EP2143810A4 - Copper alloy for electrical/electronic device and method for producing the same - Google Patents

Copper alloy for electrical/electronic device and method for producing the same

Info

Publication number
EP2143810A4
EP2143810A4 EP08722882A EP08722882A EP2143810A4 EP 2143810 A4 EP2143810 A4 EP 2143810A4 EP 08722882 A EP08722882 A EP 08722882A EP 08722882 A EP08722882 A EP 08722882A EP 2143810 A4 EP2143810 A4 EP 2143810A4
Authority
EP
European Patent Office
Prior art keywords
producing
electrical
electronic device
same
copper alloy
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP08722882A
Other languages
German (de)
French (fr)
Other versions
EP2143810A1 (en
Inventor
Ryosuke Matsuo
Tatsuhiko Eguchi
Kuniteru Mihara
Hiroshi Kaneko
Kiyoshige Hirose
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Furukawa Electric Co Ltd
Original Assignee
Furukawa Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Furukawa Electric Co Ltd filed Critical Furukawa Electric Co Ltd
Publication of EP2143810A1 publication Critical patent/EP2143810A1/en
Publication of EP2143810A4 publication Critical patent/EP2143810A4/en
Withdrawn legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C9/00—Alloys based on copper
    • C22C9/06—Alloys based on copper with nickel or cobalt as the next major constituent
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B03—SEPARATION OF SOLID MATERIALS USING LIQUIDS OR USING PNEUMATIC TABLES OR JIGS; MAGNETIC OR ELECTROSTATIC SEPARATION OF SOLID MATERIALS FROM SOLID MATERIALS OR FLUIDS; SEPARATION BY HIGH-VOLTAGE ELECTRIC FIELDS
    • B03C—MAGNETIC OR ELECTROSTATIC SEPARATION OF SOLID MATERIALS FROM SOLID MATERIALS OR FLUIDS; SEPARATION BY HIGH-VOLTAGE ELECTRIC FIELDS
    • B03C5/00—Separating dispersed particles from liquids by electrostatic effect
    • B03C5/005—Dielectrophoresis, i.e. dielectric particles migrating towards the region of highest field strength
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B03—SEPARATION OF SOLID MATERIALS USING LIQUIDS OR USING PNEUMATIC TABLES OR JIGS; MAGNETIC OR ELECTROSTATIC SEPARATION OF SOLID MATERIALS FROM SOLID MATERIALS OR FLUIDS; SEPARATION BY HIGH-VOLTAGE ELECTRIC FIELDS
    • B03C—MAGNETIC OR ELECTROSTATIC SEPARATION OF SOLID MATERIALS FROM SOLID MATERIALS OR FLUIDS; SEPARATION BY HIGH-VOLTAGE ELECTRIC FIELDS
    • B03C5/00—Separating dispersed particles from liquids by electrostatic effect
    • B03C5/02—Separators
    • B03C5/022—Non-uniform field separators
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C9/00—Alloys based on copper
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22F—CHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS AND NON-FERROUS ALLOYS
    • C22F1/00—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22F—CHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS AND NON-FERROUS ALLOYS
    • C22F1/00—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
    • C22F1/08—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working of copper or alloys based thereon
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/02—Contact members
    • H01R13/03—Contact members characterised by the material, e.g. plating, or coating materials

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • General Health & Medical Sciences (AREA)
  • Molecular Biology (AREA)
  • Conductive Materials (AREA)
EP08722882A 2007-03-26 2008-03-26 Copper alloy for electrical/electronic device and method for producing the same Withdrawn EP2143810A4 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2007080266 2007-03-26
JP2008079256A JP5170881B2 (en) 2007-03-26 2008-03-25 Copper alloy material for electrical and electronic equipment and method for producing the same
PCT/JP2008/055785 WO2008126681A1 (en) 2007-03-26 2008-03-26 Copper alloy for electrical/electronic device and method for producing the same

Publications (2)

Publication Number Publication Date
EP2143810A1 EP2143810A1 (en) 2010-01-13
EP2143810A4 true EP2143810A4 (en) 2012-06-27

Family

ID=39863792

Family Applications (1)

Application Number Title Priority Date Filing Date
EP08722882A Withdrawn EP2143810A4 (en) 2007-03-26 2008-03-26 Copper alloy for electrical/electronic device and method for producing the same

Country Status (5)

