CN109930026B - High-strength high-conductivity stress relaxation-resistant copper alloy lead frame material and preparation method thereof - Google Patents

High-strength high-conductivity stress relaxation-resistant copper alloy lead frame material and preparation method thereof Download PDF

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CN109930026B
CN109930026B CN201711365943.4A CN201711365943A CN109930026B CN 109930026 B CN109930026 B CN 109930026B CN 201711365943 A CN201711365943 A CN 201711365943A CN 109930026 B CN109930026 B CN 109930026B
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lead frame
strength
stress relaxation
rolling
conductivity
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CN109930026A (en
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尹向前
彭丽军
杨振
黄国杰
解浩峰
冯雪
高宝东
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GRIMN Engineering Technology Research Institute Co Ltd
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Abstract

The invention relates to a high-strength high-conductivity stress relaxation-resistant copper alloy lead frame material and a preparation method thereof, belonging to the field of nonferrous metal processing. The material comprises the following components in percentage by weight: 3.0-4.0% of Ni, 0.3-0.5% of P, 0.2-0.4% of Si, 0.03-0.1% of Sn, 0.5-1% of Fe, 0.05-0.2% of Co and the balance of Cu. The alloy is obtained by processing treatment such as smelting and casting, hot rolling, rough rolling, intermediate annealing, acid washing, intermediate rolling, solution treatment, acid washing, finish rolling, aging treatment and the like. The lead frame material has the tensile strength of 700-850 MPa, the conductivity of 40-50% IACS, the elongation of 6-10% and the stress relaxation resistance of 88-92%, has the characteristics of high strength, high conductivity and high stress relaxation resistance, and can meet the use requirements of large-scale integrated circuits on medium-high-end lead frame materials.

Description

High-strength high-conductivity stress relaxation-resistant copper alloy lead frame material and preparation method thereof
Technical Field
The invention relates to a high-strength high-conductivity stress relaxation-resistant copper alloy lead frame material and a preparation method thereof, belonging to the field of nonferrous metal processing.
Background
The core component of modern electronic information technology is an integrated circuit, which is mainly formed by packaging a chip and a lead frame, wherein the lead frame mainly plays roles of supporting the chip, protecting internal elements, connecting external circuits and dissipating element heat outwards, and is a key material in the integrated circuit. With the rapid development of high and new technologies of electronic information, products develop to be micro, thin, light, multifunctional and intelligent, and integrated circuits are promoted to develop to be large-scale, super-large and extremely large-scale. Therefore, the lead frame material is developed to have a finer lead pitch and a higher lead count. This places greater demands not only on the strength and conductivity of the lead frame material, but also on the processability of the material, especially with greater attention to the softening temperature resistance and stress relaxation resistance of the material.
At present, copper-based lead frames mainly comprise several alloys such as C19210, C19400 and C70250 in domestic markets, and the strength and the conductivity of the C19210 and C19400 alloy cannot meet the strength and multi-pin development requirements of ultra-large-scale integrated circuits, so that the copper-based lead frames are mainly applied to middle and low-end lead frame materials. The C70250 alloy is a high-end lead frame material for integrated circuits, the conductivity of the lead frame material is about 45 percent IACS, and the tensile strength of the lead frame material is more than 600 MPa; however, in the production process of the alloy, a special quenching aging process and equipment are needed, the production process is complex, the production cost is high, and the domestic product can only meet the use requirements of middle and low-end customers at present, so that the industrialization and the application of the alloy are influenced.
Disclosure of Invention
The invention mainly aims to make up the performance deficiency of the existing copper alloy, develop a high-strength high-conductivity and stress relaxation resistant copper alloy material and provide a preparation method with simple production process and convenient operation, and meet the use requirement of a super-large scale or super-large scale integrated circuit on a lead frame material.
In order to achieve the above object, the present invention is realized by:
a high-strength high-conductivity and stress relaxation resistant copper alloy lead frame material comprises the following components in percentage by weight: 3.0-4.0% of Ni, 0.3-0.5% of P, 0.2-0.4% of Si, 0.03-0.1% of Sn, 0.5-1% of Fe, 0.05-0.2% of Co and the balance of Cu.
Preferably, the high-strength high-conductivity and stress relaxation resistant copper alloy lead frame material comprises the following components in percentage by weight: 3.3 to 3.7 percent of Ni, 0.4 to 0.5 percent of P, 0.2 to 0.3 percent of Si, 0.05 to 0.08 percent of Sn, 0.8 to 1 percent of Fe, 0.1 to 0.15 percent of Co and the balance of Cu.
