-rolled to a thickness of 0.35 mm. After holding this at 770 ° C. for 10 minutes, a first heat treatment was performed in which it was poured into water and cooled to room temperature (about 20 ° C.) at a rate of about 300 ° C./min. The cooled material was cold-rolled to a thickness of 0.3 mm, and then a second heat treatment was performed at 450 ° C. for 2 hours. In this way, the material (A) was produced.

  Next, a copper alloy having the same composition as in Example 1 was cast and extruded in the same manner as in Example 1, and then cold-rolled to a thickness of 0.35 mm. After this is held at 770 ° C. for 10 minutes, a first heat treatment is performed in which it is poured into water and cooled to room temperature (about 20 ° C.) at a rate of about 300 ° C./min, followed by holding at 450 ° C. for 2 hours. No. 2 heat treatment was performed. This was cold-rolled to a thickness of 0.3 mm and subjected to a third heat treatment that was held at 400 ° C. for 5 minutes. In this way, the material (B) was produced.

With respect to the material (A) and the material (B) produced in Example 1 and Example 2, each characteristic value of tensile strength, 0.2% proof stress, elongation, and conductivity was measured. As a result, the material (A) has a tensile strength of 688 N / mm ² , a 0.2% yield strength of 614 N / mm ² , an elongation of 15%, a conductivity of 42% IACS, and the material (B) has a tensile strength of 684 N / mm ^2. A material having good characteristics of 0.2% proof stress 620 N / mm ² , elongation 13%, conductivity 42% IACS was obtained.

  An oxygen-free copper alloy having a composition of Ni: 2.5 wt%, Si: 0.5 wt%, Zn: 1.7 wt%, P: 0.15 wt%, Sn: 0.1 wt%, Mg: 0.1 wt% Copper was used as a base material and melted in a high-frequency melting furnace, and cast into an ingot having a diameter of 30 mm and a length of 250 mm. This was heated to 850 ° C. and extruded to form a plate having a width of 20 mm and a thickness of 8 mm, and then cold-rolled to a thickness of 0.35 mm. After holding this at 770 ° C. for 10 minutes, a first heat treatment was performed in which it was poured into water and cooled to room temperature (about 20 ° C.) at a rate of about 300 ° C./min. The cooled material was cold-rolled to a thickness of 0.3 mm, and then a second heat treatment was performed at 450 ° C. for 2 hours. In this way, the material (C) was produced.

  Next, a copper alloy having the same composition as in Example 3 was cast and extruded in the same manner as in Example 3, and then cold-rolled to a thickness of 0.35 mm. After this is held at 770 ° C. for 10 minutes, a first heat treatment is performed in which it is poured into water and cooled to room temperature (about 20 ° C.) at a rate of about 300 ° C./min, followed by holding at 450 ° C. for 2 hours. No. 2 heat treatment was performed. This was cold-rolled to a thickness of 0.3 mm and subjected to a third heat treatment that was held at 400 ° C. for 5 minutes. In this way, the material (D) was produced.

The material (C) and the material (D) manufactured in Example 3 and Example 4 were measured for characteristic values of tensile strength, 0.2% proof stress, elongation, and conductivity. As a result, the material (C) has a tensile strength of 696 N / mm ² , a 0.2% yield strength of 638 N / mm ² , an elongation of 15%, a conductivity of 42% IACS, and the material (D) has a tensile strength of 690 N / mm ^2. A material having good characteristics of 0.2% proof stress 642 N / mm ² , elongation 13%, conductivity 42% IACS was obtained.

  Next, the reasons for limiting the production conditions of the material of the present invention will be described with reference to comparative examples. Table 1 shows the production conditions of Examples 1 and 2 and Comparative Examples 1 to 6 of the present invention.

  When a copper alloy having the same composition as Example 1 and Example 2 of the present invention is processed in the same process as the material (A) of Example 1, the plate thickness before the first heat treatment, the first and second The heating conditions of the heat treatment were carried out under the conditions shown in Table 1 to produce materials (E) to (J). Each characteristic value of tensile strength, 0.2% yield strength, elongation, and conductivity was measured for each of the obtained materials. Table 2 shows the measurement results.