Country Link
US (1) US20100193092A1 (en)
EP (1) EP2143810A4 (en)
JP (1) JP5170881B2 (en)
CN (1) CN101680057A (en)
WO (1) WO2008126681A1 (en)

Families Citing this family (25)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5009849B2 (en) * 2008-03-31 2012-08-22 日本精線株式会社 Copper alloy wire for high strength spring and copper alloy spring using the copper alloy wire
EP2267173A4 (en) * 2008-03-31 2013-09-25 Furukawa Electric Co Ltd Copper alloy material for electric and electronic apparatuses, and electric and electronic components
KR101114116B1 (en) * 2008-03-31 2012-03-13 후루카와 덴키 고교 가부시키가이샤 Copper Alloy Material for Electric and Electronic Apparatuses, and Electric and Electronic Components
JP5261161B2 (en) 2008-12-12 2013-08-14 Ｊｘ日鉱日石金属株式会社 Ni-Si-Co-based copper alloy and method for producing the same
JP4708485B2 (en) * 2009-03-31 2011-06-22 Ｊｘ日鉱日石金属株式会社 Cu-Co-Si based copper alloy for electronic materials and method for producing the same
JP5140045B2 (en) * 2009-08-06 2013-02-06 Ｊｘ日鉱日石金属株式会社 Cu-Ni-Si alloy plate or strip for electronic materials
KR20120054099A (en) * 2009-09-28 2012-05-29 제이엑스 닛코 닛세키 킨조쿠 가부시키가이샤 Cu-ni-si-co copper alloy for electronic material and process for producing same
JP5654571B2 (en) * 2010-04-02 2015-01-14 Jx日鉱日石金属株式会社 Cu-Ni-Si alloy for electronic materials
JP4830035B2 (en) 2010-04-14 2011-12-07 Ｊｘ日鉱日石金属株式会社 Cu-Si-Co alloy for electronic materials and method for producing the same
JP4672804B1 (en) 2010-05-31 2011-04-20 Ｊｘ日鉱日石金属株式会社 Cu-Co-Si based copper alloy for electronic materials and method for producing the same
JP4834781B1 (en) * 2010-08-24 2011-12-14 Ｊｘ日鉱日石金属株式会社 Cu-Co-Si alloy for electronic materials
JP2012072470A (en) * 2010-09-29 2012-04-12 Jx Nippon Mining & Metals Corp Cu-Co-Si-BASED COPPER ALLOY FOR ELECTRONIC MATERIAL AND METHOD FOR PRODUCING THE SAME
JP5522692B2 (en) * 2011-02-16 2014-06-18 株式会社日本製鋼所 High strength copper alloy forging
JP6205105B2 (en) * 2011-04-18 2017-09-27 Ｊｘ金属株式会社 Cu-Ni-Si based alloy for electronic material, Cu-Co-Si based alloy and method for producing the same
KR20140025607A (en) 2011-08-04 2014-03-04 가부시키가이샤 고베 세이코쇼 Copper alloy
JP6246454B2 (en) * 2011-11-02 2017-12-13 Ｊｘ金属株式会社 Cu-Ni-Si alloy and method for producing the same
JP6222885B2 (en) * 2011-11-10 2017-11-01 Ｊｘ金属株式会社 Cu-Ni-Si-Co based copper alloy for electronic materials
JP5773929B2 (en) 2012-03-28 2015-09-02 株式会社神戸製鋼所 Copper alloy sheet for electrical and electronic parts with excellent bending workability and stress relaxation resistance
KR101472348B1 (en) * 2012-11-09 2014-12-15 주식회사 풍산 Copper alloy material for electrical and electronic components and process for producing same
JP5501495B1 (en) * 2013-03-18 2014-05-21 三菱マテリアル株式会社 Copper alloy for electronic and electrical equipment, copper alloy sheet for electronic and electrical equipment, conductive parts and terminals for electronic and electrical equipment
CN104178660B (en) * 2014-08-29 2016-11-02 河南科技大学 A kind of high intensity Cu-Ni-Si alloy and preparation method thereof
JP6821290B2 (en) * 2015-03-19 2021-01-27 Ｊｘ金属株式会社 Cu-Ni-Co-Si alloy for electronic components
CN104928527A (en) * 2015-07-13 2015-09-23 苏州科茂电子材料科技有限公司 Conductive copper material for cable and preparing method thereof
JP6879971B2 (en) * 2018-03-30 2021-06-02 Ｊｘ金属株式会社 Manufacturing method of copper alloy material, electronic parts, electronic equipment and copper alloy material
JP6830135B2 (en) * 2019-08-06 2021-02-17 Ｊｘ金属株式会社 Cu-Ni-Co-Si alloy for electronic components

