CN102703754B - Cu-Ni-Si-based alloy and preparation method thereof - Google Patents
Cu-Ni-Si-based alloy and preparation method thereof Download PDFInfo
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- CN102703754B CN102703754B CN201210181988.7A CN201210181988A CN102703754B CN 102703754 B CN102703754 B CN 102703754B CN 201210181988 A CN201210181988 A CN 201210181988A CN 102703754 B CN102703754 B CN 102703754B
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Abstract
The invention belongs to the technical field of copper alloy material, and discloses Cu-Ni-Si-based alloy with high strength and high conductivity, and a preparation method thereof. The Cu-Ni-Si-based alloy is characterized in that the Cu-Ni-Si-V alloy comprises the following components in weight percent: 95.5-97.5% of Cu, 2.0-3.0% of Ni, 0.5-1.2% of Si, and 0-0.3% of V; and the method comprises specific steps as follows: smelting pure copper, pure silicon, pure nickel and pure vanadium in an induction furnace according to the proportion, casting in a metal die to obtain a blank, and performing ageing and solution treatment for the blank after hot rolling and cold rolling deformation treatment. As shown by experimental results, the added alloy V has the remarkable grain refinement function on the CU-Ni-Si alloy; and appropriately-added V (0.086 weight percent) can significantly improve the conductivity of the alloy, at the same time, the combination properties of the alloy are improved to the conductivity of 60% IACS and the hardness number of 205 Hv from the conductivity of 41.4% IACS and the hardness number of 195.7 Hv only with slight reduction in hardness; and the alloy with 0.086 weight percent V can separate out second phase with a volume fraction twice of that of the alloy before adding V.
Description
Technical field
A kind of high-strength high-conductivity Cu-Ni-Si of the present invention base Alloy And Preparation Method, belong to Cu alloy material technical field, be specifically related to a kind of by adding low-cost alloy element, carry heavy alloyed timeliness power, the tiny second-phase of disperse of timeliness acquisition high-volume fractional reaches the object of precipitation strength and purification matrix at short notice, and combined with fine-grained strengthening obtains the Cu-Ni-Si alloy of high-strength high-conductivity.
Background technology
Because copper alloy has good electroconductibility, cheap price and the good advantages such as processing forming, be widely used as circuit lead frame material.To the nineties in 20th century, the consumption of copper-based lead frame material has accounted for the more than 80% of blaster fuse frame material total flow.Along with unicircuit is to high-density, miniaturization, multifunction development, the intensity to blaster fuse frame material, electrical and thermal conductivity performance requires more and more higher.
Copper alloy with high strength and high conductivity be designed with two kinds of thinkings: the one, add appropriate alloying element strengthening copper matrix to improve intensity, avoid the detrimentally affect to specific conductivity simultaneously as far as possible; The 2nd, introduce second-phase and form matrix material, by complex intensifying, learn from other's strong points to offset one's weaknesses, reach high-strength highly-conductive.The former alloying is one of basic skills of preparing copper alloy with high strength and high conductivity, and its strengthening means are mainly solution strengthening, precipitation strength, refined crystalline strengthening and working hardening.The effect of different elements in copper alloy is different.In general, solid solution element all reduces electric conductivity and the heat conductivility of copper, and wherein P, Fe, Si, As reduce at most, and Be, Al, Sb, Mn, Ni take second place, and Ag, Cr, Cd, Mg, Zn, Zr reduce minimum.
It is not bery remarkable that solution strengthening improves intensity effect, conventionally in conjunction with ageing treatment, improves intensity.Cu-Ni-Si is a kind of ageing strengthening type alloy.It is containing poisonous element beryllium, is that blaster fuse frame material is compared and be there is no magnetic with conventional Cu-Fe, and has caused that with high strength and middle electric conductivity and the cheap advantages such as price people pay close attention to greatly, becomes the most wide blaster fuse frame material of application prospect.Its ageing strengthening ultimate principle is in copper, to add under normal temperature solid solubility minimum, and the great alloying element of solid solubility under high temperature is processed by high temperature solid solution, makes alloying element form supersaturated solid solution in copper matrix.After ageing treatment, supersaturated solid solution decomposes, and alloying element is separated out from copper matrix with precipitated phase, and electric conductivity improves rapidly, and the strengthening effect due to Age-prrcipitation Phase simultaneously keeps higher intensity.Therefore the alloying element of precipitation strength should possess following two conditions: the one, the solid solubility under high temperature and low temperature in copper differs larger so that time usefulness produce abundant strengthening phase; The 2nd, solid solubility during room temperature in copper is minimum, to guarantee the high conductivity of matrix.Yet the Cu-Ni-Si system that has at present ideal performance index and can be applied to (specific conductivity is 60%IACS, hardness value 200Hv) in actual production still fails to obtain.