From Table 2, according to Example 1 and Example 2 of the present inventive material (A) and material (B) 0.2% yield strength and 13% or more greater than the tensile strength and 600N / mm ² greater than 680N / mm ² The materials (E) to (J) of Comparative Examples 1 to 6 are inferior in properties while having good elongation and also achieving good conductivity reaching 42% IACS. I understand that. The materials (E) and (F) are examples in which the plate thickness before the first heat treatment is out of the specified range. When the plate thickness before heat treatment is too thin like the material (E), the proof stress is particularly low and the tensile strength is also low. If the plate thickness before the heat treatment is too thick as in the material (F), the elongation is greatly reduced by cold rolling after the heat treatment, and the bending workability is deteriorated. Further, the material (G) and the material (H) are examples in which the heating temperature of the first heat treatment is out of the specified range, and in this case, the tensile strength and the proof stress are lowered. In addition, the materials (I) and (J) are examples in which the heating temperature of the second heat treatment is out of the specified range. When the heating temperature is too low as in the material (I), the electrical conductivity is low, and the tensile strength and proof stress are insufficient. When the heating temperature is too high as in the material (J), the electrical conductivity is high, but the tensile strength and proof stress are insufficient values.

  Next, Table 3 shows manufacturing conditions of Examples 3 and 4 and Comparative Examples 7 to 12 of the present invention.

  When a copper alloy having the same composition as Example 3 and Example 4 of the present invention is processed in the same process as the material (C) of Example 3, the plate thickness before the first heat treatment, the first and second The respective heating conditions of the heat treatment were carried out under the conditions shown in Table 3 to produce materials (K) to (P). Each characteristic value of tensile strength, 0.2% proof stress, elongation, and conductivity was measured for each obtained material. Table 4 shows the measurement results.

From Table 4, according to Example 3 and Example 4 of the present invention the material (C) and the material (D) 0.2% yield strength and 13% or more greater than the tensile strength and 630 N / mm ² greater than 690n / mm ² The materials (K) to (P) of Comparative Examples 7 to 12 are inferior in properties while having a good elongation and achieving a good conductivity reaching 42% IACS. I understand that. The materials (K) and (L) are examples in which the plate thickness before the first heat treatment is out of the specified range. When the plate thickness before the heat treatment is too thin like the material (K), the proof stress is particularly low and the tensile strength is also low. If the plate thickness before the heat treatment is too thick as in the material (L), the decrease in elongation is large due to cold rolling after the heat treatment, and the bending workability is deteriorated. Further, the material (M) and the material (N) are examples in which the heating temperature of the first heat treatment is out of the specified range, and in this case, the tensile strength and the proof stress are low. The materials (O) and (P) are examples in which the heating temperature of the second heat treatment is out of the specified range. When the heating temperature is too low like the material (O), the electrical conductivity is low, and the tensile strength and proof stress are also insufficient. When the heating temperature is too high like the material (P), the electrical conductivity is high, but the tensile strength and proof stress are insufficient values.

  The Cu-Ni-Si alloy material produced by the manufacturing method of the present invention has a higher electrical conductivity than conventional brass and phosphor bronze used as a material for terminals and connectors, and has the same high strength and proof strength as phosphor bronze. have. In addition, it has superior bending workability compared to conventional Cu-Ni-Si alloy materials, and has a feature that the anisotropy of the crystal structure is small. Such characteristics can be effectively used for a small connector for an automobile in which the amount of energization is increasing, and the design flexibility of the connector can be greatly expanded. In terms of manufacturing cost, the copper alloy material according to the present invention can be manufactured at a cost equivalent to that of the conventional material and does not cause a practical problem.

It is a flowchart which shows an example of the manufacturing process of the copper alloy for terminals and connectors of this invention. It is a flowchart which shows the other example of the manufacturing process of the copper alloy for terminals and connectors of this invention.