The function of the added alloy elements is as follows:
nickel: the nickel element mainly forms a nickel-phosphorus precipitated phase, a nickel-silicon precipitated phase and a nickel-tin precipitated phase with phosphorus, tin and silicon elements, so that the strength, the electric conduction and the stress relaxation resistance of the alloy are obviously improved.
Tin: the addition of tin can form a nickel-tin precipitate phase with nickel. In addition, because the radius difference between tin atoms and copper atoms is large, a small amount of tin element is added into the copper alloy, so that large lattice distortion can be caused, the movement of dislocation can be effectively hindered, and particularly, the dislocation can be effectively dragged in the stress relaxation process of the alloy, so that the stress relaxation resistance of the alloy is improved.
Phosphorus: the combination of phosphorus and nickel element forms nickel-phosphorus compound, which can effectively block the movement of dislocation and improve the stress relaxation resistance of alloy. Simultaneously can react with oxygen to play a role in removing oxygen
Silicon: the addition of the silicon element can promote the precipitation of alloy elements, inhibit the growth of precipitated phases and improve the strength and the stress relaxation resistance of the alloy.
Iron: the iron element and phosphorus can form an iron-phosphorus precipitated phase, so that the strength and the conductivity of the alloy are improved, the precipitation of other precipitated phases can be promoted, and the stress corrosion resistance sensitivity of the alloy is improved.
Cobalt: the addition of the cobalt element can promote the desolventizing of the nickel element in the copper matrix and effectively and synergistically control the precipitation and growth of a precipitated phase.
The invention also aims to provide a preparation and processing method of the high-strength high-conductivity stress relaxation resistant copper alloy lead frame material.
A preparation and processing method of a high-strength high-conductivity anti-stress relaxation copper alloy lead material comprises the following process flows of: a. the method comprises the following steps of proportioning, feeding, smelting and casting according to mass percent, b, hot rolling, c, rough rolling, d, trimming, e, intermediate annealing, f, acid washing, g, intermediate rolling, h, solution treatment, i, finish rolling, j, aging treatment, k, secondary acid washing, l, stretch bending and straightening, and m, shearing and warehousing.
In the step a, a power frequency induction furnace is adopted to carry out casting in a non-vacuum environment, the smelting temperature is 1250-1300 ℃, and the casting temperature is controlled to be 1200-1250 ℃.
Before smelting, adding electrolytic copper, electrolytic nickel, pure tin, copper-phosphorus intermediate alloy, pure cobalt, copper-iron intermediate alloy and copper-silicon intermediate alloy into an induction furnace, heating to 1250-1300 ℃, adding burnt charcoal to cover after the electrolytic copper is molten, fully stirring, standing for 15min, and carrying out semi-continuous casting at the casting temperature of 1200-1250 ℃.
And in the step b, carrying out hot rolling on the semi-continuous casting ingot, wherein the hot rolling temperature is 850-950 ℃, the heat preservation is carried out for 1-3 h, and the deformation is 80-90%.
And c, rough rolling the ingot blank after hot rolling, wherein the deformation is 60-80%.
And step e, placing the cold-rolled sheet after edge cutting into a bell jar type annealing furnace for intermediate annealing, wherein the annealing temperature is 550-600 ℃, and the annealing time is 4-6 h.
And step g, carrying out medium rolling on the plate after acid washing, wherein the deformation amount is 60-80%.
And h, carrying out solid solution treatment on the plate and strip after the intermediate rolling, wherein the solid solution temperature is 800-850 ℃, and the annealing time is 4-6 h.
In the step i, the pickled strip is subjected to finish rolling, and the deformation is 30-60%, preferably 40-50%.
And step j, placing the finish-rolled strip in a bell jar type annealing furnace for aging treatment, wherein the aging treatment temperature is 400-500 ℃, and the annealing time is 3-8 hours.
