EP2333128A4 - Copper alloy material for electrical/electronic component - Google Patents
Copper alloy material for electrical/electronic componentInfo
- Publication number
- EP2333128A4 EP2333128A4 EP09804913A EP09804913A EP2333128A4 EP 2333128 A4 EP2333128 A4 EP 2333128A4 EP 09804913 A EP09804913 A EP 09804913A EP 09804913 A EP09804913 A EP 09804913A EP 2333128 A4 EP2333128 A4 EP 2333128A4
- Authority
- EP
- European Patent Office
- Prior art keywords
- electrical
- electronic component
- copper alloy
- alloy material
- copper
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C9/00—Alloys based on copper
- C22C9/06—Alloys based on copper with nickel or cobalt as the next major constituent
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22F—CHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS AND NON-FERROUS ALLOYS
- C22F1/00—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
- C22F1/08—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working of copper or alloys based thereon
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/02—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of metals or alloys
- H01B1/026—Alloys based on copper
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2008202467 | 2008-08-05 | ||
PCT/JP2009/063615 WO2010016429A1 (en) | 2008-08-05 | 2009-07-30 | Copper alloy material for electrical/electronic component |
Publications (2)
Publication Number | Publication Date |
---|---|
EP2333128A1 EP2333128A1 (en) | 2011-06-15 |
EP2333128A4 true EP2333128A4 (en) | 2012-07-04 |
Family
ID=41663649
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
EP09804913A Withdrawn EP2333128A4 (en) | 2008-08-05 | 2009-07-30 | Copper alloy material for electrical/electronic component |
Country Status (6)
Country | Link |
---|---|
US (1) | US20110200479A1 (en) |
EP (1) | EP2333128A4 (en) |
JP (1) | JP4913902B2 (en) |
KR (1) | KR101570556B1 (en) |
CN (1) | CN102112640B (en) |
WO (1) | WO2010016429A1 (en) |
Families Citing this family (19)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
ATE414182T1 (en) | 2003-03-03 | 2008-11-15 | Mitsubishi Shindo Kk | HEAT RESISTANT COPPER ALLOY MATERIALS |
EP2228460B1 (en) | 2007-12-21 | 2017-01-11 | Mitsubishi Shindoh Co., Ltd. | High-strength highly heat-conductive copper alloy pipe and process for producing the same |
CN101932741B (en) | 2008-02-26 | 2012-10-24 | 三菱伸铜株式会社 | High-strength high-conductive copper wire rod |
BRPI0905381A2 (en) | 2008-03-28 | 2016-07-05 | Mitsubishi Shindo Kk | high strength and high conductivity copper alloy wire, rod or tube |
KR101291012B1 (en) * | 2009-01-09 | 2013-07-30 | 미쓰비시 신도 가부시키가이샤 | High-strength high-conductivity copper alloy rolled sheet and method for producing same |
EP2386666B1 (en) | 2009-01-09 | 2015-06-10 | Mitsubishi Shindoh Co., Ltd. | High-strength high-conductivity copper alloy rolled sheet and method for producing same |
JP4620173B1 (en) * | 2010-03-30 | 2011-01-26 | Jx日鉱日石金属株式会社 | Cu-Co-Si alloy material |
JP4672804B1 (en) * | 2010-05-31 | 2011-04-20 | Jx日鉱日石金属株式会社 | Cu-Co-Si based copper alloy for electronic materials and method for producing the same |
JP4601085B1 (en) * | 2010-06-03 | 2010-12-22 | Jx日鉱日石金属株式会社 | Cu-Co-Si-based copper alloy rolled plate and electrical component using the same |
JP4834781B1 (en) | 2010-08-24 | 2011-12-14 | Jx日鉱日石金属株式会社 | Cu-Co-Si alloy for electronic materials |
JP5718021B2 (en) * | 2010-10-29 | 2015-05-13 | Jx日鉱日石金属株式会社 | Titanium copper for electronic parts |
JP2012144789A (en) * | 2011-01-13 | 2012-08-02 | Jx Nippon Mining & Metals Corp | Cu-Co-Si-Zr ALLOY MATERIAL |
JP5544316B2 (en) * | 2011-02-14 | 2014-07-09 | Jx日鉱日石金属株式会社 | Cu-Co-Si-based alloys, copper products, electronic parts, and connectors |
JP5628712B2 (en) * | 2011-03-08 | 2014-11-19 | Jx日鉱日石金属株式会社 | Titanium copper for electronic parts |
JP5514762B2 (en) * | 2011-03-29 | 2014-06-04 | Jx日鉱日石金属株式会社 | Cu-Co-Si alloy with excellent bending workability |
JP6205105B2 (en) * | 2011-04-18 | 2017-09-27 | Jx金属株式会社 | Cu-Ni-Si based alloy for electronic material, Cu-Co-Si based alloy and method for producing the same |
JP6621650B2 (en) * | 2015-11-17 | 2019-12-18 | 株式会社フジコー | Roll for hot rolling process and manufacturing method thereof |
JP6461249B2 (en) * | 2017-07-06 | 2019-01-30 | 三菱アルミニウム株式会社 | Aluminum alloy foil and method for producing aluminum alloy foil |
CN108414559B (en) * | 2018-04-16 | 2020-12-29 | 中国航发北京航空材料研究院 | Quantitative analysis method for testing different-phase composition micro-area components in multi-element alloy |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0920943A (en) * | 1995-06-30 | 1997-01-21 | Furukawa Electric Co Ltd:The | Copper alloy for electronic and electrical parts and its production |
JP2006161148A (en) * | 2004-02-27 | 2006-06-22 | Furukawa Electric Co Ltd:The | Copper alloy |
US20080056930A1 (en) * | 2006-08-30 | 2008-03-06 | Mitsubishi Electric Corporation | Copper alloy and method of producing same |