Summary of the invention
A kind of high-strength and high-conductivity Cu-Ni-Si of the present invention base Alloy And Preparation Method, its object is to provide a kind of interpolation Alloying Element Vanadium V to carry out alloying to Cu-Ni-Si alloy, obtain disperse educt second-phase, and combination deformation and thermal treatment process subsequently, by the net effect of refined crystalline strengthening, solution strengthening and precipitation strength, improve alloy material of intensity and specific conductivity and preparation method thereof simultaneously.
A kind of high-strength and high-conductivity Cu-Ni-Si of the present invention base alloy, it is characterized in that a kind ofly by adding Alloying Element Vanadium V, Cu-Ni-Si alloy being carried out to alloying, carry heavy alloyed timeliness power, the tiny second-phase of disperse of timeliness acquisition high-volume fractional reaches the object of precipitation strength and purification matrix at short notice, and the alloy material of combined with fine-grained strengthening combined with fine-grained strengthening acquisition high-strength high-conductivity, its component of this alloy material and weight percent are: Cu 95.5 ~ 97.5%, Ni 2.0 ~ 3.0%, Si 0.5 ~ 1.2 %, V 0 ~ 0.3%, there is disperse and be distributed in Ni2Si on matrix and (NiV) 2Si wild phase, its specific conductivity is 60%IACS, hardness value 200Hv.
The preparation method of above-mentioned a kind of high-strength and high-conductivity Cu-Ni-Si base alloy, it is characterized in that a kind of employing interpolation alloying element V carries out grain refining, strengthen the Precipitation Kinetics of second-phase to reach precipitation strength and to purify the preparation method that matrix improves intensity and specific conductivity simultaneously, its concrete technology step is:
I, blank preparation: purity is greater than to 99.9% fine copper, pure silicon, pure nickel, pure vanadium by the composition Cu 95.5 ~ 97.5% of following mass percent, Ni 2.0 ~ 3.0%, Si 0.5 ~ 1.2 %, V 0 ~ 0.3% melting in vacuum induction furnace, after treating all raw material meltings, 1200 ~ 1300 ℃ of insulations 15 ~ 20 minutes, to guarantee that all alloying elements dissolve and fully diffusion, and casting acquisition length is 150 ~ 195mm in metal die, wide is 50 ~ 60mm, and height is the rectangle blank of 30mm;
II, deformation process: first blank is carried out under 950 ~ 980oC to homogenizing annealing 2 ~ 4h and process, blank carries out hot rolling under 950 ~ 980oC subsequently, total deformation is 65 ~ 70%, alloy after hot rolling is processed through de-scaling, at room temperature carry out the cold rolling of 8 ~ 10 passages, total deformation is 65 ~ 75%, finally obtains the thin plate that thickness is about 1.5 ~ 3.0mm;
III, thermal treatment: the sheet specimens that the sheet alloy line after deformation process is cut into 2x2cm, carry out solid solution+ageing treatment, solution heat treatment temperature is according to the phase transformation transition point temperature of Pandat 8.0 phase diagram simulation results and differential thermal analyzer mensuration, more than being chosen at single phase region solidus curve, the following temperature range of liquidus line, the solution treatment condition that is applicable to alloy system of the present invention is: 900 ~ 950 ℃ * 2 ~ 4 h, water-cooled, artificial aging system is 350 ~ 500 ℃ * 0.3 ~ 40 h, it is that 2 ~ 4 hours laggard row artificial agings of solution treatment are processed that solution treatment and artificial aging are processed matching principle.