The invention has the advantages that: the invention designs and optimizes the components of the copper alloy, and compared with a high-end C7025 lead frame material, the copper alloy lead frame material is a high-strength high-conductivity and stress relaxation-resistant copper alloy lead frame material, and comprises the following chemical components: 3.0-4.0% of nickel, 0.3-0.5% of phosphorus, 0.2-0.4% of silicon, 0.5-1% of iron, 0.05-0.2% of cobalt and the balance of copper. In addition, the invention develops a preparation and processing method suitable for the copper alloy, the tensile strength of the high-strength high-conductivity and stress relaxation resistance copper alloy lead frame material after processing and heat treatment is 700-850 MPa, the conductivity is 40-50% IACS, the elongation is 6-10%, the stress relaxation resistance (working at 120 ℃ for 1000h) is 88-92%, and compared with the high-end lead frame C7025 alloy, the copper alloy has the characteristics of high strength, high conductivity and high stress relaxation resistance, and can completely meet the use requirements of large-scale integrated circuits on the high-end lead frame material.
The present invention is further illustrated by the following specific embodiments, which are not meant to limit the scope of the invention.
Detailed Description
The invention relates to a high-strength high-conductivity stress relaxation-resistant copper alloy lead frame material, which comprises the following chemical components in percentage by weight: 3.0-4.0% of Ni, 0.3-0.5% of P, 0.2-0.4% of Si, 0.03-0.1% of Sn, 0.5-1% of Fe, 0.05-0.2% of Co and the balance of Cu.
The preparation and processing method of the high-strength high-conductivity anti-stress relaxation copper alloy lead frame material comprises the following process flows of: the method comprises the following process flows:
a. proportioning, feeding, smelting and casting according to mass percent, adding electrolytic copper, electrolytic nickel, pure tin, copper-phosphorus intermediate alloy, pure cobalt, copper iron and copper-silicon intermediate alloy into an induction furnace before smelting, raising the temperature to 1250-1300 ℃, adding burnt charcoal to cover after the electrolytic copper is molten, fully stirring, standing for 15min, and carrying out semi-continuous casting;
b. hot rolling, namely hot rolling the semi-continuous cast ingot, wherein the hot rolling temperature is 850-950 ℃, the heat preservation is carried out for 1-3 h, and the deformation is 80-90%;
c. rough rolling, namely performing rough rolling on the ingot blank subjected to hot rolling, wherein the deformation is 60-80%;
d. trimming;
e. intermediate annealing, namely placing the cold-rolled sheet subjected to edge cutting in a bell jar type annealing furnace for intermediate annealing, wherein the annealing temperature is 550-600 ℃, and the annealing time is 4-6 h;
f. acid washing;
g. carrying out medium rolling, namely carrying out medium rolling on the pickled plate, wherein the deformation is 60-80%;
h. performing solution treatment, namely performing solution treatment on the plate and strip after intermediate rolling, wherein the solution temperature is 800-850 ℃, and the annealing time is 4-6 h;
i. finish rolling, wherein the pickled strip is finish rolled, and the deformation is 30-50%;
j. aging treatment, namely placing the finish-rolled strip in bell-type annealing for aging treatment, wherein the temperature of the aging treatment is 400-500 ℃, and the annealing time is 3-8 h;
k. acid washing;
l, stretch bending and straightening;
and m, cutting and warehousing.
Example 1
The alloy of the invention is smelted by adopting the following raw materials: electrolytic copper, electrolytic nickel, pure tin, copper phosphorus master alloy, pure cobalt, copper iron and copper silicon master alloy, the composition of the alloy is shown in table 1, example 1.
1. Smelting: adding electrolytic copper, electrolytic nickel, pure tin, copper-phosphorus intermediate alloy, pure cobalt, copper-iron and copper-silicon intermediate alloy into an induction furnace, heating to 1250 ℃, adding burnt charcoal to cover after the electrolytic copper is melted, fully stirring, standing for 15min, and carrying out semi-continuous casting at the casting temperature of 1250 ℃.
2. Hot rolling: and (3) carrying out hot rolling on the semi-continuous casting ingot, wherein the hot rolling temperature is 900 ℃, the heat preservation time is 2 hours, and the deformation is 85%.
3. Rough rolling: the ingot blank after hot rolling was subjected to rough rolling with a deformation of 80%.
4. Intermediate annealing: and (3) placing the cold-rolled sheet after edge cutting into a bell-jar type annealing furnace for intermediate annealing, wherein the annealing temperature is 600 ℃, and the annealing time is 4 hours.
5. Intermediate rolling: and (4) carrying out medium rolling on the pickled plate, wherein the deformation is 60%.
6. Solution treatment: and (3) carrying out solid solution treatment on the plate and strip after the intermediate rolling, wherein the solid solution temperature is 850 ℃, and the annealing time is 4 h.