JP2008088512A (en) * | 2006-10-03 | 2008-04-17 | Nikko Kinzoku Kk | Method for producing copper alloy for electronic material |
Family Cites Families (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6187838A (en) | 1984-10-03 | 1986-05-06 | Kobe Steel Ltd | Copper alloy having superior hot workability |
JPS63307232A (en) | 1987-06-04 | 1988-12-14 | Sumitomo Metal Mining Co Ltd | Copper alloy |
JPH02129326A (en) | 1988-11-08 | 1990-05-17 | Sumitomo Metal Mining Co Ltd | High strength copper alloy |
JPH02277735A (en) | 1989-04-20 | 1990-11-14 | Sumitomo Metal Mining Co Ltd | Copper alloy for lead frame |
JP3754011B2 (en) * | 2002-09-04 | 2006-03-08 | デプト株式会社 | Metal material for electronic component, electronic component, electronic device, method for processing metal material, method for manufacturing electronic component, and electro-optical component |
JP2006265731A (en) | 2005-02-28 | 2006-10-05 | Furukawa Electric Co Ltd:The | Copper alloy |
JP5202812B2 (en) * | 2005-03-02 | 2013-06-05 | 古河電気工業株式会社 | Copper alloy and its manufacturing method |
EP1873267B1 (en) * | 2005-03-24 | 2014-07-02 | JX Nippon Mining & Metals Corporation | Copper alloy for electronic material |
JP4068626B2 (en) * | 2005-03-31 | 2008-03-26 | 日鉱金属株式会社 | Cu-Ni-Si-Co-Cr-based copper alloy for electronic materials and method for producing the same |
JP4655834B2 (en) * | 2005-09-02 | 2011-03-23 | 日立電線株式会社 | Copper alloy material for electrical parts and manufacturing method thereof |
JP4006467B1 (en) | 2006-09-22 | 2007-11-14 | 株式会社神戸製鋼所 | Copper alloy with high strength, high conductivity, and excellent bending workability |
JP4006468B1 (en) | 2006-09-22 | 2007-11-14 | 株式会社神戸製鋼所 | Copper alloy with high strength, high conductivity, and excellent bending workability |
JP4006460B1 (en) | 2006-05-26 | 2007-11-14 | 株式会社神戸製鋼所 | Copper alloy excellent in high strength, high conductivity and bending workability, and method for producing the same |
JP4876959B2 (en) | 2007-02-19 | 2012-02-15 | 株式会社Ihi | Turbocharger |
-
2009
- 2009-07-30 WO PCT/JP2009/063615 patent/WO2010016429A1/en active Application Filing
- 2009-07-30 EP EP09804913A patent/EP2333128A4/en not_active Withdrawn
- 2009-07-30 JP JP2010507744A patent/JP4913902B2/en active Active
- 2009-07-30 CN CN2009801304529A patent/CN102112640B/en not_active Expired - Fee Related
- 2009-07-30 KR KR1020117004937A patent/KR101570556B1/en not_active IP Right Cessation
-
2011
- 2011-02-04 US US13/021,371 patent/US20110200479A1/en not_active Abandoned
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0920943A (en) * | 1995-06-30 | 1997-01-21 | Furukawa Electric Co Ltd:The | Copper alloy for electronic and electrical parts and its production |
JP2006161148A (en) * | 2004-02-27 | 2006-06-22 | Furukawa Electric Co Ltd:The | Copper alloy |
US20080056930A1 (en) * | 2006-08-30 | 2008-03-06 | Mitsubishi Electric Corporation | Copper alloy and method of producing same |
JP2008088512A (en) * | 2006-10-03 | 2008-04-17 | Nikko Kinzoku Kk | Method for producing copper alloy for electronic material |
Non-Patent Citations (1)
Title |
---|
See also references of WO2010016429A1 * |
Also Published As
Publication number | Publication date |
---|---|
JPWO2010016429A1 (en) | 2012-01-19 |
KR20110039371A (en) | 2011-04-15 |
EP2333128A1 (en) | 2011-06-15 |
US20110200479A1 (en) | 2011-08-18 |
JP4913902B2 (en) | 2012-04-11 |
KR101570556B1 (en) | 2015-11-19 |
CN102112640A (en) | 2011-06-29 |
WO2010016429A1 (en) | 2010-02-11 |
CN102112640B (en) | 2013-03-27 |
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Legal Events
Date | Code | Title | Description |
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PUAI | Public reference made under article 153(3) epc to a published international application that has entered the european phase |
Free format text: ORIGINAL CODE: 0009012 |
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17P | Request for examination filed |
Effective date: 20110216 |
|
AK | Designated contracting states |
Kind code of ref document: A1 Designated state(s): AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO SE SI SK SM TR |
|
AX | Request for extension of the european patent |
Extension state: AL BA RS |
|
DAX | Request for extension of the european patent (deleted) | ||
RIC1 | Information provided on ipc code assigned before grant |
Ipc: C22F 1/08 20060101ALI20120524BHEP Ipc: C22C 9/06 20060101AFI20120524BHEP Ipc: H01B 1/02 20060101ALI20120524BHEP |
|
A4 | Supplementary search report drawn up and despatched |
Effective date: 20120604 |
|
17Q | First examination report despatched |
Effective date: 20130212 |
|
GRAP | Despatch of communication of intention to grant a patent |
Free format text: ORIGINAL CODE: EPIDOSNIGR1 |
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INTG | Intention to grant announced |
Effective date: 20130703 |
|
STAA | Information on the status of an ep patent application or granted ep patent |
Free format text: STATUS: THE APPLICATION HAS BEEN WITHDRAWN |
|
18W | Application withdrawn |
Effective date: 20130917 |