EP2333127A4 - Copper alloy material for electrical/electronic component - Google Patents
Copper alloy material for electrical/electronic componentInfo
- Publication number
- EP2333127A4 EP2333127A4 EP09804912A EP09804912A EP2333127A4 EP 2333127 A4 EP2333127 A4 EP 2333127A4 EP 09804912 A EP09804912 A EP 09804912A EP 09804912 A EP09804912 A EP 09804912A EP 2333127 A4 EP2333127 A4 EP 2333127A4
- Authority
- EP
- European Patent Office
- Prior art keywords
- electrical
- electronic component
- copper alloy
- alloy material
- copper
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C9/00—Alloys based on copper
- C22C9/06—Alloys based on copper with nickel or cobalt as the next major constituent
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22F—CHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS AND NON-FERROUS ALLOYS
- C22F1/00—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
- C22F1/08—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working of copper or alloys based thereon
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/02—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of metals or alloys
- H01B1/026—Alloys based on copper
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Crystallography & Structural Chemistry (AREA)
- Conductive Materials (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2008202469 | 2008-08-05 | ||
PCT/JP2009/063614 WO2010016428A1 (en) | 2008-08-05 | 2009-07-30 | Copper alloy material for electrical/electronic component |
Publications (2)
Publication Number | Publication Date |
---|---|
EP2333127A1 EP2333127A1 (en) | 2011-06-15 |
EP2333127A4 true EP2333127A4 (en) | 2012-07-04 |
Family
ID=41663648
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
EP09804912A Withdrawn EP2333127A4 (en) | 2008-08-05 | 2009-07-30 | Copper alloy material for electrical/electronic component |
Country Status (6)
Country | Link |
---|---|
US (1) | US20110200480A1 (en) |
EP (1) | EP2333127A4 (en) |
JP (1) | JPWO2010016428A1 (en) |
KR (1) | KR20110039372A (en) |
CN (1) | CN102112641B (en) |
WO (1) | WO2010016428A1 (en) |
Families Citing this family (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4830035B2 (en) | 2010-04-14 | 2011-12-07 | Jx日鉱日石金属株式会社 | Cu-Si-Co alloy for electronic materials and method for producing the same |
JP4672804B1 (en) | 2010-05-31 | 2011-04-20 | Jx日鉱日石金属株式会社 | Cu-Co-Si based copper alloy for electronic materials and method for producing the same |
JP4708497B1 (en) * | 2010-06-03 | 2011-06-22 | Jx日鉱日石金属株式会社 | Cu-Co-Si alloy plate and method for producing the same |
JP4834781B1 (en) * | 2010-08-24 | 2011-12-14 | Jx日鉱日石金属株式会社 | Cu-Co-Si alloy for electronic materials |
JP5508326B2 (en) * | 2011-03-24 | 2014-05-28 | Jx日鉱日石金属株式会社 | Co-Si copper alloy sheet |
JP4831552B1 (en) * | 2011-03-28 | 2011-12-07 | Jx日鉱日石金属株式会社 | Co-Si copper alloy sheet |
JP6205105B2 (en) * | 2011-04-18 | 2017-09-27 | Jx金属株式会社 | Cu-Ni-Si based alloy for electronic material, Cu-Co-Si based alloy and method for producing the same |
JP5802150B2 (en) * | 2012-02-24 | 2015-10-28 | 株式会社神戸製鋼所 | Copper alloy |
JP5839126B2 (en) * | 2012-07-26 | 2016-01-06 | 三菱電機株式会社 | Copper alloy |
KR102005332B1 (en) * | 2019-04-09 | 2019-10-01 | 주식회사 풍산 | Method for manufacturing Cu-Co-Si-Fe-P alloy having Excellent Bending Formability |
CN110205570B (en) * | 2019-04-15 | 2021-01-01 | 丰山(连云港)新材料有限公司 | Heat treatment method of copper alloy for electric and electronic parts |
CN110415895A (en) * | 2019-08-16 | 2019-11-05 | 仙桃科利科技发展有限公司 | A kind of manufacture craft of the anti-aging data line of high transmission rates |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS63307232A (en) * | 1987-06-04 | 1988-12-14 | Sumitomo Metal Mining Co Ltd | Copper alloy |
JPH0920943A (en) * | 1995-06-30 | 1997-01-21 | Furukawa Electric Co Ltd:The | Copper alloy for electronic and electrical parts and its production |
JP2007169764A (en) * | 2005-12-26 | 2007-07-05 | Furukawa Electric Co Ltd:The | Copper alloy |
WO2007139213A1 (en) * | 2006-06-01 | 2007-12-06 | The Furukawa Electric Co., Ltd. | Process for manufacturing copper alloy wire rod and copper alloy wire rod |
