EP2154257A4 - Cu-ni-si-based alloy for electronic material - Google Patents

Cu-ni-si-based alloy for electronic material

Info

Publication number
EP2154257A4
EP2154257A4 EP08739256A EP08739256A EP2154257A4 EP 2154257 A4 EP2154257 A4 EP 2154257A4 EP 08739256 A EP08739256 A EP 08739256A EP 08739256 A EP08739256 A EP 08739256A EP 2154257 A4 EP2154257 A4 EP 2154257A4
Authority
EP
European Patent Office
Prior art keywords
based alloy
electronic material
electronic
alloy
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
EP08739256A
Other languages
German (de)
French (fr)
Other versions
EP2154257B1 (en
EP2154257A1 (en
Inventor
Naohiko Era
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
JX Nippon Mining and Metals Corp
Original Assignee
JX Nippon Mining and Metals Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by JX Nippon Mining and Metals Corp filed Critical JX Nippon Mining and Metals Corp
Publication of EP2154257A1 publication Critical patent/EP2154257A1/en
Publication of EP2154257A4 publication Critical patent/EP2154257A4/en
Application granted granted Critical
Publication of EP2154257B1 publication Critical patent/EP2154257B1/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C22METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22CALLOYS
    • C22C9/00Alloys based on copper
    • C22C9/06Alloys based on copper with nickel or cobalt as the next major constituent
    • CCHEMISTRY; METALLURGY
    • C22METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22FCHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS AND NON-FERROUS ALLOYS
    • C22F1/00Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
    • CCHEMISTRY; METALLURGY
    • C22METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22FCHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS AND NON-FERROUS ALLOYS
    • C22F1/00Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
    • C22F1/02Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working in inert or controlled atmosphere or vacuum
    • CCHEMISTRY; METALLURGY
    • C22METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22FCHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS AND NON-FERROUS ALLOYS
    • C22F1/00Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
    • C22F1/08Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working of copper or alloys based thereon
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01BCABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/02Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of metals or alloys
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01BCABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/02Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of metals or alloys
    • H01B1/026Alloys based on copper
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01BCABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B5/00Non-insulated conductors or conductive bodies characterised by their form
    • H01B5/02Single bars, rods, wires, or strips
EP08739256.9A 2007-03-30 2008-03-28 Cu-ni-si-based alloy for electronic material Active EP2154257B1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007094441 2007-03-30
PCT/JP2008/056138 WO2008123433A1 (en) 2007-03-30 2008-03-28 Cu-ni-si-based alloy for electronic material

Publications (3)

Publication Number Publication Date
EP2154257A1 EP2154257A1 (en) 2010-02-17
EP2154257A4 true EP2154257A4 (en) 2012-01-11
EP2154257B1 EP2154257B1 (en) 2016-10-05

Family

ID=39830918

Family Applications (1)

Application Number Title Priority Date Filing Date
EP08739256.9A Active EP2154257B1 (en) 2007-03-30 2008-03-28 Cu-ni-si-based alloy for electronic material

Country Status (7)

Country Link
US (1) US20100086435A1 (en)
EP (1) EP2154257B1 (en)
JP (1) JP4418028B2 (en)
KR (1) KR101211984B1 (en)
CN (1) CN101646792B (en)
TW (1) TWI395824B (en)
WO (1) WO2008123433A1 (en)