A kind of high-strength and high-conductivity Cu-Ni-Si of the present invention base Alloy And Preparation Method, its advantage is:
I, compare with existing high-strength high-conductivity copper alloy, the present invention adopts interpolation alloying element V to carry out grain refining, strengthen the Precipitation Kinetics of second-phase to reach precipitation strength and to purify the means that matrix improves specific conductivity, make Cu-Ni-Si base alloy of the present invention there is higher-strength and electroconductibility simultaneously, specific conductivity is 60 %IACS, hardness value 200Hv homogeneous microstructure and containing poisonous element, the excellent properties of this series alloy has broad application prospects in blaster fuse frame material field.
II, alloy compositions of the present invention is reasonable, alloying level is high, production technique is simple, production cost is low, alloy conductive rate is high, intensity is high, be suitable for suitability for industrialized production.
III, the present invention to meet along with China's electronic industry fast development bring to the ever-increasing demand of copper alloy lead wire frame, and the problem that solves blaster fuse frame material dependence on import has important meaning.
Accompanying drawing explanation
Fig. 1 is the TEM light field phase of high-strength high-conductivity Cu-Ni-Si base alloy
Specific conductivity after Fig. 2 Cu-2.8Ni-0.7Si-0V alloy aging and hardness value (comparative example)
Specific conductivity after Fig. 3 Cu-2.8Ni-0.7Si-0.1V alloy aging and hardness value (embodiment 1)
Specific conductivity after Fig. 4 Cu-2.8Ni-0.7Si-0.2V alloy aging and hardness value (embodiment 2).
Embodiment
Embodiment 1
High-strength and high-conductivity Cu-Ni-Si base alloy, comprises Cu, Ni, Si, V, and its proportioning (mass percent) is: Ni:2.8%, and Si:0.7%, V:0.1%, all the other are Cu.
Step 1, blank preparation: purity is greater than to 99.9% fine copper, pure silicon, pure nickel, pure vanadium by the composition Cu 95.5 ~ 97.5% of following mass percent, Ni 2.0 ~ 3.0%, Si 0.5 ~ 1.2 %, V 0 ~ 0.3% melting in vacuum induction furnace, after treating all raw material meltings, 1250 ℃ of insulations 20 minutes, to guarantee that all alloying elements dissolve and abundant diffusion, and casting obtained the long 190mm of being in metal die, wide is 55mm, and height is the rectangle blank of 30mm;
Step 2, deformation process: first blank is carried out under 980oC to homogenizing annealing 2h processing.Blank carries out hot rolling under 980oC subsequently, and total deformation is 70%.Alloy after hot rolling is processed through de-scaling, and at room temperature carrying out total deformation is 75%(10 passage) cold rolling, finally obtain the thin plate that thickness is about 2.0mm.
Step 3, thermal treatment: the sheet specimens that the sheet alloy line after deformation process is cut into 2 * 2cm.And all samples are divided into two groups, one group is carried out solid solution+ageing treatment; Other one group is directly carried out ageing treatment.Solution heat treatment temperature is according to the phase transformation transition point temperature of Pandat 8.0 phase diagram simulation results and differential thermal analyzer mensuration, more than being chosen at single phase region solidus curve, the following temperature range of liquidus line, the solution treatment condition that is applicable to alloy system of the present invention is: 950 ℃ * 2 h, water-cooled, artificial aging system is 350 ~ 500 ℃ * 0.3 ~ 40 h, and it is that 2 hours laggard row artificial agings of solution treatment are processed that solution treatment and artificial aging are processed matching principle.Obtain best over-all properties: specific conductivity is 60%IACS, hardness is 205Hv.Average grain size is 15 μ m.
Embodiment 2
The per-cent of different with embodiment 1 is V in alloying constituent proportioning brings up to 0.2%.Other are identical with technique 1.The concrete composition proportion of alloy and mechanical property are in Table 1.This alloy has best over-all properties after testing: specific conductivity is 50%IACS, and hardness is 200Hv.Average grain size is 10 μ m.
Comparative example
Step 1, blank preparation: purity is greater than to 99.9% fine copper, pure silicon, pure nickel, pure vanadium by the composition Cu 95.5 ~ 97.5% of following mass percent, Ni 2.0 ~ 3.0%, Si 0.5 ~ 1.2 % melting in vacuum induction furnace, after treating all raw material meltings, 1250 ℃ of insulations 20 minutes, to guarantee that all alloying elements dissolve and fully diffusion, and casting obtains the long 190mm of being in metal die, wide is 56mm, and height is the rectangle blank of 30mm;
Step 2, deformation process: first blank is carried out under 980oC to homogenizing annealing 2h processing.Blank carries out hot rolling under 980oC subsequently, and total deformation is 70%.Alloy after hot rolling is processed through de-scaling, and at room temperature carrying out total deformation is 75%(10 passage) cold rolling, finally obtain the thin plate that thickness is about 2.0 mm.