JP2008088512A (en) * | 2006-10-03 | 2008-04-17 | Nikko Kinzoku Kk | Method for producing copper alloy for electronic material |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH02277735A (en) * | 1989-04-20 | 1990-11-14 | Sumitomo Metal Mining Co Ltd | Copper alloy for lead frame |
JP3510469B2 (en) * | 1998-01-30 | 2004-03-29 | 古河電気工業株式会社 | Copper alloy for conductive spring and method for producing the same |
JP3739214B2 (en) * | 1998-03-26 | 2006-01-25 | 株式会社神戸製鋼所 | Copper alloy sheet for electronic parts |
JP2000087158A (en) * | 1998-09-11 | 2000-03-28 | Furukawa Electric Co Ltd:The | Copper alloy for semiconductor lead frame |
JP3754011B2 (en) * | 2002-09-04 | 2006-03-08 | デプト株式会社 | Metal material for electronic component, electronic component, electronic device, method for processing metal material, method for manufacturing electronic component, and electro-optical component |
WO2006101172A1 (en) * | 2005-03-24 | 2006-09-28 | Nippon Mining & Metals Co., Ltd. | Copper alloy for electronic material |
JP4068626B2 (en) * | 2005-03-31 | 2008-03-26 | 日鉱金属株式会社 | Cu-Ni-Si-Co-Cr-based copper alloy for electronic materials and method for producing the same |
JP4943095B2 (en) * | 2006-08-30 | 2012-05-30 | 三菱電機株式会社 | Copper alloy and manufacturing method thereof |
-
2009
- 2009-07-30 JP JP2010523839A patent/JPWO2010016428A1/en active Pending
- 2009-07-30 EP EP09804912A patent/EP2333127A4/en not_active Withdrawn
- 2009-07-30 KR KR1020117004941A patent/KR20110039372A/en not_active Application Discontinuation
- 2009-07-30 WO PCT/JP2009/063614 patent/WO2010016428A1/en active Application Filing
- 2009-07-30 CN CN200980130454.8A patent/CN102112641B/en not_active Expired - Fee Related
-
2011
- 2011-02-04 US US13/021,444 patent/US20110200480A1/en not_active Abandoned
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS63307232A (en) * | 1987-06-04 | 1988-12-14 | Sumitomo Metal Mining Co Ltd | Copper alloy |
JPH0920943A (en) * | 1995-06-30 | 1997-01-21 | Furukawa Electric Co Ltd:The | Copper alloy for electronic and electrical parts and its production |
JP2007169764A (en) * | 2005-12-26 | 2007-07-05 | Furukawa Electric Co Ltd:The | Copper alloy |
WO2007139213A1 (en) * | 2006-06-01 | 2007-12-06 | The Furukawa Electric Co., Ltd. | Process for manufacturing copper alloy wire rod and copper alloy wire rod |
JP2008088512A (en) * | 2006-10-03 | 2008-04-17 | Nikko Kinzoku Kk | Method for producing copper alloy for electronic material |
Non-Patent Citations (1)
Title |
---|
See also references of WO2010016428A1 * |
Also Published As
Publication number | Publication date |
---|---|
WO2010016428A1 (en) | 2010-02-11 |
KR20110039372A (en) | 2011-04-15 |
CN102112641B (en) | 2013-03-27 |
US20110200480A1 (en) | 2011-08-18 |
CN102112641A (en) | 2011-06-29 |
JPWO2010016428A1 (en) | 2012-01-19 |
EP2333127A1 (en) | 2011-06-15 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
PUAI | Public reference made under article 153(3) epc to a published international application that has entered the european phase |
Free format text: ORIGINAL CODE: 0009012 |
|
17P | Request for examination filed |
Effective date: 20110216 |
|
AK | Designated contracting states |
Kind code of ref document: A1 Designated state(s): AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO SE SI SK SM TR |
|
AX | Request for extension of the european patent |
Extension state: AL BA RS |
|
DAX | Request for extension of the european patent (deleted) | ||
RIC1 | Information provided on ipc code assigned before grant |
Ipc: C22C 9/06 20060101AFI20120524BHEP Ipc: C22F 1/08 20060101ALI20120524BHEP Ipc: H01B 1/02 20060101ALI20120524BHEP |
|
A4 | Supplementary search report drawn up and despatched |
Effective date: 20120604 |
|
17Q | First examination report despatched |
Effective date: 20130207 |
|
GRAP | Despatch of communication of intention to grant a patent |
Free format text: ORIGINAL CODE: EPIDOSNIGR1 |
|
INTG | Intention to grant announced |
Effective date: 20131007 |
|
STAA | Information on the status of an ep patent application or granted ep patent |
Free format text: STATUS: THE APPLICATION IS DEEMED TO BE WITHDRAWN |
|
18D | Application deemed to be withdrawn |
Effective date: 20140218 |