CN102703754B - Cu-Ni-Si-based alloy and preparation method thereof - Google Patents

Cu-Ni-Si-based alloy and preparation method thereof Download PDF

Info

Publication number
CN102703754B
CN102703754B CN201210181988.7A CN201210181988A CN102703754B CN 102703754 B CN102703754 B CN 102703754B CN 201210181988 A CN201210181988 A CN 201210181988A CN 102703754 B CN102703754 B CN 102703754B
Authority
CN
China
Prior art keywords
alloy
conductivity
blank
phase
strength
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN201210181988.7A
Other languages
Chinese (zh)
Other versions
CN102703754A (en
Inventor
阙仲萍
程伟丽
陈津
张金山
林万明
梁伟
丁敏
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Taiyuan University of Technology
Original Assignee
Taiyuan University of Technology
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Taiyuan University of Technology filed Critical Taiyuan University of Technology
Priority to CN201210181988.7A priority Critical patent/CN102703754B/en
Publication of CN102703754A publication Critical patent/CN102703754A/en
Application granted granted Critical
Publication of CN102703754B publication Critical patent/CN102703754B/en
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Abstract

The invention belongs to the technical field of copper alloy material, and discloses Cu-Ni-Si-based alloy with high strength and high conductivity, and a preparation method thereof. The Cu-Ni-Si-based alloy is characterized in that the Cu-Ni-Si-V alloy comprises the following components in weight percent: 95.5-97.5% of Cu, 2.0-3.0% of Ni, 0.5-1.2% of Si, and 0-0.3% of V; and the method comprises specific steps as follows: smelting pure copper, pure silicon, pure nickel and pure vanadium in an induction furnace according to the proportion, casting in a metal die to obtain a blank, and performing ageing and solution treatment for the blank after hot rolling and cold rolling deformation treatment. As shown by experimental results, the added alloy V has the remarkable grain refinement function on the CU-Ni-Si alloy; and appropriately-added V (0.086 weight percent) can significantly improve the conductivity of the alloy, at the same time, the combination properties of the alloy are improved to the conductivity of 60% IACS and the hardness number of 205 Hv from the conductivity of 41.4% IACS and the hardness number of 195.7 Hv only with slight reduction in hardness; and the alloy with 0.086 weight percent V can separate out second phase with a volume fraction twice of that of the alloy before adding V.