Step 3, thermal treatment: the sheet specimens that the sheet alloy line after deformation process is cut into 2 * 2cm.Carry out subsequently solid solution+ageing treatment.Solution heat treatment temperature is according to the phase transformation transition point temperature of Pandat 8.0 phase diagram simulation results and differential thermal analyzer mensuration, more than being chosen at single phase region solidus curve, the following temperature range of liquidus line, the solution treatment condition that is applicable to alloy system of the present invention is: 950 ℃ * 2 h, water-cooled, artificial aging system is 350 ~ 500 ℃ * 0.3 ~ 40 h, and it is that 2 hours laggard row artificial agings of solution treatment are processed that solution treatment and artificial aging are processed matching principle.Obtain best over-all properties: specific conductivity is 41.4 %IACS, hardness is 195.7 Hv.Average grain size is 35 μ m.
Alloy property is in Table 1.
Composition and the mechanical property of table 1 high-strength and high-conductivity Cu-Ni-Si base alloy
Claims (2)
1. a high-strength and high-conductivity Cu-Ni-Si base alloy, it is characterized in that a kind ofly by adding Alloying Element Vanadium V, Cu-Ni-Si alloy being carried out to alloying, carry heavy alloyed timeliness power, the tiny second-phase of disperse of timeliness acquisition high-volume fractional reaches the object of precipitation strength and purification matrix at short notice, and combined with fine-grained strengthening obtains the alloy material of high-strength high-conductivity, its component of this alloy material and weight percent are: Cu 95.5 ~ 97.5%, Ni 2.0 ~ 3.0%, Si 0.5 ~ 1.2 %, V 0.05 ~ 0.15%, said components sum is 100%, there is disperse and be distributed in the Ni on matrix
2si and (NiV)
2si wild phase, its specific conductivity is 60%IACS, hardness value 200Hv.
2. the preparation method of a kind of high-strength and high-conductivity Cu-Ni-Si base alloy claimed in claim 1, it is characterized in that a kind of employing interpolation alloying element V carries out grain refining, strengthen the Precipitation Kinetics of second-phase to reach precipitation strength and to purify the preparation method that matrix improves intensity and specific conductivity simultaneously, its concrete technology step is:
I,
blank preparation:purity is greater than to 99.9% fine copper, pure silicon, pure nickel, pure vanadium by the composition Cu 95.5 ~ 97.5% of following mass percent, Ni 2.0 ~ 3.0%, Si 0.5 ~ 1.2 %, V 0.05 ~ 0.15% melting in vacuum induction furnace, after treating all raw material meltings, 1200 ~ 1300 ℃ of insulations 15 ~ 20 minutes, to guarantee that all alloying elements dissolve and fully diffusion, and casting acquisition length is 150 ~ 195mm in metal die, wide is 50 ~ 60mm, and height is the rectangle blank of 30mm;
: blank is carried out at 950 ~ 980 ℃ to homogenizing annealing 2 ~ 4h and process, blank carries out hot rolling at 950 ~ 980 ℃ subsequently, total deformation is 65 ~ 70%, alloy after hot rolling is processed through de-scaling, at room temperature carry out the cold rolling of 8 ~ 10 passages, total deformation is 65 ~ 75%, finally obtains the thin plate that thickness is 1.5 ~ 3.0 mm;
iII, thermal treatment: the sheet specimens that the sheet alloy line after deformation process is cut into 2x2cm, carry out solid solution+ageing treatment, solution heat treatment temperature is according to the phase transformation transition point temperature of Pandat 8.0 phase diagram simulation results and differential thermal analyzer mensuration, more than being chosen at single phase region solidus curve, the following temperature range of liquidus line, the solution treatment condition that is applicable to this alloy system is: 900 ~ 950 ℃ * 2 ~ 4 h, water-cooled, artificial aging system is 350 ~ 500 ℃ * 0.3 ~ 40 h, and it is that 2 ~ 4 hours laggard row artificial agings of solution treatment are processed that solution treatment and artificial aging are processed matching principle.
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