EP2256219A4 - Copper alloy material - Google Patents

Copper alloy material

Info

Publication number
EP2256219A4
EP2256219A4 EP09712614A EP09712614A EP2256219A4 EP 2256219 A4 EP2256219 A4 EP 2256219A4 EP 09712614 A EP09712614 A EP 09712614A EP 09712614 A EP09712614 A EP 09712614A EP 2256219 A4 EP2256219 A4 EP 2256219A4
Authority
EP
European Patent Office
Prior art keywords
copper alloy
alloy material
copper
alloy
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP09712614A
Other languages
German (de)
French (fr)
Other versions
EP2256219A1 (en
Inventor
Kiyoshige Hirose
Tatsuhiko Eguchi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Furukawa Electric Co Ltd
Original Assignee
Furukawa Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Furukawa Electric Co Ltd filed Critical Furukawa Electric Co Ltd
Publication of EP2256219A1 publication Critical patent/EP2256219A1/en
Publication of EP2256219A4 publication Critical patent/EP2256219A4/en
Withdrawn legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C9/00—Alloys based on copper
    • C22C9/06—Alloys based on copper with nickel or cobalt as the next major constituent
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22F—CHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS AND NON-FERROUS ALLOYS
    • C22F1/00—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
    • C22F1/08—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working of copper or alloys based thereon
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/02—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of metals or alloys
    • H01B1/026—Alloys based on copper

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Conductive Materials (AREA)
EP09712614A 2008-02-18 2009-02-17 Copper alloy material Withdrawn EP2256219A4 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2008036694 2008-02-18
PCT/JP2009/052718 WO2009104615A1 (en) 2008-02-18 2009-02-17 Copper alloy material

Publications (2)

Publication Number Publication Date
EP2256219A1 EP2256219A1 (en) 2010-12-01
EP2256219A4 true EP2256219A4 (en) 2012-06-27

Family

ID=40985494

Family Applications (1)

Application Number Title Priority Date Filing Date
EP09712614A Withdrawn EP2256219A4 (en) 2008-02-18 2009-02-17 Copper alloy material

Country Status (5)

Country Link
US (2) US20100310413A1 (en)
EP (1) EP2256219A4 (en)
JP (1) JPWO2009104615A1 (en)
CN (1) CN101946014A (en)
WO (1) WO2009104615A1 (en)

Families Citing this family (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5654571B2 (en) * 2010-04-02 2015-01-14 Jx日鉱日石金属株式会社 Cu-Ni-Si alloy for electronic materials
KR101294508B1 (en) * 2010-04-07 2013-08-07 후루카와 덴키 고교 가부시키가이샤 Wrought copper alloy, copper alloy part, and process for producing wrought copper alloy
KR101703679B1 (en) * 2010-07-07 2017-02-07 미츠비시 신도 가부시키가이샤 Cu-ni-si copper alloy plate with excellent deep-draw characteristics and production method thereof
JP5773929B2 (en) * 2012-03-28 2015-09-02 株式会社神戸製鋼所 Copper alloy sheet for electrical and electronic parts with excellent bending workability and stress relaxation resistance
CN102703754B (en) * 2012-06-05 2014-03-26 太原理工大学 Cu-Ni-Si-based alloy and preparation method thereof
WO2013191022A1 (en) * 2012-06-19 2013-12-27 株式会社村田製作所 Bonding member
CN102925746B (en) * 2012-11-29 2014-09-17 宁波兴业鑫泰新型电子材料有限公司 High-performance Cu-Ni-Si system copper alloy, and preparation method and processing method thereof
KR101910702B1 (en) * 2013-03-29 2018-10-22 후루카와 덴키 고교 가부시키가이샤 Aluminum alloy wire rod, aluminum alloy twisted wire, coated electric wire, wire harness, and production method for aluminum alloy wire rod
CN103740975A (en) * 2013-12-23 2014-04-23 烟台万隆真空冶金股份有限公司 Copper-nickel-silicon alloy and preparation method thereof
CN103695704A (en) * 2013-12-26 2014-04-02 青岛友铭辰生物技术有限公司 Anti-fatigue copper alloy material for electric and electronic equipment and preparation method of anti-fatigue copper alloy
CN103757479B (en) * 2014-01-10 2016-01-20 滁州学院 A kind of Lead-free environment-friendlycopper-nickel-zinc copper-nickel-zinc alloy material and preparation method thereof
JP6210563B2 (en) * 2015-04-10 2017-10-11 古河電気工業株式会社 Copper alloy wire for spring, method for producing copper alloy wire for spring, spring, and method for producing spring
CN105695797A (en) * 2016-04-20 2016-06-22 苏州市相城区明达复合材料厂 Bronze alloy for casting parts
CN106282657A (en) * 2016-08-31 2017-01-04 裴秀琴 A kind of copper alloy new material
CN107012357B (en) * 2017-03-22 2018-11-06 合肥达户电线电缆科技有限公司 A kind of copper alloy wire and preparation method thereof
RU2691823C1 (en) * 2018-05-14 2019-06-18 Федеральное государственное бюджетное образовательное учреждение высшего образования Балтийский государственный технический университет "ВОЕНМЕХ" им. Д.Ф. Устинова (БГТУ "ВОЕНМЕХ") METHOD OF THERMAL TREATMENT OF BILLET OR ARTICLE (SPRINGS) FROM BRONZE BrNCS 2,5-0,7-0,6
JP6629401B1 (en) * 2018-08-30 2020-01-15 Ｊｘ金属株式会社 Titanium copper plate before aging treatment, pressed product and method for producing pressed product
JP2021098887A (en) * 2019-12-20 2021-07-01 Ｊｘ金属株式会社 Metal powder for lamination molding, and lamination molding made using the metal powder