Description

A kind of Cu-Ni-Si base Alloy And Preparation Method
Technical field
A kind of high-strength high-conductivity Cu-Ni-Si of the present invention base Alloy And Preparation Method, belong to Cu alloy material technical field, be specifically related to a kind of by adding low-cost alloy element, carry heavy alloyed timeliness power, the tiny second-phase of disperse of timeliness acquisition high-volume fractional reaches the object of precipitation strength and purification matrix at short notice, and combined with fine-grained strengthening obtains the Cu-Ni-Si alloy of high-strength high-conductivity.
Background technology
Because copper alloy has good electroconductibility, cheap price and the good advantages such as processing forming, be widely used as circuit lead frame material.To the nineties in 20th century, the consumption of copper-based lead frame material has accounted for the more than 80% of blaster fuse frame material total flow.Along with unicircuit is to high-density, miniaturization, multifunction development, the intensity to blaster fuse frame material, electrical and thermal conductivity performance requires more and more higher.
Copper alloy with high strength and high conductivity be designed with two kinds of thinkings: the one, add appropriate alloying element strengthening copper matrix to improve intensity, avoid the detrimentally affect to specific conductivity simultaneously as far as possible; The 2nd, introduce second-phase and form matrix material, by complex intensifying, learn from other's strong points to offset one's weaknesses, reach high-strength highly-conductive.The former alloying is one of basic skills of preparing copper alloy with high strength and high conductivity, and its strengthening means are mainly solution strengthening, precipitation strength, refined crystalline strengthening and working hardening.The effect of different elements in copper alloy is different.In general, solid solution element all reduces electric conductivity and the heat conductivility of copper, and wherein P, Fe, Si, As reduce at most, and Be, Al, Sb, Mn, Ni take second place, and Ag, Cr, Cd, Mg, Zn, Zr reduce minimum.
It is not bery remarkable that solution strengthening improves intensity effect, conventionally in conjunction with ageing treatment, improves intensity.Cu-Ni-Si is a kind of ageing strengthening type alloy.It is containing poisonous element beryllium, is that blaster fuse frame material is compared and be there is no magnetic with conventional Cu-Fe, and has caused that with high strength and middle electric conductivity and the cheap advantages such as price people pay close attention to greatly, becomes the most wide blaster fuse frame material of application prospect.Its ageing strengthening ultimate principle is in copper, to add under normal temperature solid solubility minimum, and the great alloying element of solid solubility under high temperature is processed by high temperature solid solution, makes alloying element form supersaturated solid solution in copper matrix.After ageing treatment, supersaturated solid solution decomposes, and alloying element is separated out from copper matrix with precipitated phase, and electric conductivity improves rapidly, and the strengthening effect due to Age-prrcipitation Phase simultaneously keeps higher intensity.Therefore the alloying element of precipitation strength should possess following two conditions: the one, the solid solubility under high temperature and low temperature in copper differs larger so that time usefulness produce abundant strengthening phase; The 2nd, solid solubility during room temperature in copper is minimum, to guarantee the high conductivity of matrix.Yet the Cu-Ni-Si system that has at present ideal performance index and can be applied to (specific conductivity is 60%IACS, hardness value 200Hv) in actual production still fails to obtain.
Summary of the invention
A kind of high-strength and high-conductivity Cu-Ni-Si of the present invention base Alloy And Preparation Method, its object is to provide a kind of interpolation Alloying Element Vanadium V to carry out alloying to Cu-Ni-Si alloy, obtain disperse educt second-phase, and combination deformation and thermal treatment process subsequently, by the net effect of refined crystalline strengthening, solution strengthening and precipitation strength, improve alloy material of intensity and specific conductivity and preparation method thereof simultaneously.