Claims (5)

1.0-5.0 mass% Ni, 0.2-1.0 mass% Si, 1.0-5.0 mass% Zn, 0.003-0.3 mass% P, 0.0. A step of preparing an alloy material consisting of 05 to 1.0 mass% of Sn and the balance of Cu and having a Ni / Si weight ratio of Ni / Si = 4.5 to 5.5;
A step of subjecting the alloy material to a first cold rolling to a thickness of 1.1 to 1.2 times the final final plate thickness;
Performing a first heat treatment for cooling the alloy material after the first cold rolling to 700 to 850 ° C. and then cooling it to 300 ° C. or less at a temperature lowering rate of 25 ° C. or more per minute; Including a step of subjecting the alloy material after the heat treatment to a second cold heat treatment to a final final plate thickness and then performing a second heat treatment of heating to 400 to 500 ° C. and holding for 30 minutes to 3 hours. The manufacturing method of the copper alloy for terminals and connectors characterized by these. 1.0-5.0 mass% Ni, 0.2-1.0 mass% Si, 1.0-5.0 mass% Zn, 0.003-0.3 mass% P, 0.0. A step of preparing an alloy material consisting of 05 to 1.0 mass% of Sn and the balance of Cu and having a mass ratio of Ni and Si of Ni / Si = 4.5 to 5.5;
A step of subjecting the alloy material to a first cold rolling to a thickness of 1.1 to 1.2 times the final final plate thickness;
The alloy material after the first cold rolling is heated to 700 to 850 ° C., then subjected to a first heat treatment for cooling to 300 ° C. or less at a temperature lowering rate of 25 ° C. or more per minute, and then continuously 400 to 500 A step of performing a second heat treatment that is heated to ℃ and held for 30 minutes to 3 hours, and after subjecting the alloy material after the second heat treatment to a second cold rolling to a desired final thickness, The manufacturing method of the copper alloy for terminals and connectors characterized by including the process of performing the 3rd heat processing heated to 300-500 degreeC. 1.0-5.0 mass% Ni, 0.2-1.0 mass% Si, 1.0-5.0 mass% Zn, 0.003-0.3 mass% P, 0.0. It is selected from among Mg, Ti, Cr, and Zr set to 0.01 to 4.0% by mass with 0.01 to 1.0% by mass of Sn of 0.5 to 1.0% by mass per kind. A step of preparing an alloy material consisting of at least one additional component and the balance Cu, and the mass ratio of Ni and Si being Ni / Si = 4.5 to 5.5,
A step of subjecting the alloy material to a first cold rolling to a thickness of 1.1 to 1.2 times the final final plate thickness;
Performing a first heat treatment for cooling the alloy material after the first cold rolling to 700 to 850 ° C. and then cooling it to 300 ° C. or less at a temperature lowering rate of 25 ° C. or more per minute; Including a step of subjecting the alloy material after the heat treatment to a second cold heat treatment to a final final plate thickness and then performing a second heat treatment of heating to 400 to 500 ° C. and holding for 30 minutes to 3 hours. The manufacturing method of the copper alloy for terminals and connectors characterized by these. 1.0-5.0 mass% Ni, 0.2-1.0 mass% Si, 1.0-5.0 mass% Zn, 0.003-0.3 mass% P, 0.0. It is selected from among Mg, Ti, Cr, and Zr set to 0.01 to 4.0% by mass with 0.01 to 1.0% by mass of Sn of 0.5 to 1.0% by mass per kind. A step of preparing an alloy material consisting of at least one additional component and the balance Cu, and the mass ratio of Ni and Si being Ni / Si = 4.5 to 5.5,
A step of subjecting the alloy material to a first cold rolling to a thickness of 1.1 to 1.2 times the final final plate thickness;
The alloy material after the first cold rolling is heated to 700 to 850 ° C., then subjected to a first heat treatment for cooling to 300 ° C. or less at a temperature lowering rate of 25 ° C. or more per minute, and then continuously 400 to 500 A step of performing a second heat treatment that is heated to ℃ and held for 30 minutes to 3 hours, and after subjecting the alloy material after the second heat treatment to a second cold rolling to a desired final thickness, The manufacturing method of the copper alloy for terminals and connectors characterized by including the process of performing the 3rd heat processing heated to 300-500 degreeC. The first heat treatment sufficiently dissolves the alloy material in copper to prevent coarse precipitates from being re-formed during cooling,
The said 2nd heat processing includes producing | generating the compound of Ni and Si, and precipitating in a fine shape in copper, The manufacture of the copper alloy for terminals and connectors in any one of Claims 1-4 characterized by the above-mentioned. Method.

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