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20050208323A1 (en) * 2000-07-25 2005-09-22 Takayuki Usami Copper alloy material for parts of electronic and electric machinery and tools
US20050263218A1 (en) * 2004-05-27 2005-12-01 The Furukawa Electric Co., Ltd. Copper alloy
JP2006219733A (en) * 2005-02-14 2006-08-24 Kobe Steel Ltd Copper alloy sheet for electric-electronic component having reduced anisotropy
JP2006283059A (en) * 2005-03-31 2006-10-19 Kobe Steel Ltd High strength copper alloy sheet with excellent bendability, and its manufacturing method

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06184680A (en) 1992-12-21 1994-07-05 Kobe Steel Ltd Copper alloy excellent in bendability
JPH1060562A (en) * 1996-08-14 1998-03-03 Furukawa Electric Co Ltd:The Copper alloy for electronic equipment and its production
JP3510469B2 (en) * 1998-01-30 2004-03-29 古河電気工業株式会社 Copper alloy for conductive spring and method for producing the same
JP3739214B2 (en) * 1998-03-26 2006-01-25 株式会社神戸製鋼所 Copper alloy sheet for electronic parts
KR100535737B1 (en) * 2000-12-28 2005-12-09 닛꼬 긴조꾸 가꼬 가부시키가이샤 High strength copper alloy excellent in bendability and method for producing the same and terminal and connector using the same
JP3942505B2 (en) * 2002-07-16 2007-07-11 ヤマハメタニクス株式会社 Titanium copper alloy material and manufacturing method thereof
JP4664584B2 (en) 2003-09-18 2011-04-06 株式会社神戸製鋼所 High strength copper alloy plate and method for producing high strength copper alloy plate
JP2005133185A (en) * 2003-10-31 2005-05-26 Nippon Mining & Metals Co Ltd Deposition type copper alloy heat treatment method, deposition type copper alloy, and raw material thereof
JP4904455B2 (en) 2004-09-21 2012-03-28 Ｄｏｗａメタルテック株式会社 Copper alloy and manufacturing method thereof
JP2006200042A (en) * 2006-03-23 2006-08-03 Kobe Steel Ltd Electronic component composed of copper alloy sheet having excellent bending workability
JP4006460B1 (en) * 2006-05-26 2007-11-14 株式会社神戸製鋼所 Copper alloy excellent in high strength, high conductivity and bending workability, and method for producing the same
JP4357536B2 (en) * 2007-02-16 2009-11-04 株式会社神戸製鋼所 Copper alloy sheet for electrical and electronic parts with excellent strength and formability

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20050208323A1 (en) * 2000-07-25 2005-09-22 Takayuki Usami Copper alloy material for parts of electronic and electric machinery and tools
US20050263218A1 (en) * 2004-05-27 2005-12-01 The Furukawa Electric Co., Ltd. Copper alloy
JP2006219733A (en) * 2005-02-14 2006-08-24 Kobe Steel Ltd Copper alloy sheet for electric-electronic component having reduced anisotropy
JP2006283059A (en) * 2005-03-31 2006-10-19 Kobe Steel Ltd High strength copper alloy sheet with excellent bendability, and its manufacturing method

Non-Patent Citations (2)

* Cited by examiner, † Cited by third party
Title
DATABASE WPI Week 200664, Derwent World Patents Index; AN 2006-616267 *
See also references of WO2008126681A1 *

Also Published As

Publication number Publication date
EP2143810A1 (en) 2010-01-13
US20100193092A1 (en) 2010-08-05
CN101680057A (en) 2010-03-24
JP5170881B2 (en) 2013-03-27
WO2008126681A1 (en) 2008-10-23
JP2008266783A (en) 2008-11-06

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Legal Events

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DAX Request for extension of the european patent (deleted)
RAP1 Party data changed (applicant data changed or rights of an application transferred)

Owner name: FURUKAWA ELECTRIC CO., LTD.

A4 Supplementary search report drawn up and despatched

Effective date: 20120531

RIC1 Information provided on ipc code assigned before grant

Ipc: C22C 9/06 20060101AFI20120523BHEP

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Ipc: C22F 1/08 20060101ALI20120523BHEP

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