A kind of high-strength and high-conductivity Cu-Ni-Si of the present invention base alloy, it is characterized in that a kind ofly by adding Alloying Element Vanadium V, Cu-Ni-Si alloy being carried out to alloying, carry heavy alloyed timeliness power, the tiny second-phase of disperse of timeliness acquisition high-volume fractional reaches the object of precipitation strength and purification matrix at short notice, and the alloy material of combined with fine-grained strengthening combined with fine-grained strengthening acquisition high-strength high-conductivity, its component of this alloy material and weight percent are: Cu 95.5 ~ 97.5%, Ni 2.0 ~ 3.0%, Si 0.5 ~ 1.2 %, V 0 ~ 0.3%, there is disperse and be distributed in Ni2Si on matrix and (NiV) 2Si wild phase, its specific conductivity is 60%IACS, hardness value 200Hv.
The preparation method of above-mentioned a kind of high-strength and high-conductivity Cu-Ni-Si base alloy, it is characterized in that a kind of employing interpolation alloying element V carries out grain refining, strengthen the Precipitation Kinetics of second-phase to reach precipitation strength and to purify the preparation method that matrix improves intensity and specific conductivity simultaneously, its concrete technology step is:
I, blank preparation: purity is greater than to 99.9% fine copper, pure silicon, pure nickel, pure vanadium by the composition Cu 95.5 ~ 97.5% of following mass percent, Ni 2.0 ~ 3.0%, Si 0.5 ~ 1.2 %, V 0 ~ 0.3% melting in vacuum induction furnace, after treating all raw material meltings, 1200 ~ 1300 ℃ of insulations 15 ~ 20 minutes, to guarantee that all alloying elements dissolve and fully diffusion, and casting acquisition length is 150 ~ 195mm in metal die, wide is 50 ~ 60mm, and height is the rectangle blank of 30mm;
II, deformation process: first blank is carried out under 950 ~ 980oC to homogenizing annealing 2 ~ 4h and process, blank carries out hot rolling under 950 ~ 980oC subsequently, total deformation is 65 ~ 70%, alloy after hot rolling is processed through de-scaling, at room temperature carry out the cold rolling of 8 ~ 10 passages, total deformation is 65 ~ 75%, finally obtains the thin plate that thickness is about 1.5 ~ 3.0mm;
III, thermal treatment: the sheet specimens that the sheet alloy line after deformation process is cut into 2x2cm, carry out solid solution+ageing treatment, solution heat treatment temperature is according to the phase transformation transition point temperature of Pandat 8.0 phase diagram simulation results and differential thermal analyzer mensuration, more than being chosen at single phase region solidus curve, the following temperature range of liquidus line, the solution treatment condition that is applicable to alloy system of the present invention is: 900 ~ 950 ℃ * 2 ~ 4 h, water-cooled, artificial aging system is 350 ~ 500 ℃ * 0.3 ~ 40 h, it is that 2 ~ 4 hours laggard row artificial agings of solution treatment are processed that solution treatment and artificial aging are processed matching principle.
A kind of high-strength and high-conductivity Cu-Ni-Si of the present invention base Alloy And Preparation Method, its advantage is:
I, compare with existing high-strength high-conductivity copper alloy, the present invention adopts interpolation alloying element V to carry out grain refining, strengthen the Precipitation Kinetics of second-phase to reach precipitation strength and to purify the means that matrix improves specific conductivity, make Cu-Ni-Si base alloy of the present invention there is higher-strength and electroconductibility simultaneously, specific conductivity is 60 %IACS, hardness value 200Hv homogeneous microstructure and containing poisonous element, the excellent properties of this series alloy has broad application prospects in blaster fuse frame material field.
II, alloy compositions of the present invention is reasonable, alloying level is high, production technique is simple, production cost is low, alloy conductive rate is high, intensity is high, be suitable for suitability for industrialized production.
III, the present invention to meet along with China's electronic industry fast development bring to the ever-increasing demand of copper alloy lead wire frame, and the problem that solves blaster fuse frame material dependence on import has important meaning.
Accompanying drawing explanation
Fig. 1 is the TEM light field phase of high-strength high-conductivity Cu-Ni-Si base alloy
Specific conductivity after Fig. 2 Cu-2.8Ni-0.7Si-0V alloy aging and hardness value (comparative example)
Specific conductivity after Fig. 3 Cu-2.8Ni-0.7Si-0.1V alloy aging and hardness value (embodiment 1)