Families Citing this family (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101981214B (en) * 2008-03-31 2015-12-09 古河电气工业株式会社 Copper alloy for electrical/electronic device material and electrical/electronic part
CN101981213B (en) * 2008-03-31 2012-11-14 古河电气工业株式会社 Copper alloy material for electric and electronic apparatuses, and electric and electronic components
WO2011068134A1 (en) * 2009-12-02 2011-06-09 古河電気工業株式会社 Copper alloy sheet material having low young's modulus and method for producing same
JP5654571B2 (en) * 2010-04-02 2015-01-14 Jx日鉱日石金属株式会社 Cu-Ni-Si alloy for electronic materials
JP5045784B2 (en) * 2010-05-14 2012-10-10 三菱マテリアル株式会社 Copper alloy for electronic equipment, method for producing copper alloy for electronic equipment, and rolled copper alloy material for electronic equipment
JP5714863B2 (en) 2010-10-14 2015-05-07 矢崎総業株式会社 Female terminal and method for manufacturing female terminal
JP5712585B2 (en) * 2010-12-03 2015-05-07 三菱マテリアル株式会社 Copper alloy for electronic equipment, method for producing copper alloy for electronic equipment, and rolled copper alloy material for electronic equipment
JP5684022B2 (en) * 2011-03-28 2015-03-11 三菱伸銅株式会社 Cu-Ni-Si based copper alloy sheet excellent in stress relaxation resistance, fatigue resistance after bending and spring characteristics, and method for producing the same
US9159985B2 (en) * 2011-05-27 2015-10-13 Ostuka Techno Corporation Circuit breaker and battery pack including the same
JP5903842B2 (en) 2011-11-14 2016-04-13 三菱マテリアル株式会社 Copper alloy, copper alloy plastic working material, and method for producing copper alloy plastic working material
KR101274063B1 (en) * 2013-01-22 2013-06-12 한국기계연구원 A metal matrix composite with two-way shape precipitation and method for manufacturing thereof
KR101709560B1 (en) 2013-09-27 2017-02-23 주식회사 엘지화학 Secondary Battery with Electrode Tab Having Low Resistance
JP6452472B2 (en) * 2014-01-27 2019-01-16 古河電気工業株式会社 Copper alloy material and method for producing the same
CN105385890A (en) * 2015-11-27 2016-03-09 宁波博威合金材料股份有限公司 Nickel and silicon contained bronze alloy and application thereof
CN105821238B (en) * 2016-05-31 2018-01-02 黄河科技学院 A kind of Cu alloy material and preparation method thereof
CN106191725B (en) * 2016-06-24 2018-01-26 河南江河机械有限责任公司 High-intensity high-conductivity copper alloy nanometer phase precipitation technique method
CN108193080B (en) * 2016-12-08 2019-12-17 北京有色金属研究总院 High-strength high-conductivity stress relaxation-resistant copper-nickel-silicon alloy material and preparation method thereof
CN109609801A (en) * 2018-12-06 2019-04-12 宁波博威合金材料股份有限公司 High property copper alloy and preparation method thereof
CN115386766A (en) * 2022-08-11 2022-11-25 中国科学院金属研究所 Cu-Ni-Si-Cr-Mg quinary copper alloy and preparation method thereof

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05179377A (en) * 1991-12-27 1993-07-20 Kobe Steel Ltd High strength copper alloy excellent in bendability and its production
JP2001207229A (en) * 2000-01-27 2001-07-31 Nippon Mining & Metals Co Ltd Copper alloy for electronic material
JP2005350696A (en) * 2004-06-08 2005-12-22 Hitachi Cable Ltd Method for manufacturing copper alloy for terminal and connector

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61115249A (en) 1984-11-09 1986-06-02 Sanyo Electric Co Ltd Supporting device of electromechanical transducer
JP2862942B2 (en) 1990-03-20 1999-03-03 古河電気工業株式会社 Heat treatment method of Corson alloy
JPH0718356A (en) * 1993-07-01 1995-01-20 Mitsubishi Electric Corp Copper alloy for electronic equipment, its production and ic lead frame
JP4177221B2 (en) 2003-10-06 2008-11-05 古河電気工業株式会社 Copper alloy for electronic equipment
WO2006093140A1 (en) * 2005-02-28 2006-09-08 The Furukawa Electric Co., Ltd. Copper alloy
CN1776997B (en) * 2005-12-13 2010-05-05 江苏科技大学 Large-capacity steam turbine generator rotor copper alloy slot wedge and its preparing method

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05179377A (en) * 1991-12-27 1993-07-20 Kobe Steel Ltd High strength copper alloy excellent in bendability and its production
JP2001207229A (en) * 2000-01-27 2001-07-31 Nippon Mining & Metals Co Ltd Copper alloy for electronic material
JP2005350696A (en) * 2004-06-08 2005-12-22 Hitachi Cable Ltd Method for manufacturing copper alloy for terminal and connector

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
See also references of WO2008123433A1 *

Also Published As

Publication number Publication date
KR20090123017A (en) 2009-12-01
JP4418028B2 (en) 2010-02-17
CN101646792B (en) 2012-02-22
TW200902732A (en) 2009-01-16
US20100086435A1 (en) 2010-04-08
EP2154257B1 (en) 2016-10-05
WO2008123433A1 (en) 2008-10-16
EP2154257A1 (en) 2010-02-17
CN101646792A (en) 2010-02-10
TWI395824B (en) 2013-05-11
KR101211984B1 (en) 2012-12-13
JPWO2008123433A1 (en) 2010-07-15

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