7. Finish rolling: the pickled strip was finish-rolled to a strain of 50%.
8. Aging treatment: and placing the finish-rolled strip in a bell-type annealing furnace for aging treatment, wherein the aging treatment temperature is 500 ℃, and the annealing time is 3 hours.
After the above-described processing treatments such as melting and casting, hot rolling, blooming, intermediate annealing, intermediate rolling, solution treatment, finish rolling, aging treatment, etc., the properties thereof are shown in example 1 in table 2.
Example 2
The alloy of the invention is smelted by adopting the following raw materials: electrolytic copper, electrolytic nickel, pure tin, copper phosphorus master alloy, pure cobalt, copper iron and copper silicon master alloy, the composition of the alloy is shown in table 1, example 2.
1. Smelting: adding electrolytic copper, electrolytic nickel, pure tin, copper-phosphorus intermediate alloy, pure cobalt, copper-iron and copper-silicon intermediate alloy into an induction furnace, heating to 1300 ℃, adding burnt charcoal to cover after the electrolytic copper is melted, fully stirring, standing for 15min, and carrying out semi-continuous casting at the casting temperature of 1200 ℃.
2. Hot rolling: and (3) carrying out hot rolling on the semi-continuous casting ingot, wherein the hot rolling temperature is 850 ℃, the heat preservation time is 1h, and the deformation is 80%.
3. Rough rolling: the ingot blank after hot rolling was subjected to rough rolling with a deformation of 60%.
4. Intermediate annealing: and (3) placing the cold-rolled sheet after edge cutting into a bell jar type annealing furnace for intermediate annealing, wherein the annealing temperature is 550 ℃, and the annealing time is 6 hours.
5. Intermediate rolling: and (4) carrying out medium rolling on the pickled plate, wherein the deformation is 80%.
6. Solution treatment: and (3) carrying out solid solution treatment on the plate and strip after the intermediate rolling, wherein the solid solution temperature is 800 ℃, and the annealing time is 6 h.
7. Finish rolling: the pickled strip was finish-rolled to a deformation of 30%.
8. Aging treatment: and placing the finish-rolled strip in a bell-type annealing furnace for aging treatment, wherein the aging treatment temperature is 400 ℃, and the annealing time is 8 hours.
After the above-described processing treatments such as melting and casting, hot rolling, blooming, intermediate annealing, intermediate rolling, solution treatment, finish rolling, aging treatment, etc., the properties thereof are shown in example 2 in table 2.
Example 3
The alloy of the invention is smelted by adopting the following raw materials: electrolytic copper, electrolytic nickel, pure tin, copper phosphorus master alloy, pure cobalt, copper iron and copper silicon master alloy, the composition of the alloy is shown in table 1, example 3.
1. Smelting: adding electrolytic copper, electrolytic nickel, pure tin, copper-phosphorus intermediate alloy, pure cobalt, copper-iron and copper-silicon intermediate alloy into an induction furnace, heating to 1275 ℃, adding burnt charcoal to cover after the electrolytic copper is molten, fully stirring, standing for 15min, and carrying out semi-continuous casting at the casting temperature of 1225 ℃.
2. Hot rolling: and (3) carrying out hot rolling on the semi-continuous casting ingot, wherein the hot rolling temperature is 950 ℃, the heat preservation time is 3 hours, and the deformation is 90%.
3. Rough rolling: the ingot blank after hot rolling was subjected to rough rolling with a deformation of 70%.
4. Intermediate annealing: and (3) placing the cold-rolled sheet after edge cutting into a bell jar type annealing furnace for intermediate annealing, wherein the annealing temperature is 570 ℃, and the annealing time is 5 hours.
5. Intermediate rolling: and (4) carrying out medium rolling on the pickled plate, wherein the deformation is 70%.
6. Solution treatment: and (3) carrying out solid solution treatment on the plate and strip after the intermediate rolling, wherein the solid solution temperature is 825 ℃, and the annealing time is 5 h.
7. Finish rolling: the pickled strip was finish-rolled to a strain of 40%.
8. Aging treatment: and placing the finish-rolled strip in a bell-type annealing furnace for aging treatment, wherein the aging treatment temperature is 450 ℃, and the annealing time is 5 hours.
After the above-described processing treatments such as melting and casting, hot rolling, blooming, intermediate annealing, intermediate rolling, solution treatment, finish rolling, aging treatment, etc., the properties thereof are shown in example 3 in table 2.