Specific conductivity after Fig. 4 Cu-2.8Ni-0.7Si-0.2V alloy aging and hardness value (embodiment 2).
Embodiment
Embodiment 1
High-strength and high-conductivity Cu-Ni-Si base alloy, comprises Cu, Ni, Si, V, and its proportioning (mass percent) is: Ni:2.8%, and Si:0.7%, V:0.1%, all the other are Cu.
Step 1, blank preparation: purity is greater than to 99.9% fine copper, pure silicon, pure nickel, pure vanadium by the composition Cu 95.5 ~ 97.5% of following mass percent, Ni 2.0 ~ 3.0%, Si 0.5 ~ 1.2 %, V 0 ~ 0.3% melting in vacuum induction furnace, after treating all raw material meltings, 1250 ℃ of insulations 20 minutes, to guarantee that all alloying elements dissolve and abundant diffusion, and casting obtained the long 190mm of being in metal die, wide is 55mm, and height is the rectangle blank of 30mm;
Step 2, deformation process: first blank is carried out under 980oC to homogenizing annealing 2h processing.Blank carries out hot rolling under 980oC subsequently, and total deformation is 70%.Alloy after hot rolling is processed through de-scaling, and at room temperature carrying out total deformation is 75%(10 passage) cold rolling, finally obtain the thin plate that thickness is about 2.0mm.
Step 3, thermal treatment: the sheet specimens that the sheet alloy line after deformation process is cut into 2 * 2cm.And all samples are divided into two groups, one group is carried out solid solution+ageing treatment; Other one group is directly carried out ageing treatment.Solution heat treatment temperature is according to the phase transformation transition point temperature of Pandat 8.0 phase diagram simulation results and differential thermal analyzer mensuration, more than being chosen at single phase region solidus curve, the following temperature range of liquidus line, the solution treatment condition that is applicable to alloy system of the present invention is: 950 ℃ * 2 h, water-cooled, artificial aging system is 350 ~ 500 ℃ * 0.3 ~ 40 h, and it is that 2 hours laggard row artificial agings of solution treatment are processed that solution treatment and artificial aging are processed matching principle.Obtain best over-all properties: specific conductivity is 60%IACS, hardness is 205Hv.Average grain size is 15 μ m.
Embodiment 2
The per-cent of different with embodiment 1 is V in alloying constituent proportioning brings up to 0.2%.Other are identical with technique 1.The concrete composition proportion of alloy and mechanical property are in Table 1.This alloy has best over-all properties after testing: specific conductivity is 50%IACS, and hardness is 200Hv.Average grain size is 10 μ m.
Comparative example
Step 1, blank preparation: purity is greater than to 99.9% fine copper, pure silicon, pure nickel, pure vanadium by the composition Cu 95.5 ~ 97.5% of following mass percent, Ni 2.0 ~ 3.0%, Si 0.5 ~ 1.2 % melting in vacuum induction furnace, after treating all raw material meltings, 1250 ℃ of insulations 20 minutes, to guarantee that all alloying elements dissolve and fully diffusion, and casting obtains the long 190mm of being in metal die, wide is 56mm, and height is the rectangle blank of 30mm;
Step 2, deformation process: first blank is carried out under 980oC to homogenizing annealing 2h processing.Blank carries out hot rolling under 980oC subsequently, and total deformation is 70%.Alloy after hot rolling is processed through de-scaling, and at room temperature carrying out total deformation is 75%(10 passage) cold rolling, finally obtain the thin plate that thickness is about 2.0 mm.
Step 3, thermal treatment: the sheet specimens that the sheet alloy line after deformation process is cut into 2 * 2cm.Carry out subsequently solid solution+ageing treatment.Solution heat treatment temperature is according to the phase transformation transition point temperature of Pandat 8.0 phase diagram simulation results and differential thermal analyzer mensuration, more than being chosen at single phase region solidus curve, the following temperature range of liquidus line, the solution treatment condition that is applicable to alloy system of the present invention is: 950 ℃ * 2 h, water-cooled, artificial aging system is 350 ~ 500 ℃ * 0.3 ~ 40 h, and it is that 2 hours laggard row artificial agings of solution treatment are processed that solution treatment and artificial aging are processed matching principle.Obtain best over-all properties: specific conductivity is 41.4 %IACS, hardness is 195.7 Hv.Average grain size is 35 μ m.
Alloy property is in Table 1.
Composition and the mechanical property of table 1 high-strength and high-conductivity Cu-Ni-Si base alloy
Figure 671871DEST_PATH_IMAGE002