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20020127133A1 (en) * 2000-07-25 2002-09-12 Takayuki Usami Copper alloy material for parts of electronic and electric machinery and tools
JP2004307905A (en) * 2003-04-03 2004-11-04 Sumitomo Metal Ind Ltd Cu ALLOY, AND ITS PRODUCTION METHOD
JP2004353069A (en) * 2003-05-30 2004-12-16 Nikko Metal Manufacturing Co Ltd Copper alloy for electronic material
US20050263218A1 (en) * 2004-05-27 2005-12-01 The Furukawa Electric Co., Ltd. Copper alloy
EP1873266A1 (en) * 2005-02-28 2008-01-02 The Furukawa Electric Co., Ltd. Copper alloy
JP2008024999A (en) * 2006-07-24 2008-02-07 Dowa Holdings Co Ltd Cu-Ni-Si TYPE COPPER ALLOY SHEET WITH EXCELLENT PROOF STRESS AND BENDABILITY

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3797882B2 (en) * 2001-03-09 2006-07-19 株式会社神戸製鋼所 Copper alloy sheet with excellent bending workability
JP4255330B2 (en) 2003-07-31 2009-04-15 日鉱金属株式会社 Cu-Ni-Si alloy member with excellent fatigue characteristics
JP4959141B2 (en) * 2005-02-28 2012-06-20 Ｄｏｗａホールディングス株式会社 High strength copper alloy
JP2007169764A (en) * 2005-12-26 2007-07-05 Furukawa Electric Co Ltd:The Copper alloy
JP2006200042A (en) * 2006-03-23 2006-08-03 Kobe Steel Ltd Electronic component composed of copper alloy sheet having excellent bending workability
JP4143662B2 (en) * 2006-09-25 2008-09-03 日鉱金属株式会社 Cu-Ni-Si alloy

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20020127133A1 (en) * 2000-07-25 2002-09-12 Takayuki Usami Copper alloy material for parts of electronic and electric machinery and tools
JP2004307905A (en) * 2003-04-03 2004-11-04 Sumitomo Metal Ind Ltd Cu ALLOY, AND ITS PRODUCTION METHOD
JP2004353069A (en) * 2003-05-30 2004-12-16 Nikko Metal Manufacturing Co Ltd Copper alloy for electronic material
US20050263218A1 (en) * 2004-05-27 2005-12-01 The Furukawa Electric Co., Ltd. Copper alloy
EP1873266A1 (en) * 2005-02-28 2008-01-02 The Furukawa Electric Co., Ltd. Copper alloy
JP2008024999A (en) * 2006-07-24 2008-02-07 Dowa Holdings Co Ltd Cu-Ni-Si TYPE COPPER ALLOY SHEET WITH EXCELLENT PROOF STRESS AND BENDABILITY

Also Published As

Publication number Publication date
EP2256219A1 (en) 2010-12-01
WO2009104615A1 (en) 2009-08-27
US20100310413A1 (en) 2010-12-09
JPWO2009104615A1 (en) 2011-06-23
US20110259480A1 (en) 2011-10-27
CN101946014A (en) 2011-01-12

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Legal Events

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PUAI Public reference made under article 153(3) epc to a published international application that has entered the european phase

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Effective date: 20100916

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DAX Request for extension of the european patent (deleted)
A4 Supplementary search report drawn up and despatched

Effective date: 20120531

RIC1 Information provided on ipc code assigned before grant

Ipc: C22C 9/06 20060101AFI20120524BHEP

Ipc: C22F 1/08 20060101ALI20120524BHEP

Ipc: H01B 1/02 20060101ALI20120524BHEP

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Effective date: 20121205