TABLE 1 alloy Properties of examples 1-3
Alloy (I) Ni P Si Sn Fe Co Cu
Example 1 3 0.5 0.2 0.03 0.5 0.2 Balance of
Example 2 3.5 0.4 0.3 0.07 0.7 0.14 Balance of
Example 3 4 0.3 0.4 0.1 1 0.05 Balance of
TABLE 2 alloy Properties of examples 1-3
The lead frame material has the tensile strength of 700-850 MPa, the conductivity of 40-50% IACS, the elongation of 6-10% and the stress relaxation resistance (working for 1000 hours at 120 ℃) of 88-92%, and has the characteristics of high strength, high conductivity and high stress relaxation resistance compared with a high-end lead frame C7025 alloy.

Claims (10)

1. The utility model provides a high strength high conductivity, resistant stress relaxation resistant copper alloy lead frame material which characterized in that: the weight percentage composition of it is: 3.7-4.0% of Ni, 0.3-0.5% of P, 0.2-0.4% of Si, 0.03-0.1% of Sn, 0.5-1% of Fe, 0.05-0.2% of Co and the balance of Cu.
2. The high strength, high conductivity, stress relaxation resistant copper alloy lead frame material of claim 1, wherein: the material comprises the following components in percentage by weight: 4.0% of Ni, 0.4-0.5% of P, 0.2-0.3% of Si, 0.05-0.08% of Sn, 0.8-1% of Fe, 0.1-0.15% of Co and the balance of Cu.
3. The method for preparing the high-strength high-conductivity stress relaxation-resistant copper alloy lead frame material according to claim 1 or 2, wherein the method comprises the following steps: the method comprises the following steps: a. the method comprises the following steps of proportioning, feeding, smelting and casting according to mass percent, b, hot rolling, c, rough rolling, d, trimming, e, intermediate annealing, f, acid washing, g, intermediate rolling, h, solution treatment, i, finish rolling, j, aging treatment, k, secondary acid washing, l, stretch bending and straightening, and m, shearing and warehousing.
4. The method for preparing the high-strength high-conductivity stress relaxation resistant copper alloy lead frame material according to claim 3, wherein the method comprises the following steps: and (3) casting by adopting a power frequency induction furnace, wherein the smelting temperature is 1250-1300 ℃, and the casting temperature is 1200-1250 ℃.
5. The method for preparing the high-strength high-conductivity stress relaxation resistant copper alloy lead frame material according to claim 3, wherein the method comprises the following steps: and (3) carrying out hot rolling on the semi-continuous cast ingot, wherein the hot rolling temperature is 850-950 ℃, the heat preservation time is 1-3 h, and the deformation is 80-90%.
6. The method for preparing the high-strength high-conductivity stress relaxation resistant copper alloy lead frame material according to claim 3, wherein the method comprises the following steps: and roughly rolling the ingot blank subjected to hot rolling, wherein the deformation is 60-80%.
7. The method for preparing the high-strength high-conductivity stress relaxation resistant copper alloy lead frame material according to claim 3, wherein the method comprises the following steps: and (3) placing the cold-rolled sheet after edge cutting into a bell-jar annealing furnace for intermediate annealing, wherein the annealing temperature is 550-600 ℃, and the annealing time is 4-6 h.
8. The method for preparing the high-strength high-conductivity stress relaxation resistant copper alloy lead frame material according to claim 3, wherein the method comprises the following steps: and carrying out solid solution treatment on the plate and strip after the intermediate rolling, wherein the solid solution temperature is 800-850 ℃, and the annealing time is 4-6 h.
9. The method for preparing the high-strength high-conductivity stress relaxation resistant copper alloy lead frame material according to claim 3, wherein the method comprises the following steps: the deformation of the medium rolling is 60-80%; the deformation amount of the finish rolling is 30-60%.
10. The method for preparing the high-strength high-conductivity stress relaxation resistant copper alloy lead frame material according to claim 3, wherein the method comprises the following steps: and placing the finish-rolled strip into a bell jar type annealing furnace for aging treatment, wherein the aging treatment temperature is 400-500 ℃, and the annealing time is 3-8 hours.
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CN112170484A (en) * 2020-08-26 2021-01-05 宁波兴业鑫泰新型电子材料有限公司 Preparation method of copper-magnesium alloy strip for automobile relay
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