Claims (2)

1. a high-strength and high-conductivity Cu-Ni-Si base alloy, it is characterized in that a kind ofly by adding Alloying Element Vanadium V, Cu-Ni-Si alloy being carried out to alloying, carry heavy alloyed timeliness power, the tiny second-phase of disperse of timeliness acquisition high-volume fractional reaches the object of precipitation strength and purification matrix at short notice, and combined with fine-grained strengthening obtains the alloy material of high-strength high-conductivity, its component of this alloy material and weight percent are: Cu 95.5 ~ 97.5%, Ni 2.0 ~ 3.0%, Si 0.5 ~ 1.2 %, V 0.05 ~ 0.15%, said components sum is 100%, there is disperse and be distributed in the Ni on matrix 2si and (NiV) 2si wild phase, its specific conductivity is 60%IACS, hardness value 200Hv.
2. the preparation method of a kind of high-strength and high-conductivity Cu-Ni-Si base alloy claimed in claim 1, it is characterized in that a kind of employing interpolation alloying element V carries out grain refining, strengthen the Precipitation Kinetics of second-phase to reach precipitation strength and to purify the preparation method that matrix improves intensity and specific conductivity simultaneously, its concrete technology step is:
I, blank preparation:purity is greater than to 99.9% fine copper, pure silicon, pure nickel, pure vanadium by the composition Cu 95.5 ~ 97.5% of following mass percent, Ni 2.0 ~ 3.0%, Si 0.5 ~ 1.2 %, V 0.05 ~ 0.15% melting in vacuum induction furnace, after treating all raw material meltings, 1200 ~ 1300 ℃ of insulations 15 ~ 20 minutes, to guarantee that all alloying elements dissolve and fully diffusion, and casting acquisition length is 150 ~ 195mm in metal die, wide is 50 ~ 60mm, and height is the rectangle blank of 30mm;
Figure 225292DEST_PATH_IMAGE001
: blank is carried out at 950 ~ 980 ℃ to homogenizing annealing 2 ~ 4h and process, blank carries out hot rolling at 950 ~ 980 ℃ subsequently, total deformation is 65 ~ 70%, alloy after hot rolling is processed through de-scaling, at room temperature carry out the cold rolling of 8 ~ 10 passages, total deformation is 65 ~ 75%, finally obtains the thin plate that thickness is 1.5 ~ 3.0 mm;
iII, thermal treatment: the sheet specimens that the sheet alloy line after deformation process is cut into 2x2cm, carry out solid solution+ageing treatment, solution heat treatment temperature is according to the phase transformation transition point temperature of Pandat 8.0 phase diagram simulation results and differential thermal analyzer mensuration, more than being chosen at single phase region solidus curve, the following temperature range of liquidus line, the solution treatment condition that is applicable to this alloy system is: 900 ~ 950 ℃ * 2 ~ 4 h, water-cooled, artificial aging system is 350 ~ 500 ℃ * 0.3 ~ 40 h, and it is that 2 ~ 4 hours laggard row artificial agings of solution treatment are processed that solution treatment and artificial aging are processed matching principle.
CN201210181988.7A 2012-06-05 2012-06-05 Cu-Ni-Si-based alloy and preparation method thereof Expired - Fee Related CN102703754B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201210181988.7A CN102703754B (en) 2012-06-05 2012-06-05 Cu-Ni-Si-based alloy and preparation method thereof

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201210181988.7A CN102703754B (en) 2012-06-05 2012-06-05 Cu-Ni-Si-based alloy and preparation method thereof

Publications (2)

Publication Number Publication Date
CN102703754A CN102703754A (en) 2012-10-03
CN102703754B true CN102703754B (en) 2014-03-26

Family

ID=46896799

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201210181988.7A Expired - Fee Related CN102703754B (en) 2012-06-05 2012-06-05 Cu-Ni-Si-based alloy and preparation method thereof

Country Status (1)

Country Link
CN (1) CN102703754B (en)

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103643080A (en) * 2013-12-25 2014-03-19 海门市江滨永久铜管有限公司 High-strength, high-ductility and high-conductivity copper-nickel-silicon alloy bar and production method thereof
CN103898353A (en) * 2014-04-02 2014-07-02 太原理工大学 Copper alloy with high strength and high conductivity and preparation method thereof
CN106498386A (en) * 2016-11-04 2017-03-15 上海工程技术大学 A kind of laser melting coating copper surface composite coating and preparation method thereof
CN109079116A (en) * 2018-07-10 2018-12-25 浙江力博实业股份有限公司 A kind of preparation method of electrode material corson alloy
CN109943750B (en) * 2019-03-25 2020-09-08 中南大学 Ultrahigh-strength high-elasticity copper-nickel-manganese alloy and preparation method thereof
CN111020285B (en) * 2019-12-19 2021-08-06 江苏隆达超合金股份有限公司 Method for producing large-size high-strength copper alloy cast ingot by vacuum melting
CN112195362A (en) * 2020-09-17 2021-01-08 宝钛集团有限公司 Preparation method of white copper strip for heat exchange of ship engine
CN113046594B (en) * 2021-03-11 2022-03-18 郑州大学 High-strength high-thermal-conductivity copper alloy material roller sleeve and preparation method thereof
CN113699401A (en) * 2021-08-31 2021-11-26 山西春雷铜材有限责任公司 Preparation method of high-strength high-bending copper-nickel-silicon alloy strip
CN114293064B (en) * 2022-03-09 2022-07-26 北京科技大学 High-strength high-conductivity high-temperature-resistant Cu-Cr-Nb alloy and preparation method thereof
CN114752810B (en) * 2022-03-24 2023-04-11 江苏恒盈电子科技有限公司 High-strength semiconductor lead frame for circuit board and preparation method thereof
CN115029581B (en) * 2022-06-10 2022-12-09 中铁建电气化局集团轨道交通器材有限公司 Silicon bronze forging and integral forging and pressing and heat treatment method without internal stress
CN115109964B (en) * 2022-07-06 2024-01-05 中铝科学技术研究院有限公司 High-strength conductive high-temperature softening resistant Cu-Ni-Si alloy and preparation method thereof
CN115505784B (en) * 2022-10-17 2023-04-21 东南大学 High-copper eutectic multi-principal element alloy and preparation method thereof

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101946014A (en) * 2008-02-18 2011-01-12 古河电气工业株式会社 Copper alloy material

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3824884B2 (en) * 2001-05-17 2006-09-20 古河電気工業株式会社 Copper alloy material for terminals or connectors

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101946014A (en) * 2008-02-18 2011-01-12 古河电气工业株式会社 Copper alloy material

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
JP特开2002-339029A 2002.11.27

Also Published As

Publication number Publication date
CN102703754A (en) 2012-10-03

Similar Documents

Publication Publication Date Title
CN102703754B (en) Cu-Ni-Si-based alloy and preparation method thereof
CN106636734B (en) High-intensitive, highly conductive, high resistance to stress relaxation copper alloy elastic material and preparation method thereof
CN101418401B (en) Al-Er alloy conductor material and preparation method thereof
CN103898425B (en) A kind of compound deformation heat treatment method suitable in Cu-Cr-Zr system alloy wire
CN103388090B (en) A kind of high-strength, high connductivity, deep drawing quality rare-earth copper alloy and preparation method thereof
CN104946936B (en) A kind of aerial condutor high conductivity rare earth duralumin monofilament material
CN105568047B (en) High strength and high flexibility high-conductivity copper alloy
CN102912178B (en) A kind of high-strength highly-conductive rare-earth copper alloy and preparation method thereof
CN106399749A (en) High strength and high elasticity copper, nickel and silicon system alloy material and preparation method thereof
CN103382535B (en) A kind of high-strength, high connductivity, deep drawing quality copper alloy and preparation method thereof
CN102560191A (en) High-performance elastic copper alloy and preparation and processing method thereof
CN103898353A (en) Copper alloy with high strength and high conductivity and preparation method thereof
CN109930026B (en) High-strength high-conductivity stress relaxation-resistant copper alloy lead frame material and preparation method thereof
CN103339273A (en) Cu-si-co-base copper alloy for electronic materials and method for producing same
CN101709401A (en) Cu-Cr in-situ composite with boron, silver and rare earth elements added and preparation method thereof
CN103421984A (en) Ultrahigh-strength CuNiAl elastic copper alloy materials and manufacturing method thereof
CN113106286B (en) High-conductivity beryllium copper alloy rod for 5G communication and preparation process thereof
JP2017179502A (en) Copper alloy sheet excellent in strength and conductivity
CN111304489B (en) Preparation and processing method of copper alloy plate strip for vapor chamber
CN102864326A (en) High-conduction copper alloy material
CN102041407B (en) High-strength high-conductivity micro-boron copper alloy material and preparation method thereof
CN115652132A (en) Copper alloy material and application and preparation method thereof
JP2956696B1 (en) High strength and high conductivity copper alloy and its processing method
CN102851528A (en) High-conductivity copper alloy
CN110983101A (en) High-yield high-ductility medium-high-entropy alloy and preparation method thereof

Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
GR01 Patent grant
GR01 Patent grant
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20140326

Termination date: 20150605

EXPY Termination of patent right or utility model